DE102010023815A1 - Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelements - Google Patents
Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelements Download PDFInfo
- Publication number
- DE102010023815A1 DE102010023815A1 DE102010023815A DE102010023815A DE102010023815A1 DE 102010023815 A1 DE102010023815 A1 DE 102010023815A1 DE 102010023815 A DE102010023815 A DE 102010023815A DE 102010023815 A DE102010023815 A DE 102010023815A DE 102010023815 A1 DE102010023815 A1 DE 102010023815A1
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- Germany
- Prior art keywords
- chip carrier
- optoelectronic component
- chip
- semiconductor chip
- cavity
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Led Device Packages (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010023815A DE102010023815A1 (de) | 2010-06-15 | 2010-06-15 | Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelements |
| KR1020137000931A KR101843402B1 (ko) | 2010-06-15 | 2011-05-25 | 표면 장착 가능한 광전자 소자 그리고 표면 장착 가능한 광전자 소자를 제조하기 위한 방법 |
| JP2013514619A JP5819414B2 (ja) | 2010-06-15 | 2011-05-25 | 表面実装可能なオプトエレクトロニクス部品および表面実装可能なオプトエレクトロニクス部品の製造方法 |
| EP11723032.6A EP2583318B1 (de) | 2010-06-15 | 2011-05-25 | Herstellung eines oberflächenmontierbaren optoelektronischen bauelements |
| PCT/EP2011/058583 WO2011157522A1 (de) | 2010-06-15 | 2011-05-25 | Oberflächenmontierbares optoelektronisches bauelement und verfahren zur herstellung eines oberflächenmontierbaren optoelektronischen bauelements |
| CN201180029834.XA CN102939669B (zh) | 2010-06-15 | 2011-05-25 | 可表面安装的光电子器件和用于制造可表面安装的光电子器件的方法 |
| US13/702,000 US9240536B2 (en) | 2010-06-15 | 2011-05-25 | Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component |
| TW100120522A TWI491081B (zh) | 2010-06-15 | 2011-06-13 | 可表面安裝之光電組件及可表面安裝之光電組件之製造方法 |
| US14/958,740 US10020434B2 (en) | 2010-06-15 | 2015-12-03 | Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010023815A DE102010023815A1 (de) | 2010-06-15 | 2010-06-15 | Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102010023815A1 true DE102010023815A1 (de) | 2011-12-15 |
Family
ID=44246372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102010023815A Withdrawn DE102010023815A1 (de) | 2010-06-15 | 2010-06-15 | Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelements |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US9240536B2 (https=) |
| EP (1) | EP2583318B1 (https=) |
| JP (1) | JP5819414B2 (https=) |
| KR (1) | KR101843402B1 (https=) |
| CN (1) | CN102939669B (https=) |
| DE (1) | DE102010023815A1 (https=) |
| TW (1) | TWI491081B (https=) |
| WO (1) | WO2011157522A1 (https=) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011157522A1 (de) | 2010-06-15 | 2011-12-22 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares optoelektronisches bauelement und verfahren zur herstellung eines oberflächenmontierbaren optoelektronischen bauelements |
| DE102012211220A1 (de) * | 2012-06-28 | 2014-01-02 | Osram Opto Semiconductors Gmbh | Elektrisches Bauteil und Verfahren zum Herstellen von elektrischen Bauteilen |
| DE102012109905A1 (de) * | 2012-10-17 | 2014-04-17 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Vielzahl von optoelektronischen Halbleiterbauteilen |
| WO2014170363A1 (de) | 2013-04-19 | 2014-10-23 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement |
| WO2015086665A1 (de) * | 2013-12-11 | 2015-06-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement |
