DE102012202928A1 - Lichtquelle mit led-chip und leuchtstoffschicht - Google Patents

Lichtquelle mit led-chip und leuchtstoffschicht Download PDF

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Publication number
DE102012202928A1
DE102012202928A1 DE201210202928 DE102012202928A DE102012202928A1 DE 102012202928 A1 DE102012202928 A1 DE 102012202928A1 DE 201210202928 DE201210202928 DE 201210202928 DE 102012202928 A DE102012202928 A DE 102012202928A DE 102012202928 A1 DE102012202928 A1 DE 102012202928A1
Authority
DE
Germany
Prior art keywords
light
phosphor layer
light source
phosphor
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE201210202928
Other languages
German (de)
English (en)
Inventor
Krister Bergenek
Ralph Wirth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Priority to DE201210202928 priority Critical patent/DE102012202928A1/de
Priority to PCT/EP2013/053197 priority patent/WO2013127652A1/fr
Publication of DE102012202928A1 publication Critical patent/DE102012202928A1/de
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
DE201210202928 2012-02-27 2012-02-27 Lichtquelle mit led-chip und leuchtstoffschicht Withdrawn DE102012202928A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE201210202928 DE102012202928A1 (de) 2012-02-27 2012-02-27 Lichtquelle mit led-chip und leuchtstoffschicht
PCT/EP2013/053197 WO2013127652A1 (fr) 2012-02-27 2013-02-18 Source lumineuse dotée d'une puce led et d'une couche de luminophore

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201210202928 DE102012202928A1 (de) 2012-02-27 2012-02-27 Lichtquelle mit led-chip und leuchtstoffschicht

Publications (1)

Publication Number Publication Date
DE102012202928A1 true DE102012202928A1 (de) 2013-08-29

Family

ID=47748597

Family Applications (1)

Application Number Title Priority Date Filing Date
DE201210202928 Withdrawn DE102012202928A1 (de) 2012-02-27 2012-02-27 Lichtquelle mit led-chip und leuchtstoffschicht

Country Status (2)

Country Link
DE (1) DE102012202928A1 (fr)
WO (1) WO2013127652A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19638667A1 (de) * 1996-09-20 1998-04-02 Siemens Ag Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
WO2007084640A2 (fr) 2006-01-20 2007-07-26 Cree Led Lighting Solutions, Inc. Deplacer un contenu spectral dans des emetteurs de lumiere a semi-conducteurs en separant des films de luminophores dans l'espace
WO2009052329A1 (fr) 2007-10-17 2009-04-23 Intematix Corporation Dispositif électroluminescent à conversion de longueur d'onde de luminophore
WO2010106504A1 (fr) 2009-03-19 2010-09-23 Koninklijke Philips Electronics N.V. Dispositif d'éclairage avec matériau luminescent à distance
WO2010141356A1 (fr) 2009-06-02 2010-12-09 Cree, Inc. Dispositifs d'éclairage dotés de régions individuelles supportant des luminophores sur des surfaces éloignées correspondantes
DE102009033915A1 (de) * 2009-07-20 2011-01-27 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Leuchtmittels und Leuchtmittel
DE102009037186A1 (de) * 2009-08-12 2011-02-17 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauteil

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4292794B2 (ja) * 2002-12-04 2009-07-08 日亜化学工業株式会社 発光装置、発光装置の製造方法および発光装置の色度調整方法
DE102004047727B4 (de) * 2004-09-30 2018-01-18 Osram Opto Semiconductors Gmbh Lumineszenzdiodenchip mit einer Konverterschicht und Verfahren zur Herstellung eines Lumineszenzdiodenchips mit einer Konverterschicht
EP1922765B1 (fr) * 2005-08-24 2012-12-26 Philips Intellectual Property & Standards GmbH Dispositif electroluminescent a element de conversion de lumiere
DE102006024165A1 (de) * 2006-05-23 2007-11-29 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Optoelektronischer Halbleiterchip mit einem Wellenlängenkonversionsstoff sowie optoelektronisches Halbleiterbauelement mit einem solchen Halbleiterchip und Verfahren zur Herstellung des optoelektronischen Halbleiterchips
WO2009016585A2 (fr) * 2007-08-02 2009-02-05 Koninklijke Philips Electronics N.V. Dispositif de conversion de couleur
RU2010143026A (ru) * 2008-03-21 2012-04-27 Конинклейке Филипс Элкектроникс Н.В. (Nl) Светящееся устройство
JP5355030B2 (ja) * 2008-04-24 2013-11-27 シチズンホールディングス株式会社 Ｌｅｄ光源及びｌｅｄ光源の色度調整方法
DE102008022542A1 (de) * 2008-05-07 2009-11-12 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung
TWI411091B (zh) * 2008-10-13 2013-10-01 Walsin Lihwa Corp 發光二極體封裝結構
TWI481069B (zh) * 2008-11-27 2015-04-11 Lextar Electronics Corp 光學薄膜
WO2010134331A1 (fr) * 2009-05-22 2010-11-25 Panasonic Corporation Dispositif phoémetteur à semi-conducteur et source lumineuse l'utilisant

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19638667A1 (de) * 1996-09-20 1998-04-02 Siemens Ag Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
WO2007084640A2 (fr) 2006-01-20 2007-07-26 Cree Led Lighting Solutions, Inc. Deplacer un contenu spectral dans des emetteurs de lumiere a semi-conducteurs en separant des films de luminophores dans l'espace
WO2009052329A1 (fr) 2007-10-17 2009-04-23 Intematix Corporation Dispositif électroluminescent à conversion de longueur d'onde de luminophore
WO2010106504A1 (fr) 2009-03-19 2010-09-23 Koninklijke Philips Electronics N.V. Dispositif d'éclairage avec matériau luminescent à distance
WO2010141356A1 (fr) 2009-06-02 2010-12-09 Cree, Inc. Dispositifs d'éclairage dotés de régions individuelles supportant des luminophores sur des surfaces éloignées correspondantes
DE102009033915A1 (de) * 2009-07-20 2011-01-27 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Leuchtmittels und Leuchtmittel
DE102009037186A1 (de) * 2009-08-12 2011-02-17 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauteil

Also Published As

Publication number Publication date
WO2013127652A1 (fr) 2013-09-06

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R016 Response to examination communication
R081 Change of applicant/patentee

Owner name: OSRAM GMBH, DE

Free format text: FORMER OWNER: OSRAM GMBH, 81543 MUENCHEN, DE

Effective date: 20130827

Owner name: OSRAM GMBH, DE

Free format text: FORMER OWNER: OSRAM AG, 81543 MUENCHEN, DE

Effective date: 20130205

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee