DE10052762A1 - Verfahren und Vorrichtung zum Reinigen einer Halbleiterscheibe - Google Patents

Verfahren und Vorrichtung zum Reinigen einer Halbleiterscheibe

Info

Publication number
DE10052762A1
DE10052762A1 DE10052762A DE10052762A DE10052762A1 DE 10052762 A1 DE10052762 A1 DE 10052762A1 DE 10052762 A DE10052762 A DE 10052762A DE 10052762 A DE10052762 A DE 10052762A DE 10052762 A1 DE10052762 A1 DE 10052762A1
Authority
DE
Germany
Prior art keywords
cleaning
semiconductor wafer
chemical
mechanical polishing
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10052762A
Other languages
German (de)
English (en)
Inventor
Wolfgang Dickenscheid
Grit Bonsdorf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Priority to DE10052762A priority Critical patent/DE10052762A1/de
Priority to JP2002538478A priority patent/JP2004512693A/ja
Priority to KR1020037005115A priority patent/KR100543928B1/ko
Priority to PCT/EP2001/011582 priority patent/WO2002035598A1/de
Priority to EP01988947A priority patent/EP1328968A1/de
Publication of DE10052762A1 publication Critical patent/DE10052762A1/de
Priority to US10/424,173 priority patent/US6833324B2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • H10P70/237—Cleaning during device manufacture during, before or after processing of insulating materials the processing being a planarisation of insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE10052762A 2000-10-25 2000-10-25 Verfahren und Vorrichtung zum Reinigen einer Halbleiterscheibe Withdrawn DE10052762A1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE10052762A DE10052762A1 (de) 2000-10-25 2000-10-25 Verfahren und Vorrichtung zum Reinigen einer Halbleiterscheibe
JP2002538478A JP2004512693A (ja) 2000-10-25 2001-10-08 半導体ウェハの洗浄方法およびその装置
KR1020037005115A KR100543928B1 (ko) 2000-10-25 2001-10-08 반도체 웨이퍼의 세정 방법 및 장치
PCT/EP2001/011582 WO2002035598A1 (de) 2000-10-25 2001-10-08 Verfahren und vorrichtung zum reinigen einer halbleiterscheibe
EP01988947A EP1328968A1 (de) 2000-10-25 2001-10-08 Verfahren und vorrichtung zum reinigen einer halbleiterscheibe
US10/424,173 US6833324B2 (en) 2000-10-25 2003-04-25 Process and device for cleaning a semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10052762A DE10052762A1 (de) 2000-10-25 2000-10-25 Verfahren und Vorrichtung zum Reinigen einer Halbleiterscheibe

Publications (1)

Publication Number Publication Date
DE10052762A1 true DE10052762A1 (de) 2002-05-16

Family

ID=7660932

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10052762A Withdrawn DE10052762A1 (de) 2000-10-25 2000-10-25 Verfahren und Vorrichtung zum Reinigen einer Halbleiterscheibe

Country Status (6)

Country Link
US (1) US6833324B2 (https=)
EP (1) EP1328968A1 (https=)
JP (1) JP2004512693A (https=)
KR (1) KR100543928B1 (https=)
DE (1) DE10052762A1 (https=)
WO (1) WO2002035598A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6881675B2 (en) * 2002-05-15 2005-04-19 Taiwan Semiconductor Manufacturing Co, Ltd. Method and system for reducing wafer edge tungsten residue utilizing a spin etch
KR100604051B1 (ko) * 2004-06-30 2006-07-24 동부일렉트로닉스 주식회사 게이트 산화막의 전세정방법
KR100644054B1 (ko) * 2004-12-29 2006-11-10 동부일렉트로닉스 주식회사 세정 장치 및 게이트 산화막의 전세정 방법
KR100829376B1 (ko) * 2006-12-20 2008-05-13 동부일렉트로닉스 주식회사 반도체 소자의 세정방법
US20080289660A1 (en) * 2007-05-23 2008-11-27 Air Products And Chemicals, Inc. Semiconductor Manufacture Employing Isopropanol Drying
CN101217108B (zh) * 2008-01-02 2010-06-09 株洲南车时代电气股份有限公司 一种芯片台面腐蚀装置
EP4152393A4 (en) * 2021-08-04 2024-01-03 Changxin Memory Technologies, Inc. SEMICONDUCTOR STRUCTURE AND ITS FORMATION METHOD