| DE102014103034A1 (de) * | 2014-03-07 | 2015-09-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
| DE102016101942A1 (de) * | 2016-02-04 | 2017-08-10 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung und optoelektronische Leuchtvorrichtung |
| JP2018061054A (ja) * | 2013-01-24 | 2018-04-12 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 複数のオプトエレクトロニクス部品の製造方法 |
| WO2022128281A1 (de) * | 2020-12-16 | 2022-06-23 | Ams-Osram International Gmbh | Bauelement mit strukturiertem leiterrahmen und verfahren zur herstellung eines bauelements |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011114641B4 (de) * | 2011-09-30 | 2021-08-12 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
| JP5991575B2 (ja) * | 2012-05-02 | 2016-09-14 | 大日本印刷株式会社 | 樹脂付リードフレーム、多面付ledパッケージ、樹脂付リードフレームの製造方法およびledパッケージの製造方法 |
| US9335034B2 (en) * | 2013-09-27 | 2016-05-10 | Osram Sylvania Inc | Flexible circuit board for electronic applications, light source containing same, and method of making |
| JP6592902B2 (ja) * | 2014-03-28 | 2019-10-23 | 日亜化学工業株式会社 | 発光装置 |
| DE102017105017A1 (de) | 2017-03-09 | 2018-09-13 | Osram Opto Semiconductors Gmbh | Herstellung von strahlungsemittierenden bauelementen |
| US11562947B2 (en) * | 2020-07-06 | 2023-01-24 | Panjit International Inc. | Semiconductor package having a conductive pad with an anchor flange |
| US11955466B2 (en) | 2020-08-25 | 2024-04-09 | Nichia Corporation | Light emitting device |
| US12002909B2 (en) | 2020-08-25 | 2024-06-04 | Nichia Corporation | Surface-mounted multi-colored light emitting device |
| US12176220B2 (en) | 2020-12-15 | 2024-12-24 | Stmicroelectronics Pte Ltd | Optical sensor package and method of making an optical sensor package |
| DE102021113592A1 (de) | 2021-05-26 | 2022-12-01 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches halbleiterbauteil und paneel |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040140764A1 (en) * | 2003-01-22 | 2004-07-22 | Kaylu Industrial Corporation | Light emitting diode device and method of fabricating the devices |
| US20100001306A1 (en) * | 2008-07-03 | 2010-01-07 | Samsung Electro-Mechanics Co.,Ltd. | Light emitting diode package |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2556821Y2 (ja) | 1991-12-09 | 1997-12-08 | シャープ株式会社 | 発光装置 |
| DE19549818B4 (de) | 1995-09-29 | 2010-03-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiter-Bauelement |
| TW466720B (en) * | 2000-05-22 | 2001-12-01 | Siliconware Precision Industries Co Ltd | Semiconductor package with flash-prevention structure and manufacture method |
| CN1449583A (zh) * | 2000-07-25 | 2003-10-15 | Ssi株式会社 | 塑料封装基底、气腔型封装及其制造方法 |
| US6949771B2 (en) * | 2001-04-25 | 2005-09-27 | Agilent Technologies, Inc. | Light source |
| JP4009097B2 (ja) * | 2001-12-07 | 2007-11-14 | 日立電線株式会社 | 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム |
| CN100338786C (zh) * | 2002-06-19 | 2007-09-19 | 三垦电气株式会社 | 半导体发光装置及其制法和半导体发光装置用反射器 |
| DE10229067B4 (de) | 2002-06-28 | 2007-08-16 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
| US6803607B1 (en) * | 2003-06-13 | 2004-10-12 | Cotco Holdings Limited | Surface mountable light emitting device |
| US6953891B2 (en) * | 2003-09-16 | 2005-10-11 | Micron Technology, Inc. | Moisture-resistant electronic device package and methods of assembly |
