DE102006061636A1 - Bleifreies Lötmittel, Lötmittelverbindungs-Produkt und elektronische Komponente - Google Patents

Bleifreies Lötmittel, Lötmittelverbindungs-Produkt und elektronische Komponente Download PDF

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Publication number
DE102006061636A1
DE102006061636A1 DE102006061636A DE102006061636A DE102006061636A1 DE 102006061636 A1 DE102006061636 A1 DE 102006061636A1 DE 102006061636 A DE102006061636 A DE 102006061636A DE 102006061636 A DE102006061636 A DE 102006061636A DE 102006061636 A1 DE102006061636 A1 DE 102006061636A1
Authority
DE
Germany
Prior art keywords
lead
weight
solder
tin
free solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102006061636A
Other languages
German (de)
English (en)
Inventor
Long Thantrong
Yuuji Hisazato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE102006061636A1 publication Critical patent/DE102006061636A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE102006061636A 2005-12-27 2006-12-27 Bleifreies Lötmittel, Lötmittelverbindungs-Produkt und elektronische Komponente Withdrawn DE102006061636A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-375621 2005-12-27
JP2005375621 2005-12-27

Publications (1)

Publication Number Publication Date
DE102006061636A1 true DE102006061636A1 (de) 2007-08-09

Family

ID=38282343

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102006061636A Withdrawn DE102006061636A1 (de) 2005-12-27 2006-12-27 Bleifreies Lötmittel, Lötmittelverbindungs-Produkt und elektronische Komponente

Country Status (5)

Country Link
US (1) US20070178007A1 (zh)
JP (1) JP2007196289A (zh)
KR (1) KR100829465B1 (zh)
CN (1) CN101209516B (zh)
DE (1) DE102006061636A1 (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2179815A4 (en) * 2007-08-24 2010-09-08 Toshiba Kk BINDING COMPOSITION
WO2009051181A1 (ja) * 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. 無鉛はんだ合金
GB2455486A (en) * 2008-03-05 2009-06-17 Quantum Chem Tech Singapore A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy
JP5253857B2 (ja) * 2008-03-27 2013-07-31 株式会社東芝 摺動材料、摺動材料の製造方法およびそれを用いた軸受装置
EP2422918B1 (en) * 2009-04-20 2017-12-06 Panasonic Intellectual Property Management Co., Ltd. Soldering material and electronic component assembly
JP5189669B2 (ja) * 2011-05-24 2013-04-24 田中貴金属工業株式会社 活性金属ろう材
US9050651B2 (en) * 2011-06-14 2015-06-09 Ingot Metal Company Limited Method for producing lead-free copper—bismuth alloys and ingots useful for same
CN102717203B (zh) * 2012-07-04 2015-07-22 深圳市亿铖达工业有限公司 具有高延展性的低银无铅锡膏焊料
CN102717201B (zh) * 2012-07-04 2015-04-22 深圳市斯特纳新材料有限公司 具有耐腐蚀的高强度高温焊料
KR20150035671A (ko) * 2012-08-08 2015-04-07 센주긴조쿠고교 가부시키가이샤 고온 납프리 땜납 합금
WO2014034863A1 (ja) * 2012-08-31 2014-03-06 千住金属工業株式会社 導電性密着材料
EP2979807B1 (en) 2014-06-24 2018-04-11 Harima Chemicals, Inc. Solder alloy, solder composition, solder paste and electronic circuit board
KR101639614B1 (ko) * 2014-08-29 2016-07-15 한국기계연구원 다종 나노/마이크로 솔더 및 이의 제조방법
CN108213764A (zh) * 2017-12-13 2018-06-29 华南理工大学 一种可有效减小母材溶解量的锡基无铅钎料合金
CN108044255B (zh) * 2018-01-17 2020-04-28 中山翰华锡业有限公司 一种用于智能焊接的锡线
CN114807677B (zh) * 2021-05-19 2023-08-08 苏州优诺电子材料科技有限公司 一种锡合金及其制备方法
TWI778648B (zh) * 2021-06-04 2022-09-21 岱暉股份有限公司 焊料合金
CN113579557B (zh) * 2021-08-12 2024-05-28 北京康普锡威科技有限公司 SnBi系材料合金及其制备方法和用途

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4806309A (en) * 1988-01-05 1989-02-21 Willard Industries, Inc. Tin base lead-free solder composition containing bismuth, silver and antimony
US5066459A (en) * 1990-05-18 1991-11-19 General Electric Company Advanced high-temperature brazing alloys
EP0612578A1 (en) * 1993-02-22 1994-08-31 AT&T Corp. An Article comprising a pb-free solder having improved mechanical properties
DE19526822C2 (de) * 1995-07-15 1998-07-02 Euromat Gmbh Lotlegierung, Verwendung der Lotlegierung und Verfahren zum Verbinden von Werkstücken durch Löten
US6047876A (en) * 1997-09-12 2000-04-11 Materials Resources International Process of using an active solder alloy
US20040151616A1 (en) * 2003-02-04 2004-08-05 Sabarese Daniel M. Lead-free alloys, composition thereof, methods of preparation and uses for soldering and babbitting

Also Published As

Publication number Publication date
KR100829465B1 (ko) 2008-05-19
CN101209516B (zh) 2010-10-13
KR20070069069A (ko) 2007-07-02
US20070178007A1 (en) 2007-08-02
JP2007196289A (ja) 2007-08-09
CN101209516A (zh) 2008-07-02

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R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee