GB2417836B - Circuit module system and method - Google Patents

Circuit module system and method

Info

Publication number
GB2417836B
GB2417836B GB0516622A GB0516622A GB2417836B GB 2417836 B GB2417836 B GB 2417836B GB 0516622 A GB0516622 A GB 0516622A GB 0516622 A GB0516622 A GB 0516622A GB 2417836 B GB2417836 B GB 2417836B
Authority
GB
United Kingdom
Prior art keywords
circuit module
module system
circuit
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0516622A
Other languages
English (en)
Other versions
GB0516622D0 (en
GB2417836A (en
Inventor
Paul Goodwin
James W Cady
James Douglas Wehrly
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entorian Technologies Inc
Original Assignee
Entorian Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/934,027 external-priority patent/US20060050492A1/en
Priority claimed from US11/007,551 external-priority patent/US7511968B2/en
Priority claimed from US11/058,979 external-priority patent/US7468893B2/en
Priority claimed from US11/068,688 external-priority patent/US7324352B2/en
Priority claimed from US11/123,721 external-priority patent/US20060053345A1/en
Priority claimed from US11/125,018 external-priority patent/US7606049B2/en
Priority claimed from US11/193,954 external-priority patent/US20060049513A1/en
Priority to GB0822086A priority Critical patent/GB2453064A/en
Priority to GB0822085A priority patent/GB2452880B/en
Application filed by Entorian Technologies Inc filed Critical Entorian Technologies Inc
Publication of GB0516622D0 publication Critical patent/GB0516622D0/en
Publication of GB2417836A publication Critical patent/GB2417836A/en
Publication of GB2417836B publication Critical patent/GB2417836B/en
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB0516622A 2004-09-03 2005-08-12 Circuit module system and method Expired - Fee Related GB2417836B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB0822085A GB2452880B (en) 2004-09-03 2005-08-12 Circuit module system and method
GB0822086A GB2453064A (en) 2004-09-03 2005-08-12 Circuit module for memory expansion

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US10/934,027 US20060050492A1 (en) 2004-09-03 2004-09-03 Thin module system and method
US11/005,992 US7480152B2 (en) 2004-09-03 2004-12-07 Thin module system and method
US11/007,551 US7511968B2 (en) 2004-09-03 2004-12-08 Buffered thin module system and method
US11/058,979 US7468893B2 (en) 2004-09-03 2005-02-16 Thin module system and method
US11/068,688 US7324352B2 (en) 2004-09-03 2005-03-01 High capacity thin module system and method
US11/123,721 US20060053345A1 (en) 2004-09-03 2005-05-06 Thin module system and method
US11/125,018 US7606049B2 (en) 2004-09-03 2005-05-09 Module thermal management system and method
US11/173,450 US20060049512A1 (en) 2004-09-03 2005-07-01 Thin module system and method with skew reduction
US11/193,954 US20060049513A1 (en) 2004-09-03 2005-07-29 Thin module system and method with thermal management

Publications (3)

Publication Number Publication Date
GB0516622D0 GB0516622D0 (en) 2005-09-21
GB2417836A GB2417836A (en) 2006-03-08
GB2417836B true GB2417836B (en) 2009-08-26

Family

ID=35098242

Family Applications (3)

Application Number Title Priority Date Filing Date
GB0822085A Expired - Fee Related GB2452880B (en) 2004-09-03 2005-08-12 Circuit module system and method
GB0516622A Expired - Fee Related GB2417836B (en) 2004-09-03 2005-08-12 Circuit module system and method
GB0822086A Withdrawn GB2453064A (en) 2004-09-03 2005-08-12 Circuit module for memory expansion

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB0822085A Expired - Fee Related GB2452880B (en) 2004-09-03 2005-08-12 Circuit module system and method

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB0822086A Withdrawn GB2453064A (en) 2004-09-03 2005-08-12 Circuit module for memory expansion

Country Status (8)

