DE10155594A1 - Verfrahren zum Herstellen eines aus mehreren Schichten bestehenden mikroelektronischen Substrats - Google Patents

Verfrahren zum Herstellen eines aus mehreren Schichten bestehenden mikroelektronischen Substrats

Info

Publication number
DE10155594A1
DE10155594A1 DE10155594A DE10155594A DE10155594A1 DE 10155594 A1 DE10155594 A1 DE 10155594A1 DE 10155594 A DE10155594 A DE 10155594A DE 10155594 A DE10155594 A DE 10155594A DE 10155594 A1 DE10155594 A1 DE 10155594A1
Authority
DE
Germany
Prior art keywords
oxide
compression temperature
films
temperature
microelectronic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10155594A
Other languages
German (de)
English (en)
Inventor
Vassilos Zaspalis
Jack Boerekamp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Intellectual Property and Standards GmbH
Original Assignee
Philips Corporate Intellectual Property GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Corporate Intellectual Property GmbH filed Critical Philips Corporate Intellectual Property GmbH
Priority to DE10155594A priority Critical patent/DE10155594A1/de
Priority to PCT/IB2002/004763 priority patent/WO2003043035A1/en
Priority to CNA028223632A priority patent/CN1585992A/zh
Priority to US10/494,750 priority patent/US7158365B2/en
Priority to EP02781508A priority patent/EP1449224A1/en
Priority to JP2003544774A priority patent/JP2005510051A/ja
Publication of DE10155594A1 publication Critical patent/DE10155594A1/de
Priority to US11/491,467 priority patent/US20060263641A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Magnetic Ceramics (AREA)
  • Soft Magnetic Materials (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
DE10155594A 2001-11-13 2001-11-13 Verfrahren zum Herstellen eines aus mehreren Schichten bestehenden mikroelektronischen Substrats Withdrawn DE10155594A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE10155594A DE10155594A1 (de) 2001-11-13 2001-11-13 Verfrahren zum Herstellen eines aus mehreren Schichten bestehenden mikroelektronischen Substrats
PCT/IB2002/004763 WO2003043035A1 (en) 2001-11-13 2002-11-13 Method of producing a multilayer microelectronic substrate
CNA028223632A CN1585992A (zh) 2001-11-13 2002-11-13 一种生产多层微电子基片的方法
US10/494,750 US7158365B2 (en) 2001-11-13 2002-11-13 Method of producing a multilayer microelectronic substrate
EP02781508A EP1449224A1 (en) 2001-11-13 2002-11-13 Method of producing a multilayer microelectronic substrate
JP2003544774A JP2005510051A (ja) 2001-11-13 2002-11-13 多層マイクロエレクトロニック基材の製造方法
US11/491,467 US20060263641A1 (en) 2001-11-13 2006-07-21 Method of producing a multilayer microelectronic substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10155594A DE10155594A1 (de) 2001-11-13 2001-11-13 Verfrahren zum Herstellen eines aus mehreren Schichten bestehenden mikroelektronischen Substrats

Publications (1)

Publication Number Publication Date
DE10155594A1 true DE10155594A1 (de) 2003-05-22

Family

ID=7705522

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10155594A Withdrawn DE10155594A1 (de) 2001-11-13 2001-11-13 Verfrahren zum Herstellen eines aus mehreren Schichten bestehenden mikroelektronischen Substrats

Country Status (6)

Country Link
US (2) US7158365B2 (https=)
EP (1) EP1449224A1 (https=)
JP (1) JP2005510051A (https=)
CN (1) CN1585992A (https=)
DE (1) DE10155594A1 (https=)
WO (1) WO2003043035A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004031878B3 (de) * 2004-07-01 2005-10-06 Epcos Ag Elektrisches Mehrschichtbauelement mit zuverlässigem Lötkontakt
US20060279171A1 (en) * 2005-06-10 2006-12-14 Viehland Dwight D Broadband, Nonreciprocal Network Element
DE102007009740A1 (de) * 2007-02-28 2008-09-04 Siemens Ag Verfahren zum Herstellen eines magnetischen Keramikmaterials und Verwendung des Keramikmaterials
US20080220542A1 (en) * 2007-03-07 2008-09-11 Micheli Adolph L Low-fire ferroelectric material
DE102009014542B3 (de) * 2009-02-12 2010-12-02 Epcos Ag Mehrschichtbauelement und Verfahren zur Herstellung
JP6574574B6 (ja) * 2015-01-21 2020-01-15 Ｎｊコンポーネント株式会社 積層インダクタ

