CN1585992A - 一种生产多层微电子基片的方法 - Google Patents

一种生产多层微电子基片的方法 Download PDF

Info

Publication number
CN1585992A
CN1585992A CNA028223632A CN02822363A CN1585992A CN 1585992 A CN1585992 A CN 1585992A CN A028223632 A CNA028223632 A CN A028223632A CN 02822363 A CN02822363 A CN 02822363A CN 1585992 A CN1585992 A CN 1585992A
Authority
CN
China
Prior art keywords
compression temperature
temperature
oxide
film sheet
microelectronic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA028223632A
Other languages
English (en)
Chinese (zh)
Inventor
V·扎斯帕里斯
J·G·波雷坎普
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of CN1585992A publication Critical patent/CN1585992A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Magnetic Ceramics (AREA)
  • Soft Magnetic Materials (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
CNA028223632A 2001-11-13 2002-11-13 一种生产多层微电子基片的方法 Pending CN1585992A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10155594.6 2001-11-13
DE10155594A DE10155594A1 (de) 2001-11-13 2001-11-13 Verfrahren zum Herstellen eines aus mehreren Schichten bestehenden mikroelektronischen Substrats

Publications (1)

Publication Number Publication Date
CN1585992A true CN1585992A (zh) 2005-02-23

Family

ID=7705522

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA028223632A Pending CN1585992A (zh) 2001-11-13 2002-11-13 一种生产多层微电子基片的方法

Country Status (6)

Country Link
US (2) US7158365B2 (https=)
EP (1) EP1449224A1 (https=)
JP (1) JP2005510051A (https=)
CN (1) CN1585992A (https=)
DE (1) DE10155594A1 (https=)
WO (1) WO2003043035A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102318017B (zh) * 2009-02-12 2013-05-29 埃普科斯股份有限公司 多层部件和产生方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004031878B3 (de) * 2004-07-01 2005-10-06 Epcos Ag Elektrisches Mehrschichtbauelement mit zuverlässigem Lötkontakt
US20060279171A1 (en) * 2005-06-10 2006-12-14 Viehland Dwight D Broadband, Nonreciprocal Network Element
DE102007009740A1 (de) * 2007-02-28 2008-09-04 Siemens Ag Verfahren zum Herstellen eines magnetischen Keramikmaterials und Verwendung des Keramikmaterials
US20080220542A1 (en) * 2007-03-07 2008-09-11 Micheli Adolph L Low-fire ferroelectric material
JP6574574B6 (ja) * 2015-01-21 2020-01-15 Ｎｊコンポーネント株式会社 積層インダクタ

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE554942A (https=) * 1956-02-14
SU378969A1 (ru) 1967-02-06 1973-04-18 Ферритовый материал
SU661620A2 (ru) 1977-04-26 1979-05-05 Предприятие П/Я А-1216 Ферритовый материал
JPH0541315A (ja) 1991-08-02 1993-02-19 Tokin Corp 低損失酸化物磁性材料の製造方法
US5176771A (en) * 1991-12-23 1993-01-05 Hughes Aircraft Company Multilayer ceramic tape substrate having cavities formed in the upper layer thereof and method of fabricating the same by printing and delamination
JPH06237742A (ja) 1992-03-31 1994-08-30 Chiyoda Corp 果汁製品の製造方法
US5259110A (en) * 1992-04-03 1993-11-09 International Business Machines Corporation Method for forming a multilayer microelectronic wiring module
US5426075A (en) * 1994-06-15 1995-06-20 Ramtron International Corporation Method of manufacturing ferroelectric bismuth layered oxides
US5600533A (en) * 1994-06-23 1997-02-04 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor having an anti-reducing agent
US5648015A (en) * 1995-01-26 1997-07-15 Ferronics Incorporated Process for preparing a ferromagnetic material
JPH09306716A (ja) 1996-05-14 1997-11-28 Taiyo Yuden Co Ltd フェライト焼結体およびその製造方法
JP3631341B2 (ja) * 1996-10-18 2005-03-23 Ｔｄｋ株式会社 積層型複合機能素子およびその製造方法
US6080468A (en) * 1997-02-28 2000-06-27 Taiyo Yuden Co., Ltd. Laminated composite electronic device and a manufacturing method thereof
WO2000004577A1 (de) 1998-07-15 2000-01-27 Siemens Aktiengesellschaft Verfahren zur herstellung eines keramischen körpers mit einem integrierten passiven elektronischen bauelement, derartiger körper und verwendung des körpers
US6191934B1 (en) * 1998-10-02 2001-02-20 Sarnoff Corporation & Co., Ltd. High dielectric constant embedded capacitors
TW398060B (en) 1998-11-24 2000-07-11 Advanced Ceramic X Corp Fabrication method for ceramic chip of semiconductor diode
DE19924354A1 (de) 1999-05-27 2000-11-30 Philips Corp Intellectual Pty Bauelement mit magnetodielektrischem Material
JP3758464B2 (ja) * 2000-05-12 2006-03-22 株式会社村田製作所 積層電子部品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102318017B (zh) * 2009-02-12 2013-05-29 埃普科斯股份有限公司 多层部件和产生方法

