DE102011005690B4 - Leistungshalbleitermodul - Google Patents

Leistungshalbleitermodul Download PDF

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Publication number
DE102011005690B4
DE102011005690B4 DE102011005690.4A DE102011005690A DE102011005690B4 DE 102011005690 B4 DE102011005690 B4 DE 102011005690B4 DE 102011005690 A DE102011005690 A DE 102011005690A DE 102011005690 B4 DE102011005690 B4 DE 102011005690B4
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DE
Germany
Prior art keywords
wiring board
semiconductor chip
insulating wiring
heat dissipation
dissipation plate
Prior art date
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Active
Application number
DE102011005690.4A
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German (de)
English (en)
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DE102011005690A1 (de
Inventor
Yasuto KAWAGUCHI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE102011005690A1 publication Critical patent/DE102011005690A1/de
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Publication of DE102011005690B4 publication Critical patent/DE102011005690B4/de
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/141—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being on at least the sidewalls of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE102011005690.4A 2010-04-12 2011-03-17 Leistungshalbleitermodul Active DE102011005690B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010091291A JP5212417B2 (ja) 2010-04-12 2010-04-12 パワー半導体モジュール
JP2010-091291 2010-04-12

Publications (2)

Publication Number Publication Date
DE102011005690A1 DE102011005690A1 (de) 2011-10-13
DE102011005690B4 true DE102011005690B4 (de) 2021-10-28

Family

ID=44658269

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011005690.4A Active DE102011005690B4 (de) 2010-04-12 2011-03-17 Leistungshalbleitermodul

Country Status (4)

Country Link
US (1) US8558361B2 (https=)
JP (1) JP5212417B2 (https=)
CN (1) CN102214622B (https=)
DE (1) DE102011005690B4 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5328827B2 (ja) * 2010-05-28 2013-10-30 三菱電機株式会社 パワーモジュール構造、その構造を有するパワーモジュール、およびその構造の製造方法
WO2013089099A1 (ja) * 2011-12-12 2013-06-20 三菱マテリアル株式会社 パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール、フラックス成分侵入防止層形成用ペーストおよび接合体の接合方法
US8847328B1 (en) * 2013-03-08 2014-09-30 Ixys Corporation Module and assembly with dual DC-links for three-level NPC applications
JP6138277B2 (ja) * 2013-12-17 2017-05-31 三菱電機株式会社 パワー半導体モジュール
US10422681B2 (en) 2014-05-30 2019-09-24 Eltek S.P.A. Sensor for detecting the level of a medium
EP3194909B1 (en) 2014-09-15 2024-11-13 Eltek S.p.A. Sensor for detecting the level of a medium
CN107110690A (zh) * 2014-09-15 2017-08-29 埃尔特克有限公司 用于检测介质的水平的传感器
DE112016007133B4 (de) * 2016-08-10 2021-08-12 Mitsubishi Electric Corporation Halbleitervorrichtung
DE112017004739B4 (de) 2016-09-21 2024-04-18 Mitsubishi Electric Corporation Halbleitereinheit und Leistungswandler
JP6809294B2 (ja) * 2017-03-02 2021-01-06 三菱電機株式会社 パワーモジュール
JP6891075B2 (ja) * 2017-08-30 2021-06-18 株式会社 日立パワーデバイス パワー半導体モジュール
DE112018008233T5 (de) * 2018-12-27 2021-09-16 Mitsubishi Electric Corporation Halbleiteranordnung, verfahren zur herstellung einer halbleiteranordnung und leistungswandler

