CS274366B1 - Flux filling on snpb base for tube solders - Google Patents
Flux filling on snpb base for tube solders Download PDFInfo
- Publication number
- CS274366B1 CS274366B1 CS874688A CS874688A CS274366B1 CS 274366 B1 CS274366 B1 CS 274366B1 CS 874688 A CS874688 A CS 874688A CS 874688 A CS874688 A CS 874688A CS 274366 B1 CS274366 B1 CS 274366B1
- Authority
- CS
- Czechoslovakia
- Prior art keywords
- soldering
- solder
- flux
- snpb
- flux filling
- Prior art date
Links
- 230000004907 flux Effects 0.000 title claims abstract description 27
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 19
- 238000005476 soldering Methods 0.000 claims abstract description 12
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 4
- 229910007116 SnPb Inorganic materials 0.000 claims abstract description 4
- MMCPOSDMTGQNKG-UHFFFAOYSA-N anilinium chloride Chemical compound Cl.NC1=CC=CC=C1 MMCPOSDMTGQNKG-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical class Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 7
- 239000002253 acid Substances 0.000 abstract description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 abstract 1
- 231100000252 nontoxic Toxicity 0.000 abstract 1
- 230000003000 nontoxic effect Effects 0.000 abstract 1
- 238000009428 plumbing Methods 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 239000002529 flux (metallurgy) Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 231100000331 toxic Toxicity 0.000 description 3
- 230000002588 toxic effect Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 239000009493 Hova Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000006286 aqueous extract Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Vynález sn týká tavivovej náplně makkých trubičkových spájok na bázi SnPb, pře spájkovanie v elektrotechnike a v elektrotechnickom priemysle, ako aj pre strojárske spájkovanie.The present invention relates to a flux filler of populated SnPb-based tube solders, pre-soldering in the electrical and electrical industries, as well as for mechanical soldering.
Doposiaí' sú známe tavivové náplně trubičkových spájok na bázi SnPb, alebo oj samostatné tavivá, skládájúce sa 3prnvidla z čistéj kolofónie, alebo zo zmesi kolofónie s chemickými zlúčeninami, zvyšujúcimi najma účinnost' čistiaceho procesu v priebehu spájkovania, resp. zlepšujúcimi difúzne podmienky. Tieto chemické zlúčeniny a ich produkty majú aj negativné sprievodné znaky: zvýšenie korózneho vplyvu na časti spájkovaného spoja, náklady na jeho čistenie od zvyškov taviva, hygienická a ekologická závadnosť čistiacich látok, ako aj vlastnej základnéj zložky, kolofónie, alebo tiež neželatePr-ý vplyv no životné procesy zo účasti óalších nepřijatelných chemických látok (freon).To date, flux fillers of SnPb-based tubular solders, or a separate flux, consisting of a pure rosin or a mixture of rosin and chemical compounds, increasing in particular the efficiency of the cleaning process during soldering or brazing, are known. improving diffusion conditions. These chemical compounds and their products also have negative side-effects: increasing the corrosive effect on the solder joint parts, the cost of cleaning it from the flux residues, the hygienic and ecological defects of the cleaning agents as well as the actual constituent, rosin, or unwanted effect. life processes from the participation of other unacceptable chemicals (freon).
Podstata tavivovéj náplně makkých trubičkových spájok, resp. samostatného taviva na spájkovanie makkýrai spájkami na bázi SnPb, spočívá v tom, že obsahuje polyetylénglykol v množstve 90 až 93% hmot., a kyselinu solnú alebo kyselinu fluorovodíkoví:, alebo onilinhydrochlorid v množstve 2 až 10% hmot.The essence of the flux filler of the flux cored solder, respectively. It consists of polyethylene glycol in an amount of 90 to 93% by weight, and hydrochloric acid or hydrofluoric acid, or onilin hydrochloride in an amount of 2 to 10% by weight.
