DE102017211606B4 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number
DE102017211606B4
DE102017211606B4 DE102017211606.4A DE102017211606A DE102017211606B4 DE 102017211606 B4 DE102017211606 B4 DE 102017211606B4 DE 102017211606 A DE102017211606 A DE 102017211606A DE 102017211606 B4 DE102017211606 B4 DE 102017211606B4
Authority
DE
Germany
Prior art keywords
housing
sub
area
electrode
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102017211606.4A
Other languages
German (de)
English (en)
Other versions
DE102017211606A1 (de
Inventor
Yasuo Konishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE102017211606A1 publication Critical patent/DE102017211606A1/de
Application granted granted Critical
Publication of DE102017211606B4 publication Critical patent/DE102017211606B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/755—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent insulating package substrate, interpose or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
DE102017211606.4A 2016-07-15 2017-07-07 Halbleitervorrichtung Active DE102017211606B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-140001 2016-07-15
JP2016140001A JP6598740B2 (ja) 2016-07-15 2016-07-15 半導体装置

Publications (2)

Publication Number Publication Date
DE102017211606A1 DE102017211606A1 (de) 2018-01-18
DE102017211606B4 true DE102017211606B4 (de) 2026-07-09

Family

ID=60783084

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102017211606.4A Active DE102017211606B4 (de) 2016-07-15 2017-07-07 Halbleitervorrichtung

Country Status (4)

Country Link
US (1) US10121719B2 (enExample)
JP (1) JP6598740B2 (enExample)
CN (1) CN107622987B (enExample)
DE (1) DE102017211606B4 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7183551B2 (ja) * 2018-03-15 2022-12-06 富士電機株式会社 半導体装置
DE102019135271A1 (de) * 2019-12-19 2021-06-24 Seg Automotive Germany Gmbh Leistungsmodul, Stromrichter und Kraftfahrzeugkomponente
DE102022133512A1 (de) * 2022-12-15 2024-06-20 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit einem Gehäuse, einer leistungselektronischen Baugruppe und mit einem Formkörper
DE112023005535T5 (de) * 2023-01-11 2025-11-20 Mitsubishi Electric Corporation Leistungsmodul

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349210A (ja) 1999-06-09 2000-12-15 Nippon Inter Electronics Corp 複合半導体装置
DE10058446A1 (de) 1999-11-24 2001-05-31 Denso Corp Halbleitervorrichtung mit Abstrahlungsstruktur, sowie Verfahren zu ihrer Herstellung
DE10102621A1 (de) 2001-01-20 2002-08-01 Conti Temic Microelectronic Leistungsmodul
JP2010045399A (ja) 2009-11-17 2010-02-25 Mitsubishi Electric Corp パワー半導体装置
US20120141818A1 (en) 2010-12-01 2012-06-07 Hitachi, Ltd. Metal-resin composite, method for producing the same, busbar, module case, and resinous connector part
US20160141224A1 (en) 2013-07-22 2016-05-19 Rohm Co., Ltd. Power module and fabrication method for the same
DE102016208029A1 (de) 2015-06-29 2016-12-29 Fuji Electric Co., Ltd. Halbleitervorrichtung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2816239B2 (ja) * 1990-06-15 1998-10-27 株式会社日立製作所 樹脂封止型半導体装置
JP2000113428A (ja) * 1998-10-08 2000-04-21 Tdk Corp 薄膜デバイス、薄膜磁気ヘッドおよび磁気抵抗効果素子並びにそれらの製造方法
JP2002246515A (ja) * 2001-02-20 2002-08-30 Mitsubishi Electric Corp 半導体装置
JP4007143B2 (ja) * 2002-10-09 2007-11-14 日産自動車株式会社 電子部品、電子部品の製造方法及び製造装置
US8477492B2 (en) * 2010-08-19 2013-07-02 Apple Inc. Formed PCB
JP2014187346A (ja) * 2013-02-22 2014-10-02 Tokyo Electron Ltd 焼結銀被覆膜の作製方法及び焼成装置及び半導体装置
JP6057926B2 (ja) * 2014-01-09 2017-01-11 三菱電機株式会社 半導体装置
DE102014114808B4 (de) * 2014-10-13 2018-03-08 Infineon Technologies Ag Elektronikmodul und Verfahren zur Herstellung eines Elektronikmoduls

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349210A (ja) 1999-06-09 2000-12-15 Nippon Inter Electronics Corp 複合半導体装置
DE10058446A1 (de) 1999-11-24 2001-05-31 Denso Corp Halbleitervorrichtung mit Abstrahlungsstruktur, sowie Verfahren zu ihrer Herstellung
DE10102621A1 (de) 2001-01-20 2002-08-01 Conti Temic Microelectronic Leistungsmodul
JP2010045399A (ja) 2009-11-17 2010-02-25 Mitsubishi Electric Corp パワー半導体装置
US20120141818A1 (en) 2010-12-01 2012-06-07 Hitachi, Ltd. Metal-resin composite, method for producing the same, busbar, module case, and resinous connector part
US20160141224A1 (en) 2013-07-22 2016-05-19 Rohm Co., Ltd. Power module and fabrication method for the same
DE102016208029A1 (de) 2015-06-29 2016-12-29 Fuji Electric Co., Ltd. Halbleitervorrichtung

Also Published As

Publication number Publication date
CN107622987B (zh) 2020-04-21
JP6598740B2 (ja) 2019-10-30
CN107622987A (zh) 2018-01-23
US20180019181A1 (en) 2018-01-18
JP2018011005A (ja) 2018-01-18
DE102017211606A1 (de) 2018-01-18
US10121719B2 (en) 2018-11-06

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R016 Response to examination communication
R084 Declaration of willingness to licence
R016 Response to examination communication
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023420000

Ipc: H10W0040700000

R016 Response to examination communication
R018 Grant decision by examination section/examining division