Also Published As

Publication number Publication date
US7158365B2 (en) 2007-01-02
US20050011602A1 (en) 2005-01-20
DE10155594A1 (de) 2003-05-22
JP2005510051A (ja) 2005-04-14
EP1449224A1 (en) 2004-08-25
WO2003043035A1 (en) 2003-05-22
US20060263641A1 (en) 2006-11-23

Similar Documents

Publication Publication Date Title
KR101994722B1 (ko) 적층형 전자부품
KR101101793B1 (ko) 적층형 세라믹 전자 부품
CN110828108B (zh) 含金属磁性粒子的磁性基体和含该磁性基体的电子部件
JPH10338545A (ja) 非磁性セラミックおよびセラミック積層部品
CN111986876B (zh) 层叠型线圈部件
JP4535592B2 (ja) 積層体
CN116959843A (zh) 层叠型线圈部件及偏置器电路
JP2691715B2 (ja) フェライト焼結体、チップインダクタおよびｌｃ複合部品
US8384490B2 (en) Non-reciprocal circuit and non-reciprocal circuit device, and central conductor assembly used therein
CN1585992A (zh) 一种生产多层微电子基片的方法
JP3860687B2 (ja) 誘電体磁器および積層体
JP3975051B2 (ja) 磁性フェライトの製造方法、積層型チップフェライト部品の製造方法及びｌｃ複合積層部品の製造方法
KR101920887B1 (ko) 유전체층 및 금속 페라이트 자성체층을 소결 접합한 소결 구조체 및 이의 제조방법
EP1096674B1 (en) Circuit substrate
JP4074440B2 (ja) 磁性酸化物焼結体およびこれを用いた高周波回路部品
US20050244677A1 (en) Hybrid electronic device comprising a low-temperature-cofired-ceramic ltcc-tape
JP3645046B2 (ja) 非磁性セラミックおよびセラミック積層部品
JP3978689B2 (ja) 低温焼成磁器組成物、及びこれを用いたマイクロ波部品
JP2002260912A (ja) 磁性酸化物焼結体およびこれを用いた高周波回路部品
JP3364267B2 (ja) チップアンテナ
TW499399B (en) Ferrite with high-permittivity and high dielectric coefficient and method for producing the same
JPH10101416A (ja) 誘電体磁器組成物、誘電体磁器およびその製造方法
JPH10182223A (ja) 高周波用磁器組成物および高周波用磁器の製造方法
KR0173240B1 (ko) 전자기적 특성이 양호한 인덕터 칩의 제조방법
JP4895417B2 (ja) 高周波用電子基体

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication