DE102007031562B4 - Gehäuse mit einem elektrischen Modul - Google Patents

Gehäuse mit einem elektrischen Modul Download PDF

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Publication number
DE102007031562B4
DE102007031562B4 DE102007031562.9A DE102007031562A DE102007031562B4 DE 102007031562 B4 DE102007031562 B4 DE 102007031562B4 DE 102007031562 A DE102007031562 A DE 102007031562A DE 102007031562 B4 DE102007031562 B4 DE 102007031562B4
Authority
DE
Germany
Prior art keywords
contact means
module
electrical component
connection
outer housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102007031562.9A
Other languages
German (de)
English (en)
Other versions
DE102007031562A1 (de
Inventor
Juergen Kurle
Ingbert Gerngross
Frieder Haag
Christian Ohl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE102007031562.9A priority Critical patent/DE102007031562B4/de
Priority to ITMI2008A001215A priority patent/IT1390818B1/it
Priority to US12/217,301 priority patent/US7791891B2/en
Priority to FR0854468A priority patent/FR2918503B1/fr
Priority to JP2008174456A priority patent/JP2009016841A/ja
Publication of DE102007031562A1 publication Critical patent/DE102007031562A1/de
Application granted granted Critical
Publication of DE102007031562B4 publication Critical patent/DE102007031562B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0078—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
  • Casings For Electric Apparatus (AREA)
DE102007031562.9A 2007-07-06 2007-07-06 Gehäuse mit einem elektrischen Modul Active DE102007031562B4 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE102007031562.9A DE102007031562B4 (de) 2007-07-06 2007-07-06 Gehäuse mit einem elektrischen Modul
ITMI2008A001215A IT1390818B1 (it) 2007-07-06 2008-07-01 Contenitore con un modulo elettrico
US12/217,301 US7791891B2 (en) 2007-07-06 2008-07-02 Enclosure including an electrical module
FR0854468A FR2918503B1 (fr) 2007-07-06 2008-07-02 Boitier comportant un module electrique
JP2008174456A JP2009016841A (ja) 2007-07-06 2008-07-03 電気モジュールを備えたハウジング

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007031562.9A DE102007031562B4 (de) 2007-07-06 2007-07-06 Gehäuse mit einem elektrischen Modul

Publications (2)

Publication Number Publication Date
DE102007031562A1 DE102007031562A1 (de) 2009-01-08
DE102007031562B4 true DE102007031562B4 (de) 2024-01-18

Family

ID=40092510

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102007031562.9A Active DE102007031562B4 (de) 2007-07-06 2007-07-06 Gehäuse mit einem elektrischen Modul

Country Status (5)

Country Link
US (1) US7791891B2 (https=)
JP (1) JP2009016841A (https=)
DE (1) DE102007031562B4 (https=)
FR (1) FR2918503B1 (https=)
IT (1) IT1390818B1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010039063B4 (de) 2010-08-09 2024-01-18 Robert Bosch Gmbh Sensormodul mit einem elektromagnetisch abgeschirmten elektrischen Bauteil und Verfahren zur Herstellung eines solchen Sensormoduls
DE102011081016A1 (de) * 2011-08-16 2013-02-21 Robert Bosch Gmbh Sensormodul und Verfahren zur Herstellung eines Sensormoduls
DE102013226236A1 (de) * 2013-12-17 2015-06-18 Robert Bosch Gmbh Elektrische Baugruppe
US10804913B1 (en) 2018-09-10 2020-10-13 Inphi Corporation Clock and data recovery devices with fractional-N PLL

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5747876A (en) 1995-11-30 1998-05-05 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and semiconductor module
US5948991A (en) 1996-12-09 1999-09-07 Denso Corporation Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip
DE10201710A1 (de) 2001-01-18 2002-07-25 Fuji Electric Co Ltd Halbleitersensor für eine physikalische Größe
DE10213648A1 (de) 2002-03-27 2003-10-23 Semikron Elektronik Gmbh Leistungshalbleitermodul

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0278298A (ja) * 1988-09-14 1990-03-19 Hitachi Ltd 電子装置
JPH07288332A (ja) * 1994-02-25 1995-10-31 Fujitsu Ltd 光素子組立体とその製造方法
JP3452835B2 (ja) * 1999-05-28 2003-10-06 三菱電機株式会社 圧力センサ装置
DE10052406A1 (de) * 2000-10-20 2002-05-23 Bosch Gmbh Robert Drucksensormodul
DE10054013B4 (de) * 2000-11-01 2007-06-21 Robert Bosch Gmbh Drucksensormodul
DE10065013B4 (de) * 2000-12-23 2009-12-24 Robert Bosch Gmbh Verfahren zum Herstellen eines mikromechanischen Bauelements

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5747876A (en) 1995-11-30 1998-05-05 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and semiconductor module
US5948991A (en) 1996-12-09 1999-09-07 Denso Corporation Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip
DE10201710A1 (de) 2001-01-18 2002-07-25 Fuji Electric Co Ltd Halbleitersensor für eine physikalische Größe
DE10213648A1 (de) 2002-03-27 2003-10-23 Semikron Elektronik Gmbh Leistungshalbleitermodul

Also Published As

Publication number Publication date
FR2918503B1 (fr) 2013-04-05
IT1390818B1 (it) 2011-10-19
ITMI20081215A1 (it) 2009-01-07
JP2009016841A (ja) 2009-01-22
US7791891B2 (en) 2010-09-07
US20090027861A1 (en) 2009-01-29
FR2918503A1 (fr) 2009-01-09
DE102007031562A1 (de) 2009-01-08

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