DE1018089T1 - Komponentenzufuhrzusammenstellungs-überwachung - Google Patents

Komponentenzufuhrzusammenstellungs-überwachung

Info

Publication number
DE1018089T1
DE1018089T1 DE1018089T DE98943520T DE1018089T1 DE 1018089 T1 DE1018089 T1 DE 1018089T1 DE 1018089 T DE1018089 T DE 1018089T DE 98943520 T DE98943520 T DE 98943520T DE 1018089 T1 DE1018089 T1 DE 1018089T1
Authority
DE
Germany
Prior art keywords
feed composition
component feed
composition monitoring
monitoring
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE1018089T
Other languages
English (en)
Inventor
Yuen-Foo Michael Kou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KOU YUEN FOO MICHAEL
Original Assignee
KOU YUEN FOO MICHAEL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KOU YUEN FOO MICHAEL filed Critical KOU YUEN FOO MICHAEL
Publication of DE1018089T1 publication Critical patent/DE1018089T1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/087—Equipment tracking or labelling, e.g. tracking of nozzles, feeders or mounting heads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/0882—Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Automation & Control Theory (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE1018089T 1997-09-10 1998-09-02 Komponentenzufuhrzusammenstellungs-überwachung Pending DE1018089T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/926,848 US6027019A (en) 1997-09-10 1997-09-10 Component feeder configuration monitoring
PCT/US1998/018235 WO1999013428A1 (en) 1997-09-10 1998-09-02 Component feeder configuration monitoring

Publications (1)

Publication Number Publication Date
DE1018089T1 true DE1018089T1 (de) 2001-06-07

Family

ID=25453800

Family Applications (2)

Application Number Title Priority Date Filing Date
DE1018089T Pending DE1018089T1 (de) 1997-09-10 1998-09-02 Komponentenzufuhrzusammenstellungs-überwachung
DE69810324T Expired - Fee Related DE69810324T2 (de) 1997-09-10 1998-09-02 Komponentenzufuhrzusammenstellungs-überwachung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69810324T Expired - Fee Related DE69810324T2 (de) 1997-09-10 1998-09-02 Komponentenzufuhrzusammenstellungs-überwachung

Country Status (6)

Country Link
US (2) US6027019A (de)
EP (1) EP1018089B1 (de)
CN (1) CN1149507C (de)
CA (1) CA2303175A1 (de)
DE (2) DE1018089T1 (de)
WO (1) WO1999013428A1 (de)

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US20030121607A1 (en) * 1998-02-24 2003-07-03 Peter Davis Surface mount assembly system with integral label feeder
GB9811069D0 (en) * 1998-05-23 1998-07-22 Ncr Int Inc Modular self service terminal
US6253076B1 (en) * 1999-02-25 2001-06-26 Ericsson Inc. Manufacturing method for wireless communications devices employing potentially different versions of integrated circuits
US6352203B1 (en) * 1999-03-17 2002-03-05 Compaq Information Technologies Group, L.P. Automated semiconductor identification system
EP1039410A1 (de) * 1999-03-24 2000-09-27 Hewlett-Packard Company Intelligentes Mediumlesegerät und Etikettendrucker
DE19940584A1 (de) * 1999-08-26 2001-03-22 Siemens Ag Verfahren und System zum Bestücken von in einer Bestückungseinheit angeordneten Schaltungsträgern
MXPA02010342A (es) 2000-04-20 2004-09-06 Cogiscan Inc Sistema automatizado de control de manufactura.
US20020143423A1 (en) * 2000-07-06 2002-10-03 Robert Huber Scheduling system for an electronics manufacturing plant
US6778878B1 (en) * 2000-11-27 2004-08-17 Accu-Assembly Incorporated Monitoring electronic component holders
US6675056B1 (en) * 2001-01-13 2004-01-06 Juki Corporation Intelligent component feeder system
JP4733281B2 (ja) * 2001-03-06 2011-07-27 富士機械製造株式会社 対フィーダ作業支援装置
EP1253818A1 (de) * 2001-04-23 2002-10-30 TraceXpert A/S Bauteilesteuerung für einen Bestückautomat
US6662966B2 (en) 2001-06-28 2003-12-16 Smtc Corporation Surface mount manufacturing storage system
US20030098798A1 (en) * 2001-09-28 2003-05-29 Fuji Machine Mfg. Co., Ltd. Manufacturing system, and apparatus and system for administering the manufacturing system
US7239399B2 (en) * 2001-11-13 2007-07-03 Cyberoptics Corporation Pick and place machine with component placement inspection
US7555831B2 (en) * 2001-11-13 2009-07-07 Cyberoptics Corporation Method of validating component feeder exchanges
US7813559B2 (en) * 2001-11-13 2010-10-12 Cyberoptics Corporation Image analysis for pick and place machines with in situ component placement inspection
US6847861B2 (en) * 2001-11-30 2005-01-25 Mckesson Automation, Inc. Carousel product for use in integrated restocking and dispensing system
EP1343363A1 (de) * 2002-03-08 2003-09-10 TraceXpert A/S Prüfung einer Zufuhreinrichtung mit einer Kamera
US6817216B2 (en) 2002-08-22 2004-11-16 Accu-Assembly Incorporated Electronic component placement
WO2004026016A1 (en) * 2002-09-13 2004-03-25 Matsushita Electric Industrial Co., Ltd. Component placing head and origin detection method of component placing head
US7052097B2 (en) * 2002-12-06 2006-05-30 Mckesson Automation, Inc. High capacity drawer with mechanical indicator for a dispensing device
US6879869B2 (en) * 2003-03-28 2005-04-12 Accu-Assembly Incorporated Placement of electronic components
US7559134B2 (en) * 2003-11-04 2009-07-14 Cyberoptics Corporation Pick and place machine with improved component placement inspection
US20050125993A1 (en) * 2003-11-07 2005-06-16 Madsen David D. Pick and place machine with improved setup and operation procedure
US7706595B2 (en) * 2003-11-07 2010-04-27 Cyberoptics Corporation Pick and place machine with workpiece motion inspection
CA2752578C (en) * 2003-11-26 2016-02-02 Mckesson Automation Inc. Integrated suite of medical tools
CA2464014A1 (en) * 2004-04-08 2005-10-08 Unknown Closed-loop reel setup verification and traceability
US20060016066A1 (en) * 2004-07-21 2006-01-26 Cyberoptics Corporation Pick and place machine with improved inspection
US7290701B2 (en) 2004-08-13 2007-11-06 Accu-Assembly Incorporated Gathering data relating to electrical components picked from stacked trays
US20060075631A1 (en) * 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
US7089074B2 (en) * 2004-11-10 2006-08-08 Universal Instruments Corporation Host feeder setup validation