Country Link
JP (1) JP2006074031A (ja)
KR (1) KR100880054B1 (ja)
AU (1) AU2005203591A1 (ja)
CA (1) CA2515714A1 (ja)
DE (1) DE102005038254A1 (ja)
FR (1) FR2878118A1 (ja)
GB (3) GB2452880B (ja)
WO (1) WO2006028643A2 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100837276B1 (ko) 2006-12-20 2008-06-11 삼성전자주식회사 인쇄 회로 기판 및 이를 사용하는 반도체 메모리 모듈
US7715200B2 (en) 2007-09-28 2010-05-11 Samsung Electronics Co., Ltd. Stacked semiconductor module, method of fabricating the same, and electronic system using the same
JP2011035345A (ja) 2009-08-06 2011-02-17 Fujitsu Ltd 半導体素子モジュール、電子回路ユニット、電子デバイス、及び、半導体素子モジュールの製造方法
JP2011090441A (ja) * 2009-10-21 2011-05-06 Elpida Memory Inc メモリモジュール
US8536697B2 (en) 2011-11-30 2013-09-17 Freescale Semiconductor, Inc. Packaged die for heat dissipation and method therefor
TW201347051A (zh) * 2012-01-27 2013-11-16 Mosaid Technologies Inc 連接記憶體晶粒形成記憶體系統的方法與設備
US9516755B2 (en) * 2012-12-28 2016-12-06 Intel Corporation Multi-channel memory module
DE102016115665B3 (de) * 2016-08-24 2018-01-18 Harting Electric Gmbh & Co. Kg Steckverbinder
US10679722B2 (en) 2016-08-26 2020-06-09 Sandisk Technologies Llc Storage system with several integrated components and method for use therewith
JP6597810B2 (ja) 2018-02-02 2019-10-30 日本電気株式会社 実装構造、構造部品、実装構造の製造方法
US20190314083A1 (en) * 2018-04-11 2019-10-17 Biosense Webster (Israel) Ltd. Flexible Multi-Arm Catheter with Diametrically Opposed Sensing Electrodes

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0527044A1 (en) * 1991-08-05 1993-02-10 International Business Machines Corporation Memory package
US5751553A (en) * 1992-09-16 1998-05-12 Clayton; James E. Thin multichip module including a connector frame socket having first and second apertures
JPH113955A (ja) * 1997-06-12 1999-01-06 Shinko Electric Ind Co Ltd 半導体チップ搭載ボード
US5963427A (en) * 1997-12-11 1999-10-05 Sun Microsystems, Inc. Multi-chip module with flexible circuit board
US6449159B1 (en) * 2000-05-03 2002-09-10 Rambus Inc. Semiconductor module with imbedded heat spreader

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57193094A (en) * 1981-05-18 1982-11-27 Matsushita Electric Ind Co Ltd Electronic circuit part and method of mounting same
FR2538989B1 (fr) * 1982-12-30 1985-10-04 Thomson Csf Structure d'assemblage de circuits electroniques complexes, et procede d'amelioration de la fiabilite d'un tel assemblage
US6219243B1 (en) * 1999-12-14 2001-04-17 Intel Corporation Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units
US6444921B1 (en) * 2000-02-03 2002-09-03 Fujitsu Limited Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like
JP2002151648A (ja) * 2000-11-07 2002-05-24 Mitsubishi Electric Corp 半導体モジュール
JP2002237568A (ja) * 2000-12-28 2002-08-23 Texas Instr Inc <Ti> 基板上垂直組立体用の折り曲げた相互接続体上にスタックしたチップスケールパッケージ
WO2005104324A2 (en) * 2004-04-15 2005-11-03 Smith Gary W Folded, fully buffered memory module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0527044A1 (en) * 1991-08-05 1993-02-10 International Business Machines Corporation Memory package
US5751553A (en) * 1992-09-16 1998-05-12 Clayton; James E. Thin multichip module including a connector frame socket having first and second apertures
JPH113955A (ja) * 1997-06-12 1999-01-06 Shinko Electric Ind Co Ltd 半導体チップ搭載ボード
US5963427A (en) * 1997-12-11 1999-10-05 Sun Microsystems, Inc. Multi-chip module with flexible circuit board
US6449159B1 (en) * 2000-05-03 2002-09-10 Rambus Inc. Semiconductor module with imbedded heat spreader

Also Published As

Publication number Publication date
GB2453064A (en) 2009-03-25
FR2878118A1 (fr) 2006-05-19
GB0516622D0 (en) 2005-09-21
GB2452880A (en) 2009-03-18
WO2006028643A3 (en) 2006-11-30
GB0822085D0 (en) 2009-01-07
CA2515714A1 (en) 2006-03-03
AU2005203591A1 (en) 2006-03-23
DE102005038254A1 (de) 2006-03-23
KR100880054B1 (ko) 2009-01-22
JP2006074031A (ja) 2006-03-16
KR20060050487A (ko) 2006-05-19
GB2452880B (en) 2009-07-29
GB0822086D0 (en) 2009-01-07
WO2006028643A2 (en) 2006-03-16
GB2417836A (en) 2006-03-08

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20110812