| US7183588B2 (en) * | 2004-01-08 | 2007-02-27 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emission device |
| TWI239655B (en) * | 2004-02-23 | 2005-09-11 | Siliconware Precision Industries Co Ltd | Photosensitive semiconductor package with support member and method for fabricating the same |
| KR100631903B1 (ko) | 2005-02-17 | 2006-10-11 | 삼성전기주식회사 | 고출력 led 하우징 및 그 제조 방법 |
| JP4711715B2 (ja) * | 2005-03-30 | 2011-06-29 | 株式会社東芝 | 半導体発光装置及び半導体発光ユニット |
| DE102005041064B4 (de) | 2005-08-30 | 2023-01-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
| US20070069418A1 (en) | 2005-09-28 | 2007-03-29 | Chih-Yuan Liao | In mold manufacturing of an object comprising a functional element |
| TW200718478A (en) | 2005-09-28 | 2007-05-16 | Sipix Imaging Inc | In mold manufacturing of an object comprising a functional element |
| JP2007109887A (ja) | 2005-10-13 | 2007-04-26 | Toshiba Corp | 半導体発光装置 |
| DE102006046678A1 (de) | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zum Herstellen eines Gehäuses für ein optoelektronisches Bauelement |
| KR100998233B1 (ko) * | 2007-12-03 | 2010-12-07 | 서울반도체 주식회사 | 슬림형 led 패키지 |
| DE102008024704A1 (de) | 2008-04-17 | 2009-10-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils |
| JP2010003877A (ja) | 2008-06-20 | 2010-01-07 | Panasonic Corp | リードフレームおよび光半導体パッケージおよび光半導体装置および光半導体パッケージの製造方法 |
| DE102008038748B4 (de) | 2008-08-12 | 2022-08-04 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Oberflächenmontierbares, optoelektronisches Halbleiterbauteil |
| DE102008051928A1 (de) | 2008-10-16 | 2010-04-22 | Osram Opto Semiconductors Gmbh | Elektrischer Anschlussleiter für ein Halbleiterbauelement, Halbleiterbauelement und Verfahren zur Herstellung eines elektrischen Anschlussleiters |
| DE102008053489A1 (de) | 2008-10-28 | 2010-04-29 | Osram Opto Semiconductors Gmbh | Trägerkörper für ein Halbleiterbauelement, Halbleiterbauelement und Verfahren zur Herstellung eines Trägerkörpers |
| DE102010023815A1 (de) | 2010-06-15 | 2011-12-15 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelements |
-
2010
- 2010-06-15 DE DE102010023815A patent/DE102010023815A1/de not_active Withdrawn
-
2011
- 2011-05-25 KR KR1020137000931A patent/KR101843402B1/ko not_active Expired - Fee Related
- 2011-05-25 JP JP2013514619A patent/JP5819414B2/ja not_active Expired - Fee Related
- 2011-05-25 CN CN201180029834.XA patent/CN102939669B/zh not_active Expired - Fee Related
- 2011-05-25 WO PCT/EP2011/058583 patent/WO2011157522A1/de not_active Ceased
- 2011-05-25 EP EP11723032.6A patent/EP2583318B1/de not_active Not-in-force
- 2011-05-25 US US13/702,000 patent/US9240536B2/en not_active Expired - Fee Related
- 2011-06-13 TW TW100120522A patent/TWI491081B/zh not_active IP Right Cessation
-
2015
- 2015-12-03 US US14/958,740 patent/US10020434B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040140764A1 (en) * | 2003-01-22 | 2004-07-22 | Kaylu Industrial Corporation | Light emitting diode device and method of fabricating the devices |
| US20100001306A1 (en) * | 2008-07-03 | 2010-01-07 | Samsung Electro-Mechanics Co.,Ltd. | Light emitting diode package |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011157522A1 (de) | 2010-06-15 | 2011-12-22 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares optoelektronisches bauelement und verfahren zur herstellung eines oberflächenmontierbaren optoelektronischen bauelements |
