DE102009051188A1 - Lichtsignalgeber und Lichtempfänger für einen optischen Sensor - Google Patents
Lichtsignalgeber und Lichtempfänger für einen optischen Sensor Download PDFInfo
- Publication number
- DE102009051188A1 DE102009051188A1 DE200910051188 DE102009051188A DE102009051188A1 DE 102009051188 A1 DE102009051188 A1 DE 102009051188A1 DE 200910051188 DE200910051188 DE 200910051188 DE 102009051188 A DE102009051188 A DE 102009051188A DE 102009051188 A1 DE102009051188 A1 DE 102009051188A1
- Authority
- DE
- Germany
- Prior art keywords
- light
- semiconductor
- circuit board
- printed circuit
- signal transmitter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 32
- 239000004065 semiconductor Substances 0.000 claims abstract description 41
- 230000004888 barrier function Effects 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
- G01V8/10—Detecting, e.g. by using light barriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
Landscapes
- General Physics & Mathematics (AREA)
- Geophysics (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Optical Couplings Of Light Guides (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Semiconductor Lasers (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200910051188 DE102009051188A1 (de) | 2009-10-29 | 2009-10-29 | Lichtsignalgeber und Lichtempfänger für einen optischen Sensor |
| EP10775774A EP2494384A2 (de) | 2009-10-29 | 2010-10-28 | Lichtsignalgeber und lichtempfänger für einen optischen sensor |
| US13/504,987 US8851733B2 (en) | 2009-10-29 | 2010-10-28 | Light signal transmitter and light receiver for an optical sensor |
| KR1020127010615A KR20120101357A (ko) | 2009-10-29 | 2010-10-28 | 광학 센서를 위한 광 신호 송신기 및 광 수신기 |
| JP2012535820A JP2013509699A (ja) | 2009-10-29 | 2010-10-28 | 光学的センサのための光発信器および光受信器 |
| PCT/EP2010/066318 WO2011051370A2 (de) | 2009-10-29 | 2010-10-28 | Lichtsignalgeber und lichtempfänger für einen optischen sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200910051188 DE102009051188A1 (de) | 2009-10-29 | 2009-10-29 | Lichtsignalgeber und Lichtempfänger für einen optischen Sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102009051188A1 true DE102009051188A1 (de) | 2011-05-19 |
Family
ID=43797830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE200910051188 Ceased DE102009051188A1 (de) | 2009-10-29 | 2009-10-29 | Lichtsignalgeber und Lichtempfänger für einen optischen Sensor |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8851733B2 (https=) |
| EP (1) | EP2494384A2 (https=) |
| JP (1) | JP2013509699A (https=) |
| KR (1) | KR20120101357A (https=) |
| DE (1) | DE102009051188A1 (https=) |
| WO (1) | WO2011051370A2 (https=) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8851733B2 (en) | 2009-10-29 | 2014-10-07 | Siemens Aktiengesellschaft | Light signal transmitter and light receiver for an optical sensor |
| DE102016107153A1 (de) * | 2016-04-18 | 2017-10-19 | Sick Ag | Optoelektronischer Sensor |
| DE202016106394U1 (de) | 2016-11-15 | 2018-02-16 | Sick Ag | Mehrstrahllichtschranke |
| DE102016121913A1 (de) | 2016-11-15 | 2018-05-17 | Sick Ag | Mehrstrahllichtschranke |
| DE102019118978A1 (de) * | 2019-07-12 | 2021-01-14 | OSRAM CONTINENTAL GmbH | Optische Anordnung und Fahrzeug |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI511005B (zh) * | 2013-12-20 | 2015-12-01 | Qisda Corp | 顯示裝置及其紅外線觸控模組 |
| CN106547033B (zh) * | 2016-09-28 | 2018-08-07 | 西北工业大学 | 一种可移动的微纳偏振光栅阵列装置及其使用方法 |
| CN112216656B (zh) * | 2020-09-02 | 2021-07-06 | 珠海越亚半导体股份有限公司 | 一种具有定向光电传输通道的空腔基板及其制造方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5675143A (en) * | 1994-12-22 | 1997-10-07 | Optosys Ag | Proximity switch |
| DE19858247C1 (de) * | 1998-12-17 | 2000-01-27 | Leuze Electronic Gmbh & Co | Optoelektronische Vorrichtung zum Erfassen von Gegenständen in einem Überwachungsbereich |
| DE10308085A1 (de) * | 2002-03-08 | 2003-10-02 | Leuze Electronic Gmbh & Co | Optoelektronische Vorrichtung |
| US20040109627A1 (en) * | 2002-12-05 | 2004-06-10 | Young-Woo Kim | Multi-layer PCB and method for coupling block type multichannel optical signals |
| US20040136099A1 (en) * | 2002-12-27 | 2004-07-15 | Young-Woo Kim | Printed circuit board assembly with multi-channel block-type optical devices packaged therein |
| US20060250813A1 (en) * | 2005-05-03 | 2006-11-09 | Raymond Lippmann | Illuminated display system |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4407967C2 (de) | 1994-03-10 | 1997-11-20 | Leuze Electronic Gmbh & Co | Elektronische Vorrichtung |
| JPH09318853A (ja) * | 1996-03-29 | 1997-12-12 | Sony Corp | 光送受信装置および光通信ネットワーク |