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4341269A1 (de) 1993-12-03 1995-06-22 Bosch Gmbh Robert Gleichrichterdiode
EP0706221A2 (en) 1994-10-07 1996-04-10 Hitachi, Ltd. Semiconductor device comprising a plurality of semiconductor elements
FR2800017A1 (fr) 1999-10-25 2001-04-27 Valeo Thermique Moteur Sa Dispositif de refroidissement pour un vehicule a moteur electrique alimente par une pile a combustible
US6231919B1 (en) 1998-08-28 2001-05-15 Commscope Properties, Llc Method of making conductor insulated with foamed fluoropolymer
JP2002076190A (ja) 2000-08-24 2002-03-15 Toshiba Corp 回路基板、半導体装置及びこれらの製造方法
DE102007015534A1 (de) 2006-09-28 2008-04-03 Mitsubishi Electric Corp. Leistungshalbleitermodul
DE102007008912B4 (de) 2006-07-04 2009-01-29 Mitsubishi Electric Corp. Halbleitervorrichtung

Family Cites Families (15)

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US4855872A (en) * 1987-08-13 1989-08-08 General Electric Company Leadless ceramic chip carrier printed wiring board adapter
JPH08125071A (ja) 1994-10-25 1996-05-17 Fuji Electric Co Ltd 半導体装置
JPH1187567A (ja) 1997-09-02 1999-03-30 Toshiba Corp 半導体装置
TW408453B (en) * 1997-12-08 2000-10-11 Toshiba Kk Package for semiconductor power device and method for assembling the same
JP3440824B2 (ja) * 1998-05-28 2003-08-25 株式会社日立製作所 半導体装置
JP2004200306A (ja) * 2002-12-17 2004-07-15 Hitachi Ltd 半導体モジュール
JP4253183B2 (ja) 2002-12-27 2009-04-08 三菱電機株式会社 電力用半導体モジュール
JP2005210006A (ja) * 2004-01-26 2005-08-04 Toshiba Corp 半導体装置
JP4319591B2 (ja) * 2004-07-15 2009-08-26 株式会社日立製作所 半導体パワーモジュール
JP2006318980A (ja) * 2005-05-10 2006-11-24 Toyota Industries Corp 半導体装置および半導体装置の製造方法
JP4609296B2 (ja) * 2005-12-05 2011-01-12 株式会社日立製作所 高温半田及び高温半田ペースト材、及びそれを用いたパワー半導体装置
JP4525636B2 (ja) * 2006-06-09 2010-08-18 株式会社日立製作所 パワーモジュール
US8004075B2 (en) 2006-04-25 2011-08-23 Hitachi, Ltd. Semiconductor power module including epoxy resin coating
JP4972503B2 (ja) * 2007-09-11 2012-07-11 株式会社日立製作所 半導体パワーモジュール
JP2009070869A (ja) 2007-09-11 2009-04-02 Panasonic Corp 半導体発光装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4341269A1 (de) 1993-12-03 1995-06-22 Bosch Gmbh Robert Gleichrichterdiode
EP0706221A2 (en) 1994-10-07 1996-04-10 Hitachi, Ltd. Semiconductor device comprising a plurality of semiconductor elements
US6231919B1 (en) 1998-08-28 2001-05-15 Commscope Properties, Llc Method of making conductor insulated with foamed fluoropolymer
FR2800017A1 (fr) 1999-10-25 2001-04-27 Valeo Thermique Moteur Sa Dispositif de refroidissement pour un vehicule a moteur electrique alimente par une pile a combustible
JP2002076190A (ja) 2000-08-24 2002-03-15 Toshiba Corp 回路基板、半導体装置及びこれらの製造方法
DE102007008912B4 (de) 2006-07-04 2009-01-29 Mitsubishi Electric Corp. Halbleitervorrichtung
DE102007015534A1 (de) 2006-09-28 2008-04-03 Mitsubishi Electric Corp. Leistungshalbleitermodul

Also Published As

Publication number Publication date
JP2011222805A (ja) 2011-11-04
CN102214622B (zh) 2013-09-18
DE102011005690A1 (de) 2011-10-13
US20110249407A1 (en) 2011-10-13
CN102214622A (zh) 2011-10-12
US8558361B2 (en) 2013-10-15
JP5212417B2 (ja) 2013-06-19

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