DE102005038254A1 - Schaltungsmodulsystem und -Verfahren - Google Patents
Schaltungsmodulsystem und -Verfahren Download PDFInfo
- Publication number
- DE102005038254A1 DE102005038254A1 DE102005038254A DE102005038254A DE102005038254A1 DE 102005038254 A1 DE102005038254 A1 DE 102005038254A1 DE 102005038254 A DE102005038254 A DE 102005038254A DE 102005038254 A DE102005038254 A DE 102005038254A DE 102005038254 A1 DE102005038254 A1 DE 102005038254A1
- Authority
- DE
- Germany
- Prior art keywords
- circuit
- substrate
- csps
- flex circuit
- circuit module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims description 24
- 239000000758 substrate Substances 0.000 claims abstract description 317
- 239000004020 conductor Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 15
- 238000003780 insertion Methods 0.000 claims abstract description 10
- 230000037431 insertion Effects 0.000 claims abstract description 10
- 238000002507 cathodic stripping potentiometry Methods 0.000 claims description 177
- 230000002093 peripheral effect Effects 0.000 claims description 23
- 238000003491 array Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 239000000872 buffer Substances 0.000 claims description 12
- 238000004891 communication Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 5
- 238000000605 extraction Methods 0.000 claims 1
- 230000001737 promoting effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 71
- 230000008901 benefit Effects 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 230000006870 function Effects 0.000 description 8
- 238000005452 bending Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 238000010276 construction Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 101100018369 Arabidopsis thaliana ICR3 gene Proteins 0.000 description 4
- 101100018370 Arabidopsis thaliana ICR4 gene Proteins 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 239000003575 carbonaceous material Substances 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000009740 moulding (composite fabrication) Methods 0.000 description 2
- 229920000729 poly(L-lysine) polymer Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000012549 training Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 238000003855 Adhesive Lamination Methods 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 210000002105 tongue Anatomy 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/056—Folded around rigid support or component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Applications Claiming Priority (18)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/934,027 | 2004-09-03 | ||
| US10/934,027 US20060050492A1 (en) | 2004-09-03 | 2004-09-03 | Thin module system and method |
| US11/005,992 US7480152B2 (en) | 2004-09-03 | 2004-12-07 | Thin module system and method |
| US11/005,992 | 2004-12-07 | ||
| US11/007,551 | 2004-12-08 | ||
| US11/007,551 US7511968B2 (en) | 2004-09-03 | 2004-12-08 | Buffered thin module system and method |
| US11/058,979 | 2005-02-16 | ||
| US11/058,979 US7468893B2 (en) | 2004-09-03 | 2005-02-16 | Thin module system and method |
| US11/068,688 | 2005-03-01 | ||
| US11/068,688 US7324352B2 (en) | 2004-09-03 | 2005-03-01 | High capacity thin module system and method |
| US11/123,721 | 2005-05-06 | ||
| US11/123,721 US20060053345A1 (en) | 2004-09-03 | 2005-05-06 | Thin module system and method |
| US11/125,018 US7606049B2 (en) | 2004-09-03 | 2005-05-09 | Module thermal management system and method |
| US11/125,018 | 2005-05-09 | ||
| US11/173,450 | 2005-07-01 | ||
| US11/173,450 US20060049512A1 (en) | 2004-09-03 | 2005-07-01 | Thin module system and method with skew reduction |
| US11/193,954 US20060049513A1 (en) | 2004-09-03 | 2005-07-29 | Thin module system and method with thermal management |
| US11/193,954 | 2005-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102005038254A1 true DE102005038254A1 (de) | 2006-03-23 |
Family
ID=35098242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102005038254A Withdrawn DE102005038254A1 (de) | 2004-09-03 | 2005-08-12 | Schaltungsmodulsystem und -Verfahren |
Country Status (8)
| Country | Link |
|---|---|
| JP (1) | JP2006074031A (ja) |
| KR (1) | KR100880054B1 (ja) |
| AU (1) | AU2005203591A1 (ja) |
| CA (1) | CA2515714A1 (ja) |
| DE (1) | DE102005038254A1 (ja) |
| FR (1) | FR2878118A1 (ja) |
| GB (3) | GB2417836B (ja) |