| JPH10256648A (ja) * | 1997-03-13 | 1998-09-25 | Hitachi Ltd | レーザダイオード・モジュール |
| DE19947889C2 (de) * | 1999-10-05 | 2003-03-06 | Infineon Technologies Ag | Optoelektronisches, bidirektionales Sende- und Empfangsmodul in Leadframe-Technik |
| AT5153U1 (de) * | 2001-03-22 | 2002-03-25 | Avl List Gmbh | Optischer sensor zur erfassung von verbrennungsvorgängen |
| JP2004061799A (ja) * | 2002-07-29 | 2004-02-26 | Canon Inc | 二次元光導波装置、およびそれを用いた光電融合配線基板 |
| KR100451635B1 (ko) * | 2002-12-10 | 2004-10-08 | 삼성전기주식회사 | 섬유 블록과 파이프 블록, 및 이를 이용하여 다층인쇄회로기판의 층간 광신호를 연결하는 방법 |
| KR100528972B1 (ko) * | 2003-10-27 | 2005-11-16 | 한국전자통신연구원 | 테이퍼진 광도파로가 내장된 광 인쇄회로기판 시스템 |
| DE102004028814A1 (de) * | 2004-06-15 | 2006-01-05 | Siemens Ag | Leiterplatte und Verfahren zum Herstellen einer Leiterplatte |
| US7228020B2 (en) * | 2004-08-31 | 2007-06-05 | Finisar Corporation | Optoelectronic arrangement having a surface-mountable semiconductor module and a cooling element |
| AT503027B1 (de) * | 2006-05-08 | 2007-07-15 | Austria Tech & System Tech | Leiterplattenelement mit optoelektronischem bauelement und licht-wellenleiter |
| AT503585B1 (de) * | 2006-05-08 | 2007-11-15 | Austria Tech & System Tech | Leiterplattenelement sowie verfahren zu dessen herstellung |
| JP2008084396A (ja) * | 2006-09-27 | 2008-04-10 | Matsushita Electric Ind Co Ltd | 半導体装置および半導体装置の製造方法、光ピックアップ装置および光ディスクドライブ装置 |
| PL2082167T3 (pl) * | 2006-10-16 | 2017-08-31 | Philips Lighting Holding B.V. | Urządzenie oświetlające diodą emitującą światło |
| CN101529156B (zh) * | 2006-10-16 | 2012-03-21 | 皇家飞利浦电子股份有限公司 | 照明设备 |
| AT505834B1 (de) * | 2007-09-21 | 2009-09-15 | Austria Tech & System Tech | Leiterplattenelement |
| US7541058B2 (en) * | 2007-10-09 | 2009-06-02 | Endicott Interconnect Technologies, Inc. | Method of making circuitized substrate with internal optical pathway |
| DE102009051188A1 (de) | 2009-10-29 | 2011-05-19 | Siemens Aktiengesellschaft | Lichtsignalgeber und Lichtempfänger für einen optischen Sensor |
-
2009
- 2009-10-29 DE DE200910051188 patent/DE102009051188A1/de not_active Ceased
-
2010
- 2010-10-28 EP EP10775774A patent/EP2494384A2/de not_active Withdrawn
- 2010-10-28 JP JP2012535820A patent/JP2013509699A/ja active Pending
- 2010-10-28 WO PCT/EP2010/066318 patent/WO2011051370A2/de not_active Ceased
- 2010-10-28 US US13/504,987 patent/US8851733B2/en not_active Expired - Fee Related
- 2010-10-28 KR KR1020127010615A patent/KR20120101357A/ko not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5675143A (en) * | 1994-12-22 | 1997-10-07 | Optosys Ag | Proximity switch |
| DE19858247C1 (de) * | 1998-12-17 | 2000-01-27 | Leuze Electronic Gmbh & Co | Optoelektronische Vorrichtung zum Erfassen von Gegenständen in einem Überwachungsbereich |
| DE10308085A1 (de) * | 2002-03-08 | 2003-10-02 | Leuze Electronic Gmbh & Co | Optoelektronische Vorrichtung |
| US20040109627A1 (en) * | 2002-12-05 | 2004-06-10 | Young-Woo Kim | Multi-layer PCB and method for coupling block type multichannel optical signals |
| US20040136099A1 (en) * | 2002-12-27 | 2004-07-15 | Young-Woo Kim | Printed circuit board assembly with multi-channel block-type optical devices packaged therein |
| US20060250813A1 (en) * | 2005-05-03 | 2006-11-09 | Raymond Lippmann | Illuminated display system |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8851733B2 (en) | 2009-10-29 | 2014-10-07 | Siemens Aktiengesellschaft | Light signal transmitter and light receiver for an optical sensor |
| DE102016107153A1 (de) * | 2016-04-18 | 2017-10-19 | Sick Ag | Optoelektronischer Sensor |
| DE102016107153B4 (de) | 2016-04-18 | 2018-10-18 | Sick Ag | Optoelektronischer Sensor |
| DE202016106394U1 (de) | 2016-11-15 | 2018-02-16 | Sick Ag | Mehrstrahllichtschranke |
| DE102016121913A1 (de) | 2016-11-15 | 2018-05-17 | Sick Ag | Mehrstrahllichtschranke |
| DE102019118978A1 (de) * | 2019-07-12 | 2021-01-14 | OSRAM CONTINENTAL GmbH | Optische Anordnung und Fahrzeug |
| DE102019118978B4 (de) * | 2019-07-12 | 2025-09-18 | OSRAM CONTINENTAL GmbH | Optische Anordnung und Fahrzeug |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013509699A (ja) | 2013-03-14 |
| EP2494384A2 (de) | 2012-09-05 |
| WO2011051370A3 (de) | 2012-04-19 |
| WO2011051370A2 (de) | 2011-05-05 |
| KR20120101357A (ko) | 2012-09-13 |
| US8851733B2 (en) | 2014-10-07 |
| US20120218766A1 (en) | 2012-08-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R002 | Refusal decision in examination/registration proceedings | ||
| OP8 | Request for examination as to paragraph 44 patent law | ||
| R003 | Refusal decision now final |
Effective date: 20110329 |