DE102012201917A1 - Nitrid-Halbleitersubstrat und Verfahren zu dessen Herstellung - Google Patents

Nitrid-Halbleitersubstrat und Verfahren zu dessen Herstellung Download PDF

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Publication number
DE102012201917A1
DE102012201917A1 DE102012201917A DE102012201917A DE102012201917A1 DE 102012201917 A1 DE102012201917 A1 DE 102012201917A1 DE 102012201917 A DE102012201917 A DE 102012201917A DE 102012201917 A DE102012201917 A DE 102012201917A DE 102012201917 A1 DE102012201917 A1 DE 102012201917A1
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DE
Germany
Prior art keywords
layer
nitride semiconductor
semiconductor substrate
electron transport
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102012201917A
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German (de)
English (en)
Inventor
Akira Yoshida
Jun Komiyama
Yoshihisa Abe
Hiroshi Oishi
Kenichi Eriguchi
Shunichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coorstek KK
Original Assignee
Covalent Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Covalent Materials Corp filed Critical Covalent Materials Corp
Publication of DE102012201917A1 publication Critical patent/DE102012201917A1/de
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
    • H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having two-dimensional [2D] charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
    • H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
    • H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
    • H10D30/4755—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202—Materials thereof
    • H10P14/3214—Materials thereof being Group IIIA-VA semiconductors
    • H10P14/3216—Nitrides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3242—Structure
    • H10P14/3244—Layer structure
    • H10P14/3251—Layer structure consisting of three or more layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H10P14/3416—Nitrides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN

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  • Junction Field-Effect Transistors (AREA)
DE102012201917A 2011-02-22 2012-02-09 Nitrid-Halbleitersubstrat und Verfahren zu dessen Herstellung Ceased DE102012201917A1 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2011035291 2011-02-22
JP2011-035291 2011-02-22
JP2011099031 2011-04-27
JP2011-099031 2011-04-27
JP2011-117552 2011-05-26
JP2011117552 2011-05-26
JP2011-248155 2011-11-14
JP2011248155A JP5788296B2 (ja) 2011-02-22 2011-11-14 窒化物半導体基板及びその製造方法

Publications (1)

Publication Number Publication Date
DE102012201917A1 true DE102012201917A1 (de) 2012-08-23

Family

ID=46605163

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102012201917A Ceased DE102012201917A1 (de) 2011-02-22 2012-02-09 Nitrid-Halbleitersubstrat und Verfahren zu dessen Herstellung

Country Status (3)

Country Link
US (1) US8785942B2 (https=)
JP (1) JP5788296B2 (https=)
DE (1) DE102012201917A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1023890B1 (de) * 2015-10-14 2017-09-06 Coors Tek Kk Verbindungshalbleitersubstrat

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5787417B2 (ja) * 2013-05-14 2015-09-30 コバレントマテリアル株式会社 窒化物半導体基板
JP2015060987A (ja) * 2013-09-19 2015-03-30 富士通株式会社 半導体装置及び半導体装置の製造方法
JP6287629B2 (ja) * 2014-06-26 2018-03-07 日亜化学工業株式会社 ヘテロ接合電界効果トランジスタ
US9608103B2 (en) 2014-10-02 2017-03-28 Toshiba Corporation High electron mobility transistor with periodically carbon doped gallium nitride
JP6668597B2 (ja) * 2015-03-10 2020-03-18 住友電気工業株式会社 高電子移動度トランジスタ及び高電子移動度トランジスタの製造方法
JP6660631B2 (ja) * 2015-08-10 2020-03-11 ローム株式会社 窒化物半導体デバイス
JP6925117B2 (ja) 2016-11-18 2021-08-25 エア・ウォーター株式会社 化合物半導体基板の製造方法および化合物半導体基板
CN112820773B (zh) * 2019-11-18 2024-05-07 联华电子股份有限公司 一种高电子迁移率晶体管
JP7645743B2 (ja) * 2021-08-16 2025-03-14 株式会社東芝 窒化物半導体、半導体装置及び窒化物半導体の製造方法
TWI830472B (zh) * 2022-08-18 2024-01-21 環球晶圓股份有限公司 發光元件製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001196575A (ja) 2000-01-13 2001-07-19 Matsushita Electric Ind Co Ltd 半導体装置
JP2008010803A (ja) 2006-06-02 2008-01-17 National Institute Of Advanced Industrial & Technology 窒化物半導体電界効果トランジスタ
JP2010123899A (ja) 2008-11-21 2010-06-03 Panasonic Corp 電界効果トランジスタ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4117535B2 (ja) * 2001-11-30 2008-07-16 信越半導体株式会社 化合物半導体素子
US7485512B2 (en) * 2005-06-08 2009-02-03 Cree, Inc. Method of manufacturing an adaptive AIGaN buffer layer
JP5064824B2 (ja) * 2006-02-20 2012-10-31 古河電気工業株式会社 半導体素子
WO2007116517A1 (ja) * 2006-04-10 2007-10-18 Fujitsu Limited 化合物半導体構造とその製造方法
JP5396068B2 (ja) * 2008-11-12 2014-01-22 シャープ株式会社 電界効果型トランジスタ
JP5133927B2 (ja) * 2009-03-26 2013-01-30 コバレントマテリアル株式会社 化合物半導体基板
JP5810518B2 (ja) * 2010-12-03 2015-11-11 富士通株式会社 化合物半導体装置及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001196575A (ja) 2000-01-13 2001-07-19 Matsushita Electric Ind Co Ltd 半導体装置
JP2008010803A (ja) 2006-06-02 2008-01-17 National Institute Of Advanced Industrial & Technology 窒化物半導体電界効果トランジスタ
JP2010123899A (ja) 2008-11-21 2010-06-03 Panasonic Corp 電界効果トランジスタ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1023890B1 (de) * 2015-10-14 2017-09-06 Coors Tek Kk Verbindungshalbleitersubstrat
US10068858B2 (en) 2015-10-14 2018-09-04 Coorstek Kk Compound semiconductor substrate

Also Published As

Publication number Publication date
JP2013008938A (ja) 2013-01-10
JP5788296B2 (ja) 2015-09-30
US8785942B2 (en) 2014-07-22
US20120211763A1 (en) 2012-08-23

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Owner name: COORSTEK KK, JP

Free format text: FORMER OWNER: COVALENT MATERIALS CORP., TOKYO, JP

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Representative=s name: HOFFMANN - EITLE PATENT- UND RECHTSANWAELTE PA, DE

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