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5442828A (en) * 1992-11-30 1995-08-22 Ontrak Systems, Inc. Double-sided wafer scrubber with a wet submersing silicon wafer indexer
EP0805000A1 (en) * 1996-05-02 1997-11-05 MEMC Electronic Materials, Inc. Semiconductor wafer post-polish clean and dry method and apparatus
US5779520A (en) * 1993-11-09 1998-07-14 Sony Corporation Method and apparatus of polishing wafer
DE19801360A1 (de) * 1998-01-16 1999-07-22 Sez Semiconduct Equip Zubehoer Verfahren und Vorrichtung zum Behandeln von Halbleiter-Oberflächen

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT389959B (de) * 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
US5996594A (en) * 1994-11-30 1999-12-07 Texas Instruments Incorporated Post-chemical mechanical planarization clean-up process using post-polish scrubbing
TW386235B (en) * 1995-05-23 2000-04-01 Tokyo Electron Ltd Method for spin rinsing
JPH09270412A (ja) * 1996-04-01 1997-10-14 Canon Inc 洗浄装置及び洗浄方法
US5997653A (en) * 1996-10-07 1999-12-07 Tokyo Electron Limited Method for washing and drying substrates
US5922136A (en) * 1997-03-28 1999-07-13 Taiwan Semiconductor Manufacturing Company, Ltd. Post-CMP cleaner apparatus and method
US6017437A (en) * 1997-08-22 2000-01-25 Cutek Research, Inc. Process chamber and method for depositing and/or removing material on a substrate
DE69832567T2 (de) * 1997-09-24 2007-01-18 Interuniversitair Micro-Electronica Centrum Vzw Verfahren und Vorrichtung zum Entfernen von einer Flüssigkeit von der Oberfläche eines rotierenden Substrats
US5807439A (en) * 1997-09-29 1998-09-15 Siemens Aktiengesellschaft Apparatus and method for improved washing and drying of semiconductor wafers
DE19806406C1 (de) * 1998-02-17 1999-07-29 Sez Semiconduct Equip Zubehoer Verfahren zum Rauhätzen einer Halbleiter-Oberfläche
US6172848B1 (en) * 1998-04-10 2001-01-09 International Business Machines Corporation Write head with self aligned pedestal shaped pole tips that are separated by a zero throat height defining layer
US5964953A (en) * 1998-05-26 1999-10-12 Memc Electronics Materials, Inc. Post-etching alkaline treatment process
JP2000003897A (ja) 1998-06-16 2000-01-07 Sony Corp 基板洗浄方法及び基板洗浄装置
US6099662A (en) * 1999-02-11 2000-08-08 Taiwan Semiconductor Manufacturing Company Process for cleaning a semiconductor substrate after chemical-mechanical polishing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5442828A (en) * 1992-11-30 1995-08-22 Ontrak Systems, Inc. Double-sided wafer scrubber with a wet submersing silicon wafer indexer
US5779520A (en) * 1993-11-09 1998-07-14 Sony Corporation Method and apparatus of polishing wafer
EP0805000A1 (en) * 1996-05-02 1997-11-05 MEMC Electronic Materials, Inc. Semiconductor wafer post-polish clean and dry method and apparatus
DE19801360A1 (de) * 1998-01-16 1999-07-22 Sez Semiconduct Equip Zubehoer Verfahren und Vorrichtung zum Behandeln von Halbleiter-Oberflächen

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP 2000-3897 A. In: Patent Abstracts of Japan *

Also Published As

Publication number Publication date
JP2004512693A (ja) 2004-04-22
KR20040004400A (ko) 2004-01-13
EP1328968A1 (de) 2003-07-23
WO2002035598A1 (de) 2002-05-02
KR100543928B1 (ko) 2006-01-20
US6833324B2 (en) 2004-12-21
US20030186553A1 (en) 2003-10-02

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8125 Change of the main classification

Ipc: H01L 21302

8139 Disposal/non-payment of the annual fee