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE554942A (https=) * 1956-02-14
SU378969A1 (ru) 1967-02-06 1973-04-18 Ферритовый материал
SU661620A2 (ru) 1977-04-26 1979-05-05 Предприятие П/Я А-1216 Ферритовый материал
JPH0541315A (ja) 1991-08-02 1993-02-19 Tokin Corp 低損失酸化物磁性材料の製造方法
US5176771A (en) * 1991-12-23 1993-01-05 Hughes Aircraft Company Multilayer ceramic tape substrate having cavities formed in the upper layer thereof and method of fabricating the same by printing and delamination
JPH06237742A (ja) 1992-03-31 1994-08-30 Chiyoda Corp 果汁製品の製造方法
US5259110A (en) * 1992-04-03 1993-11-09 International Business Machines Corporation Method for forming a multilayer microelectronic wiring module
US5426075A (en) * 1994-06-15 1995-06-20 Ramtron International Corporation Method of manufacturing ferroelectric bismuth layered oxides
US5600533A (en) * 1994-06-23 1997-02-04 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor having an anti-reducing agent
US5648015A (en) * 1995-01-26 1997-07-15 Ferronics Incorporated Process for preparing a ferromagnetic material
JPH09306716A (ja) 1996-05-14 1997-11-28 Taiyo Yuden Co Ltd フェライト焼結体およびその製造方法
JP3631341B2 (ja) * 1996-10-18 2005-03-23 Ｔｄｋ株式会社 積層型複合機能素子およびその製造方法
US6080468A (en) * 1997-02-28 2000-06-27 Taiyo Yuden Co., Ltd. Laminated composite electronic device and a manufacturing method thereof
WO2000004577A1 (de) 1998-07-15 2000-01-27 Siemens Aktiengesellschaft Verfahren zur herstellung eines keramischen körpers mit einem integrierten passiven elektronischen bauelement, derartiger körper und verwendung des körpers
US6191934B1 (en) * 1998-10-02 2001-02-20 Sarnoff Corporation & Co., Ltd. High dielectric constant embedded capacitors
TW398060B (en) 1998-11-24 2000-07-11 Advanced Ceramic X Corp Fabrication method for ceramic chip of semiconductor diode
DE19924354A1 (de) 1999-05-27 2000-11-30 Philips Corp Intellectual Pty Bauelement mit magnetodielektrischem Material
JP3758464B2 (ja) * 2000-05-12 2006-03-22 株式会社村田製作所 積層電子部品

Also Published As

Publication number Publication date
US7158365B2 (en) 2007-01-02
US20050011602A1 (en) 2005-01-20
JP2005510051A (ja) 2005-04-14
CN1585992A (zh) 2005-02-23
EP1449224A1 (en) 2004-08-25
WO2003043035A1 (en) 2003-05-22
US20060263641A1 (en) 2006-11-23

Similar Documents

Publication Publication Date Title
DE10002812C2 (de) Verfahren zur Herstellung eines dielektrischen Glas-Keramikkörpers, der bei niedrigen Temperaturen sinterfähig ist
DE60121386T2 (de) Dielektrische Keramikzusammensetzung sowie Verfahren zu ihrer Herstellung und Vorrichtung für Kommunikationsgerät
DE112009000012B4 (de) Glaskeramikzusammensetzung, Glaskeramik-Sinterkörper und keramisches Mehrschicht-Elektronikbauteil
DE69728721T2 (de) Dielektrische keramische Zusammensetzung und dieselbe benutzender monolithischer keramischer Kondensator
DE69034034T2 (de) Keramischer Mehrschicht-Chipkondensator und Verfahren zu seiner Herstellung
DE69710259T2 (de) Dielektrische keramische Zusammensetzung und ihre Verwendung in einem monolithischen keramischen Kondensator
DE3317963C2 (de) Keramikkondensator mit Schichtaufbau
DE10157443B4 (de) Glas-Keramikzusammensetzung für ein elektronisches Keramikbauteil, Verwendung der Glas-Keramikzusammensetzung für ein elektronisches Keramikbauteil und Vefahren zur Herstellung eines elektronischen Vielschicht-Keramikbauteils
DE19725849C2 (de) Weichferrit-Material für die Verwendung zur Herstellung von Induktivitäten und Verfahren zur Herstellung von Induktivitäten unter Verwendung dieses Materials
DE69221470T2 (de) Verfahren zur herstellung eines mehrschichtigen keramikteils sowie mehrschichtiges keramikteil
DE69611892T2 (de) Dielektrisches porzellan, verfahren zu seiner herstellung und elektronische teile daraus
DE2701411C3 (de) Dielektrische Keramikverbindung
DE102014106376A1 (de) Zusammengesetzte Ferrit-Verbindung und elektronische Vorrichtung
DE112008002221B4 (de) Keramikzusammensetzung, Verfahren zum Erzeugen derselben, Keramiksubstrat und Verfahren zum Erzeugen einer keramischen Grünschicht
DE3701973C2 (https=)
DE3888582T2 (de) Gesinterter Ferritkörper, Chip-Induktivität und Verbund-LC-Teil.
DE19725869A1 (de) Niedertemperatursinterungs-Radiofrequenz-Weichferrit-Material und Verfahren zur Herstellung eines Induktors unter Verwendung dieses Materials
DE19638195A1 (de) Dielektrische Paste
EP4289530A1 (de) Verfahren zur herstellung von elementen für elektrische arbeitsmaschinen, die mit übereinander angeordneten schichten aus eisen oder einer eisenlegierung mit weichmagnetischen eigenschaften gebildet sind sowie ein damit hergestelltes element
DE10010082B4 (de) Magnetische Keramikzusammensetzung und deren Verwendung in einer Induktorkomponente
DE69201108T2 (de) Keramischer Kondensator und sein Herstellungsverfahren.
DE60116449T2 (de) Magnesium-Zink-Titanat Pulver mit einem Flussmittel aus Lithiumsilikat und Bariumboraten und ein daraus hergestellter mehrschichtiger COG-Kondensator
DE68912988T2 (de) Monolithischer keramischer Kondensator.
DE60126242T2 (de) Dielektrische zusammensetzung, herstellungsverfahren von einem keramikbauteil, und elektronisches bauteil
DE4005505A1 (de) Monolithischer keramischer kondensator

Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH, 20

8139 Disposal/non-payment of the annual fee