| DE102012211220A1 (de) * | 2012-06-28 | 2014-01-02 | Osram Opto Semiconductors Gmbh | Elektrisches Bauteil und Verfahren zum Herstellen von elektrischen Bauteilen |
| US9209367B2 (en) | 2012-06-28 | 2015-12-08 | Osram Opto Semiconductors Gmbh | Electrical component and method of producing electrical components |
| KR20150067368A (ko) * | 2012-10-17 | 2015-06-17 | 오스람 옵토 세미컨덕터스 게엠베하 | 다수의 광전자 반도체 소자의 제조 방법 |
| DE102012109905B4 (de) | 2012-10-17 | 2021-11-11 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung einer Vielzahl von optoelektronischen Halbleiterbauteilen |
| WO2014060355A3 (de) * | 2012-10-17 | 2014-06-26 | Osram Opto Semiconductors Gmbh | Verfahren zur herstellung einer vielzahl von optoelektronischen halbleiterbauteilen |
| CN104737307B (zh) * | 2012-10-17 | 2017-11-10 | 欧司朗光电半导体有限公司 | 用于制造多个光电子半导体构件的方法 |
| KR102100253B1 (ko) | 2012-10-17 | 2020-04-13 | 오스람 옵토 세미컨덕터스 게엠베하 | 다수의 광전자 반도체 소자의 제조 방법 |
| CN104737307A (zh) * | 2012-10-17 | 2015-06-24 | 欧司朗光电半导体有限公司 | 用于制造多个光电子半导体构件的方法 |
| JP2015532541A (ja) * | 2012-10-17 | 2015-11-09 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 複数のオプトエレクトロニクス半導体素子を製造するための方法 |
| DE102012109905A1 (de) * | 2012-10-17 | 2014-04-17 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Vielzahl von optoelektronischen Halbleiterbauteilen |
| US9318357B2 (en) | 2012-10-17 | 2016-04-19 | Osram Opto Semiconductors Gmbh | Method for producing a multiplicity of optoelectronic semiconductor components |
| JP2018061054A (ja) * | 2013-01-24 | 2018-04-12 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 複数のオプトエレクトロニクス部品の製造方法 |
| DE102013207111A1 (de) | 2013-04-19 | 2014-11-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| US9780273B2 (en) | 2013-04-19 | 2017-10-03 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
| WO2014170363A1 (de) | 2013-04-19 | 2014-10-23 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement |
| US9620694B2 (en) | 2013-12-11 | 2017-04-11 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
| WO2015086665A1 (de) * | 2013-12-11 | 2015-06-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement |
| DE102014103034A1 (de) * | 2014-03-07 | 2015-09-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
| DE102016101942A1 (de) * | 2016-02-04 | 2017-08-10 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung und optoelektronische Leuchtvorrichtung |
| US10931081B2 (en) | 2016-02-04 | 2021-02-23 | Osram Oled Gmbh | Method of producing an optoelectronic lighting device and optoelectronic lighting device |
| DE102016101942B4 (de) | 2016-02-04 | 2022-07-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung |
| WO2022128281A1 (de) * | 2020-12-16 | 2022-06-23 | Ams-Osram International Gmbh | Bauelement mit strukturiertem leiterrahmen und verfahren zur herstellung eines bauelements |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5819414B2 (ja) | 2015-11-24 |
| CN102939669B (zh) | 2016-08-03 |
| CN102939669A (zh) | 2013-02-20 |
| TW201208152A (en) | 2012-02-16 |
| EP2583318B1 (de) | 2017-11-01 |
| US9240536B2 (en) | 2016-01-19 |
| US20160087182A1 (en) | 2016-03-24 |
| US10020434B2 (en) | 2018-07-10 |
| JP2013534719A (ja) | 2013-09-05 |
| TWI491081B (zh) | 2015-07-01 |
| KR20130058721A (ko) | 2013-06-04 |
| US20130126935A1 (en) | 2013-05-23 |
| WO2011157522A1 (de) | 2011-12-22 |
| KR101843402B1 (ko) | 2018-03-29 |
| EP2583318A1 (de) | 2013-04-24 |
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