DE102009015878A1 - Verfahren zum materialabtragenden Bearbeiten von flachen Werkstücken - Google Patents

Verfahren zum materialabtragenden Bearbeiten von flachen Werkstücken Download PDF

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Publication number
DE102009015878A1
DE102009015878A1 DE102009015878A DE102009015878A DE102009015878A1 DE 102009015878 A1 DE102009015878 A1 DE 102009015878A1 DE 102009015878 A DE102009015878 A DE 102009015878A DE 102009015878 A DE102009015878 A DE 102009015878A DE 102009015878 A1 DE102009015878 A1 DE 102009015878A1
Authority
DE
Germany
Prior art keywords
workpieces
carrier
work
working
free surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102009015878A
Other languages
German (de)
English (en)
Inventor
Frank Dipl.-Ing. Runkel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lapmaster Wolters GmbH
Original Assignee
Peter Wolters GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Peter Wolters GmbH filed Critical Peter Wolters GmbH
Priority to DE102009015878A priority Critical patent/DE102009015878A1/de
Priority to JP2012502511A priority patent/JP5639147B2/ja
Priority to PCT/EP2010/002090 priority patent/WO2010112225A1/de
Priority to SG2011065844A priority patent/SG174365A1/en
Priority to KR1020117023576A priority patent/KR101760355B1/ko
Priority to CN2010800147754A priority patent/CN102378668A/zh
Priority to US13/262,596 priority patent/US20120052771A1/en
Priority to EP10712902.5A priority patent/EP2414133B1/de
Publication of DE102009015878A1 publication Critical patent/DE102009015878A1/de
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE102009015878A 2009-04-01 2009-04-01 Verfahren zum materialabtragenden Bearbeiten von flachen Werkstücken Ceased DE102009015878A1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE102009015878A DE102009015878A1 (de) 2009-04-01 2009-04-01 Verfahren zum materialabtragenden Bearbeiten von flachen Werkstücken
JP2012502511A JP5639147B2 (ja) 2009-04-01 2010-04-01 両面研削機における極薄被加工物の材料除去機械加工方法
PCT/EP2010/002090 WO2010112225A1 (de) 2009-04-01 2010-04-01 Verfahren zum materialabtragenden bearbeiten von sehr dünnen werkstücken in einer doppelseitenschleifmaschine
SG2011065844A SG174365A1 (en) 2009-04-01 2010-04-01 Method for the material-removing machining of very thin work pieces in a double side grinding machine
KR1020117023576A KR101760355B1 (ko) 2009-04-01 2010-04-01 양면 연삭 기계에서 매우 얇은 작업물을 재료 제거 가공하기 위한 방법
CN2010800147754A CN102378668A (zh) 2009-04-01 2010-04-01 用于在双面磨床中去除材料地加工非常薄的工件的方法
US13/262,596 US20120052771A1 (en) 2009-04-01 2010-04-01 Method For the Material-Removing Machining of Very Thin Work Pieces in a Double Sided Grinding Machine
EP10712902.5A EP2414133B1 (de) 2009-04-01 2010-04-01 Verfahren zum materialabtragenden bearbeiten von sehr dünnen werkstücken in einer doppelseitenschleifmaschine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009015878A DE102009015878A1 (de) 2009-04-01 2009-04-01 Verfahren zum materialabtragenden Bearbeiten von flachen Werkstücken

Publications (1)

Publication Number Publication Date
DE102009015878A1 true DE102009015878A1 (de) 2010-10-07

Family

ID=42269533

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102009015878A Ceased DE102009015878A1 (de) 2009-04-01 2009-04-01 Verfahren zum materialabtragenden Bearbeiten von flachen Werkstücken

Country Status (8)

Country Link
US (1) US20120052771A1 (https=)
EP (1) EP2414133B1 (https=)
JP (1) JP5639147B2 (https=)
KR (1) KR101760355B1 (https=)
CN (1) CN102378668A (https=)
DE (1) DE102009015878A1 (https=)
SG (1) SG174365A1 (https=)
WO (1) WO2010112225A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014106100A1 (de) * 2014-04-30 2015-11-05 Ev Group E. Thallner Gmbh Verfahren und Vorrichtung zum Vergleichmäßigen eines Substratstapels
WO2026027120A1 (de) * 2024-07-29 2026-02-05 Lapmaster Wolters Gmbh Verfahren, werkstückträger und system zum bearbeiten von werkstücken in einer doppelseiten-bearbeitungsmaschine

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103158054B (zh) * 2011-12-19 2016-02-03 张卫兴 两种在双面研抛机上实现的单面抛光方法
US9427841B2 (en) * 2013-03-15 2016-08-30 Ii-Vi Incorporated Double-sided polishing of hard substrate materials
JP6371310B2 (ja) * 2013-11-29 2018-08-08 Hoya株式会社 研削又は研磨処理用キャリア、研削又は研磨処理用キャリアの製造方法、及び磁気ディスク用基板の製造方法
CN106625065A (zh) * 2017-01-17 2017-05-10 宜兴市科兴合金材料有限公司 一种能够回收碎屑的钼圆片打磨装置
CN108188931A (zh) * 2017-12-22 2018-06-22 华侨大学 双面行星磨削/研磨加工中工件破碎的在线控制系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0788146A1 (en) * 1996-01-31 1997-08-06 Shin-Etsu Handotai Company Limited Method of polishing semiconductor wafers
DE102007056627A1 (de) * 2007-03-19 2008-09-25 Siltronic Ag Verfahren zum gleichzeitigen Schleifen mehrerer Halbleiterscheiben
WO2008125543A2 (en) * 2007-04-17 2008-10-23 Interuniversitair Microelektronica Centrum (Imec) Method for reducing the thickness of substrates

