DE102008062933B4 - Optoelektronische Projektionsvorrichtung - Google Patents

Optoelektronische Projektionsvorrichtung Download PDF

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Publication number
DE102008062933B4
DE102008062933B4 DE102008062933.2A DE102008062933A DE102008062933B4 DE 102008062933 B4 DE102008062933 B4 DE 102008062933B4 DE 102008062933 A DE102008062933 A DE 102008062933A DE 102008062933 B4 DE102008062933 B4 DE 102008062933B4
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DE
Germany
Prior art keywords
contact layer
semiconductor body
projection device
exit side
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102008062933.2A
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German (de)
English (en)
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DE102008062933A1 (de
Inventor
Dr. Malm Norwin von
Dr. Streubel Klaus
Patrick Rode
Dr. Engl Karl
Dr. Höppel Lutz
Dr. Moosburger Jürgen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE102008062933.2A priority Critical patent/DE102008062933B4/de
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to PCT/DE2009/001694 priority patent/WO2010072191A1/de
Priority to EP09801388.1A priority patent/EP2368269B1/de
Priority to KR1020117017130A priority patent/KR101601348B1/ko
Priority to US13/127,328 priority patent/US8716724B2/en
Priority to CN200980152067.4A priority patent/CN102265399B/zh
Priority to JP2011541081A priority patent/JP5657563B2/ja
Publication of DE102008062933A1 publication Critical patent/DE102008062933A1/de
Application granted granted Critical
Publication of DE102008062933B4 publication Critical patent/DE102008062933B4/de
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers

Landscapes

  • Projection Apparatus (AREA)
  • Led Device Packages (AREA)
DE102008062933.2A 2008-12-23 2008-12-23 Optoelektronische Projektionsvorrichtung Active DE102008062933B4 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE102008062933.2A DE102008062933B4 (de) 2008-12-23 2008-12-23 Optoelektronische Projektionsvorrichtung
EP09801388.1A EP2368269B1 (de) 2008-12-23 2009-11-27 Optoelektronische projektionsvorrichtung
KR1020117017130A KR101601348B1 (ko) 2008-12-23 2009-11-27 광전 영사 장치
US13/127,328 US8716724B2 (en) 2008-12-23 2009-11-27 Optoelectronic projection device
PCT/DE2009/001694 WO2010072191A1 (de) 2008-12-23 2009-11-27 Optoelektronische projektionsvorrichtung
CN200980152067.4A CN102265399B (zh) 2008-12-23 2009-11-27 光电子投影装置
JP2011541081A JP5657563B2 (ja) 2008-12-23 2009-11-27 オプトエレクトロニクス投影装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008062933.2A DE102008062933B4 (de) 2008-12-23 2008-12-23 Optoelektronische Projektionsvorrichtung

Publications (2)

Publication Number Publication Date
DE102008062933A1 DE102008062933A1 (de) 2010-07-01
DE102008062933B4 true DE102008062933B4 (de) 2021-05-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008062933.2A Active DE102008062933B4 (de) 2008-12-23 2008-12-23 Optoelektronische Projektionsvorrichtung

Country Status (7)

Country Link
US (1) US8716724B2 (https=)
EP (1) EP2368269B1 (https=)
JP (1) JP5657563B2 (https=)
KR (1) KR101601348B1 (https=)
CN (1) CN102265399B (https=)
DE (1) DE102008062933B4 (https=)
WO (1) WO2010072191A1 (https=)

