DE102008016011A1 - Korrektur optischer Elemente mittels flach eingestrahltem Korrekturlicht - Google Patents

Korrektur optischer Elemente mittels flach eingestrahltem Korrekturlicht Download PDF

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Publication number
DE102008016011A1
DE102008016011A1 DE102008016011A DE102008016011A DE102008016011A1 DE 102008016011 A1 DE102008016011 A1 DE 102008016011A1 DE 102008016011 A DE102008016011 A DE 102008016011A DE 102008016011 A DE102008016011 A DE 102008016011A DE 102008016011 A1 DE102008016011 A1 DE 102008016011A1
Authority
DE
Germany
Prior art keywords
correction light
optical
arrangement
mirror
optical element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102008016011A
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German (de)
English (en)
Inventor
Sascha Bleidistel
Manfred Dr. Maul
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Zeiss SMT GmbH
Original Assignee
Carl Zeiss SMT GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss SMT GmbH filed Critical Carl Zeiss SMT GmbH
Publication of DE102008016011A1 publication Critical patent/DE102008016011A1/de
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0025—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration
    • G02B27/0068—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration having means for controlling the degree of correction, e.g. using phase modulators, movable elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/028—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
    • G02F1/293—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection by another light beam, i.e. opto-optical deflection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Nonlinear Science (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Lenses (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE102008016011A 2007-03-27 2008-03-26 Korrektur optischer Elemente mittels flach eingestrahltem Korrekturlicht Withdrawn DE102008016011A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007014699 2007-03-27
DE102007014699.1 2007-03-27

Publications (1)

Publication Number Publication Date
DE102008016011A1 true DE102008016011A1 (de) 2008-10-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008016011A Withdrawn DE102008016011A1 (de) 2007-03-27 2008-03-26 Korrektur optischer Elemente mittels flach eingestrahltem Korrekturlicht

Country Status (5)

Country Link
US (4) US8760744B2 (https=)
JP (1) JP5329520B2 (https=)
KR (1) KR101492287B1 (https=)
DE (1) DE102008016011A1 (https=)
WO (1) WO2008116886A1 (https=)

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* Cited by examiner, † Cited by third party
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WO2010131774A1 (en) * 2009-05-15 2010-11-18 Nikon Corporation Optical apparatus, exposure apparatus, exposure method, and method for producing device
DE102011088740A1 (de) * 2011-12-15 2013-01-17 Carl Zeiss Smt Gmbh Optisches System, sowie Verfahren zum Manipulieren des thermischen Zustandes eines optischen Elementes in einer mikrolithographischen Projektionsbelichtungsanlage
DE102016213025A1 (de) 2016-07-18 2016-09-08 Carl Zeiss Smt Gmbh Steuerung für Mikrospiegelanordnungen in Lithographiesystemen
DE102022212570A1 (de) 2022-11-24 2023-12-14 Carl Zeiss Smt Gmbh Heizvorrichtung und optisches System, insbesondere EUV-Lithographiesystem

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JP5329520B2 (ja) 2007-03-27 2013-10-30 カール・ツァイス・エスエムティー・ゲーエムベーハー 低角度で入射する補正光を用いる補正光学素子
DE102010041298A1 (de) 2010-09-24 2012-03-29 Carl Zeiss Smt Gmbh EUV-Mikrolithographie-Projektionsbelichtungsanlage mit einer Heizlichtquelle
DE102012216284A1 (de) * 2011-09-27 2013-03-28 Carl Zeiss Smt Gmbh Mikrolithographische Projektionsbelichtungsanlage
DE102014203189A1 (de) * 2014-02-21 2015-08-27 Carl Zeiss Smt Gmbh Spiegel-Array
CN107810448B (zh) 2015-07-02 2020-03-24 应用材料公司 使用时间偏移曝光的非均匀图案校正
JP6827785B2 (ja) 2016-11-30 2021-02-10 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
US11079564B2 (en) * 2017-07-20 2021-08-03 Cymer, Llc Methods and apparatuses for aligning and diagnosing a laser beam
DE102021102254A1 (de) * 2021-02-01 2022-08-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische anordnung
DE102021201689A1 (de) * 2021-02-23 2022-08-25 Carl Zeiss Smt Gmbh Optische Baugruppe, Verfahren zur Deformation eines optischen Elements und Projektionsbelichtungsanlage

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010131774A1 (en) * 2009-05-15 2010-11-18 Nikon Corporation Optical apparatus, exposure apparatus, exposure method, and method for producing device
DE102011088740A1 (de) * 2011-12-15 2013-01-17 Carl Zeiss Smt Gmbh Optisches System, sowie Verfahren zum Manipulieren des thermischen Zustandes eines optischen Elementes in einer mikrolithographischen Projektionsbelichtungsanlage
DE102016213025A1 (de) 2016-07-18 2016-09-08 Carl Zeiss Smt Gmbh Steuerung für Mikrospiegelanordnungen in Lithographiesystemen
DE102022212570A1 (de) 2022-11-24 2023-12-14 Carl Zeiss Smt Gmbh Heizvorrichtung und optisches System, insbesondere EUV-Lithographiesystem

Also Published As

Publication number Publication date
KR101492287B1 (ko) 2015-02-11
US8760744B2 (en) 2014-06-24
US10054786B2 (en) 2018-08-21
US20160259161A1 (en) 2016-09-08
US8811568B2 (en) 2014-08-19
US20140078567A1 (en) 2014-03-20
US9366857B2 (en) 2016-06-14
WO2008116886A1 (de) 2008-10-02
JP5329520B2 (ja) 2013-10-30
JP2010522977A (ja) 2010-07-08
US20100060988A1 (en) 2010-03-11
KR20100015913A (ko) 2010-02-12
US20150062682A1 (en) 2015-03-05

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