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JPS5894964A (ja) * 1981-11-27 1983-06-06 Toshiba Corp 研摩装置
JPS62264864A (ja) * 1986-05-10 1987-11-17 Sony Corp 基体の研摩方法
JPS6362673A (ja) * 1986-09-01 1988-03-18 Speedfam Co Ltd 定寸機構付き平面研磨装置
DE3929484A1 (de) * 1989-09-05 1991-03-14 Wacker Chemitronic Verfahren zum zweiseitigen chemomechanischen polieren von halbleiterscheiben, sowie vorrichtung zu seiner durchfuehrung und dadurch erhaeltliche halbleiterscheiben
DE4131752A1 (de) * 1991-09-24 1993-03-25 Wolters Peter Fa Verfahren zum einseitigen flaechenbearbeiten von werkstuecken
US5538460A (en) 1992-01-16 1996-07-23 System Seiko Co., Ltd. Apparatus for grinding hard disk substrates
JPH07227756A (ja) * 1994-02-21 1995-08-29 Speedfam Co Ltd ワークの研磨方法及び装置
JP3327175B2 (ja) * 1997-07-18 2002-09-24 株式会社ニコン 検知部及びこの検知部を具えたウェハ研磨装置
US5975998A (en) * 1997-09-26 1999-11-02 Memc Electronic Materials , Inc. Wafer processing apparatus
US6080042A (en) * 1997-10-31 2000-06-27 Virginia Semiconductor, Inc. Flatness and throughput of single side polishing of wafers
JPH11189500A (ja) * 1997-12-26 1999-07-13 Toshiba Corp 酸化物単結晶基板の製造方法
JP2000317815A (ja) * 1998-06-26 2000-11-21 Yoshiaki Nagaura 圧電素子およびその加工方法
WO2001082354A1 (en) * 2000-04-24 2001-11-01 Sumitomo Mitsubishi Silicon Corporation Method of manufacturing semiconductor wafer
JP2001347447A (ja) * 2000-06-08 2001-12-18 Fujikoshi Mach Corp テープ研磨装置
DE102004063870A1 (de) * 2004-12-30 2006-07-13 Supfina Grieshaber Gmbh & Co.Kg Werkstückdickenmessung mit Ultra- oder Megaschall
JP2007281067A (ja) * 2006-04-04 2007-10-25 Nitto Denko Corp 半導体装置の製造方法、及びそれに用いる半導体ウェハ加工用の粘着シート
JP2008004648A (ja) * 2006-06-21 2008-01-10 Matsushita Electric Ind Co Ltd 研磨装置及び研磨方法
DE102006032455A1 (de) * 2006-07-13 2008-04-10 Siltronic Ag Verfahren zum gleichzeitigen beidseitigen Schleifen mehrerer Halbleiterscheiben sowie Halbleierscheibe mit hervorragender Ebenheit
ITBO20070504A1 (it) * 2007-07-20 2009-01-21 Marposs Spa Apparecchiatura e metodo per il controllo dello spessore di un elemento in lavorazione

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0788146A1 (en) * 1996-01-31 1997-08-06 Shin-Etsu Handotai Company Limited Method of polishing semiconductor wafers
DE102007056627A1 (de) * 2007-03-19 2008-09-25 Siltronic Ag Verfahren zum gleichzeitigen Schleifen mehrerer Halbleiterscheiben
WO2008125543A2 (en) * 2007-04-17 2008-10-23 Interuniversitair Microelektronica Centrum (Imec) Method for reducing the thickness of substrates

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
C. Landesberger et al.: Carrier Techniques for Thin Wafer Processing, CS Mantech Conference, May 14-17, 2007, Austin, Texas, USA

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014106100A1 (de) * 2014-04-30 2015-11-05 Ev Group E. Thallner Gmbh Verfahren und Vorrichtung zum Vergleichmäßigen eines Substratstapels
US9984942B2 (en) 2014-04-30 2018-05-29 Ev Group E. Thallner Gmbh Method and device for leveling a substrate stack
WO2026027120A1 (de) * 2024-07-29 2026-02-05 Lapmaster Wolters Gmbh Verfahren, werkstückträger und system zum bearbeiten von werkstücken in einer doppelseiten-bearbeitungsmaschine

Also Published As

Publication number Publication date
KR101760355B1 (ko) 2017-07-21
WO2010112225A1 (de) 2010-10-07
JP5639147B2 (ja) 2014-12-10
EP2414133B1 (de) 2016-11-23
JP2012522649A (ja) 2012-09-27
US20120052771A1 (en) 2012-03-01
CN102378668A (zh) 2012-03-14
SG174365A1 (en) 2011-10-28
KR20110135401A (ko) 2011-12-16
EP2414133A1 (de) 2012-02-08

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
R081 Change of applicant/patentee

Owner name: LAPMASTER WOLTERS GMBH, DE

Free format text: FORMER OWNER: PETER WOLTERS GMBH, 24768 RENDSBURG, DE

R082 Change of representative

Representative=s name: HAUCK PATENTANWALTSPARTNERSCHAFT MBB, DE

R081 Change of applicant/patentee

Owner name: LAPMASTER WOLTERS GMBH, DE

Free format text: FORMER OWNER: PETER WOLTERS GMBH, 24768 RENDSBURG, DE

Effective date: 20150522

R082 Change of representative

Representative=s name: HAUCK PATENTANWALTSPARTNERSCHAFT MBB, DE

Effective date: 20150522

R012 Request for examination validly filed
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final