| WO (1) | WO2006028643A2 (ja) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100837276B1 (ko) | 2006-12-20 | 2008-06-11 | 삼성전자주식회사 | 인쇄 회로 기판 및 이를 사용하는 반도체 메모리 모듈 |
| US7715200B2 (en) | 2007-09-28 | 2010-05-11 | Samsung Electronics Co., Ltd. | Stacked semiconductor module, method of fabricating the same, and electronic system using the same |
| JP2011035345A (ja) | 2009-08-06 | 2011-02-17 | Fujitsu Ltd | 半導体素子モジュール、電子回路ユニット、電子デバイス、及び、半導体素子モジュールの製造方法 |
| JP2011090441A (ja) * | 2009-10-21 | 2011-05-06 | Elpida Memory Inc | メモリモジュール |
| US8536697B2 (en) | 2011-11-30 | 2013-09-17 | Freescale Semiconductor, Inc. | Packaged die for heat dissipation and method therefor |
| US9159647B2 (en) | 2012-01-27 | 2015-10-13 | Novachips Canada Inc. | Method and apparatus for connecting memory dies to form a memory system |
| US9516755B2 (en) * | 2012-12-28 | 2016-12-06 | Intel Corporation | Multi-channel memory module |
| DE102016115665B3 (de) | 2016-08-24 | 2018-01-18 | Harting Electric Gmbh & Co. Kg | Steckverbinder |
| US10679722B2 (en) | 2016-08-26 | 2020-06-09 | Sandisk Technologies Llc | Storage system with several integrated components and method for use therewith |
| JP6597810B2 (ja) * | 2018-02-02 | 2019-10-30 | 日本電気株式会社 | 実装構造、構造部品、実装構造の製造方法 |
| US20190314083A1 (en) | 2018-04-11 | 2019-10-17 | Biosense Webster (Israel) Ltd. | Flexible Multi-Arm Catheter with Diametrically Opposed Sensing Electrodes |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57193094A (en) * | 1981-05-18 | 1982-11-27 | Matsushita Electric Ind Co Ltd | Electronic circuit part and method of mounting same |
| FR2538989B1 (fr) * | 1982-12-30 | 1985-10-04 | Thomson Csf | Structure d'assemblage de circuits electroniques complexes, et procede d'amelioration de la fiabilite d'un tel assemblage |
| US5252857A (en) * | 1991-08-05 | 1993-10-12 | International Business Machines Corporation | Stacked DCA memory chips |
| US5731633A (en) * | 1992-09-16 | 1998-03-24 | Gary W. Hamilton | Thin multichip module |
| JPH113955A (ja) * | 1997-06-12 | 1999-01-06 | Shinko Electric Ind Co Ltd | 半導体チップ搭載ボード |
| US5963427A (en) * | 1997-12-11 | 1999-10-05 | Sun Microsystems, Inc. | Multi-chip module with flexible circuit board |
| US6219243B1 (en) * | 1999-12-14 | 2001-04-17 | Intel Corporation | Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units |
| US6444921B1 (en) * | 2000-02-03 | 2002-09-03 | Fujitsu Limited | Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like |
| US6449159B1 (en) * | 2000-05-03 | 2002-09-10 | Rambus Inc. | Semiconductor module with imbedded heat spreader |
| JP2002151648A (ja) * | 2000-11-07 | 2002-05-24 | Mitsubishi Electric Corp | 半導体モジュール |
| JP2002237568A (ja) * | 2000-12-28 | 2002-08-23 | Texas Instr Inc <Ti> | 基板上垂直組立体用の折り曲げた相互接続体上にスタックしたチップスケールパッケージ |
| WO2005104324A2 (en) * | 2004-04-15 | 2005-11-03 | Smith Gary W | Folded, fully buffered memory module |
-
2005
- 2005-08-10 WO PCT/US2005/028547 patent/WO2006028643A2/en active Application Filing
- 2005-08-11 FR FR0508522A patent/FR2878118A1/fr not_active Withdrawn
- 2005-08-11 CA CA002515714A patent/CA2515714A1/en not_active Abandoned
- 2005-08-11 AU AU2005203591A patent/AU2005203591A1/en not_active Abandoned
- 2005-08-12 GB GB0516622A patent/GB2417836B/en not_active Expired - Fee Related
- 2005-08-12 DE DE102005038254A patent/DE102005038254A1/de not_active Withdrawn
- 2005-08-12 GB GB0822085A patent/GB2452880B/en not_active Expired - Fee Related
- 2005-08-12 GB GB0822086A patent/GB2453064A/en not_active Withdrawn
- 2005-08-15 JP JP2005235451A patent/JP2006074031A/ja active Pending
- 2005-08-16 KR KR1020050074824A patent/KR100880054B1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| GB2417836B (en) | 2009-08-26 |
| GB0822085D0 (en) | 2009-01-07 |
| GB2453064A (en) | 2009-03-25 |
| GB2452880A (en) | 2009-03-18 |
| WO2006028643A2 (en) | 2006-03-16 |
| GB2452880B (en) | 2009-07-29 |
| JP2006074031A (ja) | 2006-03-16 |
| AU2005203591A1 (en) | 2006-03-23 |
| GB0822086D0 (en) | 2009-01-07 |
| GB0516622D0 (en) | 2005-09-21 |
| CA2515714A1 (en) | 2006-03-03 |
| KR20060050487A (ko) | 2006-05-19 |
| FR2878118A1 (fr) | 2006-05-19 |
| GB2417836A (en) | 2006-03-08 |
| WO2006028643A3 (en) | 2006-11-30 |
| KR100880054B1 (ko) | 2009-01-22 |
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| Publication | Publication Date | Title |
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