DE102012004220A1 - Stabile, konzentrierbare chemisch-mechanische Polierzusammensetzung und damit zusammenhängendes Verfahren - Google Patents

Stabile, konzentrierbare chemisch-mechanische Polierzusammensetzung und damit zusammenhängendes Verfahren Download PDF

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Publication number
DE102012004220A1
DE102012004220A1 DE102012004220A DE102012004220A DE102012004220A1 DE 102012004220 A1 DE102012004220 A1 DE 102012004220A1 DE 102012004220 A DE102012004220 A DE 102012004220A DE 102012004220 A DE102012004220 A DE 102012004220A DE 102012004220 A1 DE102012004220 A1 DE 102012004220A1
Authority
DE
Germany
Prior art keywords
mechanical polishing
chemical mechanical
polishing composition
water
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102012004220A
Other languages
German (de)
English (en)
Inventor
Hamed Lakrout
Jinjie Shi
Joseph Letizia
Xu Li
Francis Kelley
Keith Harris
Christopher Tucker
Thomas Kalantar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Dow Global Technologies LLC
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of DE102012004220A1 publication Critical patent/DE102012004220A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/06—Other polishing compositions
    • C09G1/14—Other polishing compositions based on non-waxy substances
    • C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE102012004220A 2011-03-03 2012-03-01 Stabile, konzentrierbare chemisch-mechanische Polierzusammensetzung und damit zusammenhängendes Verfahren Withdrawn DE102012004220A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/039,723 2011-03-03
US13/039,723 US8435896B2 (en) 2011-03-03 2011-03-03 Stable, concentratable chemical mechanical polishing composition and methods relating thereto

Publications (1)

Publication Number Publication Date
DE102012004220A1 true DE102012004220A1 (de) 2012-09-06

Family

ID=46671508

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102012004220A Withdrawn DE102012004220A1 (de) 2011-03-03 2012-03-01 Stabile, konzentrierbare chemisch-mechanische Polierzusammensetzung und damit zusammenhängendes Verfahren

Country Status (7)

Country Link
US (1) US8435896B2 (https=)
JP (1) JP6118502B2 (https=)
KR (1) KR101829635B1 (https=)
CN (1) CN102702979B (https=)
DE (1) DE102012004220A1 (https=)
FR (1) FR2972196B1 (https=)
TW (1) TWI609072B (https=)

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KR101318102B1 (ko) * 2007-07-05 2013-10-15 히타치가세이가부시끼가이샤 금속막용 연마액 및 연마방법
JP2012146975A (ja) * 2010-12-24 2012-08-02 Hitachi Chem Co Ltd 研磨液及びこの研磨液を用いた基板の研磨方法
JP6198740B2 (ja) * 2012-09-18 2017-09-20 株式会社フジミインコーポレーテッド 研磨用組成物
JP6549927B2 (ja) * 2015-07-24 2019-07-24 株式会社ディスコ ホウ素化合物を添加した切削砥石
JP7209620B2 (ja) * 2017-03-14 2023-01-20 株式会社フジミインコーポレーテッド 研磨用組成物、その製造方法ならびにこれを用いた研磨方法および基板の製造方法
KR102611598B1 (ko) * 2017-04-27 2023-12-08 주식회사 동진쎄미켐 화학-기계적 연마용 슬러리 조성물
US10676646B2 (en) * 2017-05-25 2020-06-09 Fujifilm Electronic Materials U.S.A., Inc. Chemical mechanical polishing slurry for cobalt applications
WO2020091242A1 (ko) * 2018-10-31 2020-05-07 영창케미칼 주식회사 구리 배리어층 연마용 슬러리 조성물
WO2020120641A1 (en) * 2018-12-12 2020-06-18 Basf Se Chemical mechanical polishing of substrates containing copper and ruthenium
CN114686116A (zh) * 2020-12-30 2022-07-01 安集微电子科技（上海）股份有限公司 化学机械抛光液及其使用方法
CN112920716A (zh) * 2021-01-26 2021-06-08 中国科学院上海微系统与信息技术研究所 一种用于氮化钛化学机械抛光的组合物及其使用方法
CN115926629B (zh) * 2022-12-30 2023-12-05 昂士特科技(深圳)有限公司 具有改进再循环性能的化学机械抛光组合物
LU103163B1 (en) * 2023-06-30 2024-12-30 Sampochem Gmbh High-density, sub-zero stable clear liquid composition and the method for producing thereof

Citations (1)

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US7086935B2 (en) 2004-11-24 2006-08-08 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cellulose-containing polishing compositions and methods relating thereto

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DE2531431C3 (de) * 1975-07-14 1979-03-01 Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen Poliermittel zur Herstellung schleierfreier Halbleiteroberflächen
SG99289A1 (en) 1998-10-23 2003-10-27 Ibm Chemical-mechanical planarization of metallurgy
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JP3551238B2 (ja) * 1999-09-07 2004-08-04 三菱住友シリコン株式会社 シリコンウェーハの研磨液及びこれを用いた研磨方法
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US6679928B2 (en) 2001-04-12 2004-01-20 Rodel Holdings, Inc. Polishing composition having a surfactant
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US6821897B2 (en) * 2001-12-05 2004-11-23 Cabot Microelectronics Corporation Method for copper CMP using polymeric complexing agents
US6776810B1 (en) * 2002-02-11 2004-08-17 Cabot Microelectronics Corporation Anionic abrasive particles treated with positively charged polyelectrolytes for CMP
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JP2008091411A (ja) * 2006-09-29 2008-04-17 Fujifilm Corp 金属用研磨液
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US9633865B2 (en) * 2008-02-22 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Low-stain polishing composition
JP4521058B2 (ja) * 2008-03-24 2010-08-11 株式会社Adeka 表面改質コロイダルシリカおよびこれを含有するｃｍｐ用研磨組成物
US8540893B2 (en) 2008-08-04 2013-09-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and methods relating thereto
US8440097B2 (en) * 2011-03-03 2013-05-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7086935B2 (en) 2004-11-24 2006-08-08 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cellulose-containing polishing compositions and methods relating thereto

Also Published As

Publication number Publication date
TW201249973A (en) 2012-12-16
JP2012199532A (ja) 2012-10-18
US20120225555A1 (en) 2012-09-06
CN102702979A (zh) 2012-10-03
FR2972196A1 (fr) 2012-09-07
TWI609072B (zh) 2017-12-21
KR20120101308A (ko) 2012-09-13
FR2972196B1 (fr) 2017-05-19
KR101829635B1 (ko) 2018-03-29
CN102702979B (zh) 2014-12-03
JP6118502B2 (ja) 2017-04-19
US8435896B2 (en) 2013-05-07

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Representative=s name: MUELLER-BORE & PARTNER PATENTANWAELTE PARTG MB, DE

Representative=s name: MUELLER-BORE & PARTNER PATENTANWAELTE, EUROPEA, DE

R005 Application deemed withdrawn due to failure to request examination