US20070003126A1 (en) * 2005-05-19 2007-01-04 Case Steven K Method and apparatus for evaluating a component pick action in an electronics assembly machine
US7545514B2 (en) * 2005-09-14 2009-06-09 Cyberoptics Corporation Pick and place machine with improved component pick image processing
CN1956649A (zh) * 2005-10-26 2007-05-02 鸿富锦精密工业（深圳）有限公司 贴片机供料器管理系统及方法
DE112006003019T5 (de) * 2005-10-31 2008-10-23 Cyberoptics Corp., Golden Valley Elektronikmontagevorrichtung mit eingebauter Lötpastenprüfung
JP2008085076A (ja) * 2006-09-27 2008-04-10 Juki Corp 部品実装機のメンテナンス情報管理装置
EP2067394A2 (de) * 2006-09-29 2009-06-10 Siemens Energy & Automation, Inc. Inventarverwaltungsdienst und unterstützung zur herstellung einer bestückten leiterplatte
EP2067395A1 (de) * 2006-09-29 2009-06-10 Siemens Energy & Automation, Inc. Inventarverwalter für platinenherstellung
US20080078829A1 (en) * 2006-09-29 2008-04-03 Siemens Energy & Automation, Inc Inventory manager service and assistant for PCB manufacturing
JP4887205B2 (ja) * 2007-04-26 2012-02-29 株式会社日立ハイテクインスツルメンツ 電子部品装着方法及び電子部品装着装置
US20080270178A1 (en) * 2007-04-30 2008-10-30 Mckesson Specialty Distribution Llc Inventory Management System For A Medical Service Provider
CH701168B1 (de) * 2007-08-17 2010-12-15 Kellenberger & Co Ag L Verfahren und Bearbeitungsmaschine zur Behandlung von Werkstücken.
US8269973B2 (en) * 2009-05-13 2012-09-18 Accu-Assembly Incorporated Detecting component carrier tape splicing
EP2827692B1 (de) * 2012-03-13 2018-07-18 Fuji Machine Mfg. Co., Ltd. Verwaltungssystem für die zuführvorrichtung einer komponentenmontagevorrichtung
WO2014203331A1 (ja) * 2013-06-18 2014-12-24 富士機械製造株式会社 実装管理装置、実装処理装置、実装システム、実装管理方法及び実装処理方法
CN106063401B (zh) * 2013-09-18 2019-05-07 迈康尼股份公司 用于表面安装装置仓库中的组件和箱的重新分配的方法、系统和装置
US10285319B2 (en) 2013-10-30 2019-05-07 Fuji Corporation Component mounting line management device
JP6302753B2 (ja) * 2014-06-04 2018-03-28 Juki株式会社 電子部品実装システム及び電子部品実装方法
EP3282820B1 (de) * 2015-04-08 2019-07-31 FUJI Corporation System zur berechnung von komponentenaufnahmeraten für komponentenmontagevorrichtung
JP7017508B2 (ja) * 2016-07-04 2022-02-08 株式会社Fuji 電子部品供給装置
CN109417869B (zh) * 2016-07-13 2020-10-16 株式会社富士 元件安装机
JP6603881B2 (ja) * 2016-09-28 2019-11-13 パナソニックＩｐマネジメント株式会社 管理システムおよび管理方法
US10373643B2 (en) * 2017-03-27 2019-08-06 Panasonic Intellectual Property Management Co., Ltd. Component accommodating body managing apparatus, component accommodating body storeroom, and component storage instructing method
US10996308B2 (en) * 2018-04-17 2021-05-04 Asm Technology Singapore Pte Ltd Apparatus and method for authentication of electronic device test stations
DE102022125639A1 (de) 2022-10-05 2024-04-11 ASMPT GmbH & Co. KG RFID-Modul für eine Bestückungsmaschine

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US5455409A (en) * 1993-08-16 1995-10-03 Texas Digital Systems, Inc. Apparatus and method for monitoring a plurality of coded articles and for identifying the location of selected articles
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US5567927A (en) * 1994-07-25 1996-10-22 Texas Instruments Incorporated Apparatus for semiconductor wafer identification
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US5838574A (en) * 1995-10-11 1998-11-17 R. R. Donnelley & Sons Company System for controlling feeders of a package assembly apparatus
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Also Published As

Publication number Publication date
EP1018089B1 (de) 2002-12-18
DE69810324T2 (de) 2003-05-22
CN1149507C (zh) 2004-05-12
WO1999013428A1 (en) 1999-03-18
US6027019A (en) 2000-02-22
EP1018089A4 (de) 2001-07-04
US6530517B1 (en) 2003-03-11
EP1018089A1 (de) 2000-07-12
CA2303175A1 (en) 1999-03-18
CN1306647A (zh) 2001-08-01
DE69810324D1 (de) 2003-01-30

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