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JP2010517274A (ja) 2007-01-22 2010-05-20 クリー レッド ライティング ソリューションズ、インコーポレイテッド 外部で相互接続された発光素子のアレイを用いる照明デバイスとその製造方法
DE102010025320B4 (de) * 2010-06-28 2021-11-11 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
TWI557934B (zh) * 2010-09-06 2016-11-11 晶元光電股份有限公司 半導體光電元件
DE102011003684B4 (de) * 2011-02-07 2026-01-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
US9362455B2 (en) * 2011-02-24 2016-06-07 Cree, Inc. Semiconductor light emitting diodes having multiple bond pads and current spreading structures
US8492182B2 (en) 2011-04-29 2013-07-23 Osram Opto Semiconductors Gmbh Method for the producing of a light-emitting semiconductor chip, method for the production of a conversion die and light-emitting semiconductor chip
US12002915B2 (en) 2011-06-24 2024-06-04 Creeled, Inc. Multi-segment monolithic LED chip
US11251348B2 (en) 2011-06-24 2022-02-15 Creeled, Inc. Multi-segment monolithic LED chip
US9653643B2 (en) 2012-04-09 2017-05-16 Cree, Inc. Wafer level packaging of light emitting diodes (LEDs)
KR101868537B1 (ko) 2011-11-07 2018-06-19 엘지이노텍 주식회사 발광소자 및 이를 포함하는 발광 소자 패키지
DE102011056888A1 (de) * 2011-12-22 2013-06-27 Osram Opto Semiconductors Gmbh Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung
DE102012101892B4 (de) 2012-03-06 2021-05-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Wellenlängenkonversionselement, Licht emittierendes Halbleiterbauelement und Anzeigevorrichtung damit sowie Verfahren zur Herstellung eines Wellenlängenkonversionselements
DE102012105176B4 (de) 2012-06-14 2021-08-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip
US11160148B2 (en) 2017-06-13 2021-10-26 Ideal Industries Lighting Llc Adaptive area lamp
US11792898B2 (en) 2012-07-01 2023-10-17 Ideal Industries Lighting Llc Enhanced fixtures for area lighting
US8816383B2 (en) * 2012-07-06 2014-08-26 Invensas Corporation High performance light emitting diode with vias
DE102012112302B4 (de) * 2012-12-14 2026-03-26 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung
DE102012112530A1 (de) * 2012-12-18 2014-06-18 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen von optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip
DE102013102667A1 (de) * 2013-03-15 2014-10-02 Osram Opto Semiconductors Gmbh Anzeigevorrichtung
KR102098110B1 (ko) * 2013-04-11 2020-04-08 엘지이노텍 주식회사 발광소자, 발광소자 패키지 및 라이트 유닛
DE102013104046A1 (de) * 2013-04-22 2014-10-23 Osram Opto Semiconductors Gmbh Optische Anordnung und Anzeigegerät
KR102098135B1 (ko) * 2013-07-12 2020-04-08 엘지이노텍 주식회사 발광소자
DE102013111918B4 (de) 2013-10-29 2020-01-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
WO2015063077A1 (en) 2013-10-29 2015-05-07 Osram Opto Semiconductors Gmbh Wavelength conversion element, method of making, and light-emitting semiconductor component having same
DE102013112881A1 (de) * 2013-11-21 2015-05-21 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip
DE102014100542A1 (de) 2014-01-20 2015-07-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer lateral strukturierten Schicht und optoelektronisches Halbleiterbauteil mit einer solchen Schicht
DE102014102029A1 (de) * 2014-02-18 2015-08-20 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von Halbleiterbauelementen und Halbleiterbauelement
JP6425921B2 (ja) 2014-06-12 2018-11-21 株式会社ジャパンディスプレイ 画像表示装置
DE102014108373A1 (de) * 2014-06-13 2015-12-17 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip
KR102212666B1 (ko) * 2014-06-27 2021-02-05 엘지이노텍 주식회사 발광소자
TWI625868B (zh) 2014-07-03 2018-06-01 晶元光電股份有限公司 光電元件及其製造方法
DE102015103055A1 (de) 2014-12-04 2016-06-09 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
JP6156402B2 (ja) * 2015-02-13 2017-07-05 日亜化学工業株式会社 発光装置
DE102015122627A1 (de) * 2015-05-28 2016-12-01 Osram Opto Semiconductors Gmbh Optoelektronische Anordnung und Tiefenerfassungssystem
KR102480220B1 (ko) 2016-04-08 2022-12-26 삼성전자주식회사 발광 다이오드 모듈 및 이를 구비한 디스플레이 패널
US10529696B2 (en) 2016-04-12 2020-01-07 Cree, Inc. High density pixelated LED and devices and methods thereof
CN106131519A (zh) * 2016-06-15 2016-11-16 联想(北京)有限公司 一种信息处理方法及电子设备
DE102016116986B4 (de) * 2016-09-09 2025-07-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Bauelement zur Darstellung eines Piktogramms und Verfahren zur Herstellung eines Bauelements
DE102016221481B4 (de) * 2016-11-02 2021-09-16 Siemens Healthcare Gmbh Strahlungsdetektor mit einer Zwischenschicht
DE102016123013A1 (de) * 2016-11-29 2018-05-30 Osram Opto Semiconductors Gmbh Anzeigevorrichtung mit einer Mehrzahl getrennt voneinander betreibbarer Bildpunkte
DE102017102247A1 (de) 2017-02-06 2018-08-09 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Herstellungsverfahren hierfür
WO2019028314A1 (en) 2017-08-03 2019-02-07 Cree, Inc. HIGH DENSITY PIXELIZED LED CHIPS AND NETWORK DEVICES AND METHODS OF MANUFACTURE
US10734363B2 (en) 2017-08-03 2020-08-04 Cree, Inc. High density pixelated-LED chips and chip array devices
US10529773B2 (en) 2018-02-14 2020-01-07 Cree, Inc. Solid state lighting devices with opposing emission directions
US10903265B2 (en) 2018-12-21 2021-01-26 Cree, Inc. Pixelated-LED chips and chip array devices, and fabrication methods
US11817526B2 (en) 2019-10-29 2023-11-14 Creeled, Inc. Texturing for high density pixelated-LED chips and chip array devices
US11437548B2 (en) 2020-10-23 2022-09-06 Creeled, Inc. Pixelated-LED chips with inter-pixel underfill materials, and fabrication methods

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US20050122487A1 (en) * 2003-12-04 2005-06-09 Sharp Kabushiki Kaisha Projector optical system configuration, optical module, and projector, and also electronic equipment, vehicle, projection system, and showcase utilizing such projector
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US20050122487A1 (en) * 2003-12-04 2005-06-09 Sharp Kabushiki Kaisha Projector optical system configuration, optical module, and projector, and also electronic equipment, vehicle, projection system, and showcase utilizing such projector
DE102007022947A1 (de) * 2007-04-26 2008-10-30 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen

Also Published As

Publication number Publication date
EP2368269B1 (de) 2016-03-16
JP5657563B2 (ja) 2015-01-21
EP2368269A1 (de) 2011-09-28
JP2012513667A (ja) 2012-06-14
US8716724B2 (en) 2014-05-06
US20110241031A1 (en) 2011-10-06
KR101601348B1 (ko) 2016-03-08
CN102265399B (zh) 2014-05-28
KR20110099753A (ko) 2011-09-08
WO2010072191A1 (de) 2010-07-01
CN102265399A (zh) 2011-11-30
DE102008062933A1 (de) 2010-07-01

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Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8181 Inventor (new situation)

Inventor name: MALM, NORWIN VON, DR., 93152 NITTENDORF, DE

Inventor name: STREUBEL, KLAUS, DR., 93164 LAABER, DE

Inventor name: RODE, PATRICK, 93051 REGENSBURG, DE

Inventor name: ENGL, KARL, DR., 93080 PENTLING, DE

Inventor name: HOEPPEL, LUTZ, DR., 93087 ALTEGLOFSHEIM, DE

Inventor name: MOOSBURGER, JUERGEN, DR., 93055 REGENSBURG, DE

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R018 Grant decision by examination section/examining division
R020 Patent grant now final
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0027150000

Ipc: H10H0029140000