Hlavné výhody tavivovej náplně makkých trubičkových spájok, resp. samostatného taviva, spočívajú v tom, že hlavná zložka taviva je založená na esterifikovanom vysokomolekulérnom alkohole, ktorý preberá funkciu tenzidů, detergentů a speňovadla a v spojení s kyselinou solnou, alebo fluorovodíkovou, alebo s anilínhydrochloridom oko nktivátorom, tiež funkciu dočistenia povrchu spájkovaného materiálu a spájky, a funkciu podpory hlavněj zložky.The main advantages of the flux filler of the flux cored solder, respectively. The main component of the flux is based on an esterified high molecular weight alcohol, which assumes the function of surfactants, detergents and a foaming agent and, in conjunction with hydrochloric or hydrofluoric acid, or aniline hydrochloride eye activator, as well as the surface cleaning of soldered material and solder. and the main component support function.
Vylučuje technologické zložitostí výroby taviv doposiaí’ známých koncepcií, znižuje ekonomická náročnost1. Tavivová náplň, resp. tavivo má vysokú stálost', koncentrácia jeho exhaldtov zo technologického tepla nie je toxická. Je zmývatelné vodou, alebo z hlediska koroznosti je jeho prítomnosť na spájkovanom spoji zaneóbateťná a neškodná.It eliminates the technological complexity of the production of fluxes of the prior art, reducing the economic demands 1 . Flux filling, resp. the flux has a high stability, the concentration of its exhaldt from the process heat is not toxic. It is washable with water, or in terms of corrosion, its presence on the solder joint is negligible and harmless.
Je nekorózne.It's non-corrosive.
Skúšky v jednom případe prebiehali s tnvivovými náplněmi, resp. tavivomi v množstve 90 až 98% hmot. polyetylénglykolu a 2 až 10 % hmot. kyseliny soťnej, alebo fluorovodíkovej, alebo anilínhyórochloridu.Tests in one case were conducted with tnvivovými fillings, respectively. 90 to 98 wt. % polyethylene glycol and 2 to 10 wt. hydrochloric or hydrofluoric acid, or aniline hydrochloride.
Vlastr.ú spojka mola složer.ie Sn6OP24O, resp. Sn631b37. Skúšky os týkali tavivovej r.óplre v trubičko spájky, resp. samostatného taviva vo formě roztoku s pc-užitím na tekvtcj vine spájky, resp. použitia v podmienkach strojárskeho (klampicrskeho) spájkovania. Pracovní' teplota bola 193 až 230 °C. Použité boli technologie: spájkovačkou, no tekutej vine.Sn6OP24O, resp. Sn631b37. Tests of axes concerned flux r.óplre in solder tube, respectively. of a separate flux in the form of a solution with the use of solder, respectively. use in mechanical (flip-flop) soldering conditions. The working temperature was 193-230 ° C. The technologies used were: solder, but liquid guilt.
S použitím známých taviv no báze kolofónie (napr. FB 12-11) sa dosiahla prieraerná roztekavosť E = 120 mm2 /Cu) a R = 80 mm2 (Ms). Korózia zvyškov taviva po spájkovaní bola: vodivost' vodného výluhu 340 až 470 us.cm-'1', množstvo rozpustných kyselin vo vodě sa pohybovalo v množstve od 14 do 78 mg.l-·1', čistota dosák plošných spojov bo1a v rozpatí 0,60 až 1,05 ug NaCl.cm“ . Vodorozpustnosť: skúšané tavivá boli nerozpustné. Hygienické hodnotenie: dymnatosť - tavivá dávajú rozkladné toxické pyrolytické produkty aldehydického charakteru, pričom rozklad začína už pri 180 °C,Using known rosin-based fluxes (e.g. FB 12-11), an average flowability of E = 120 mm 2 / Cu and R = 80 mm 2 (Ms) was achieved. The corrosion of the flux residues after soldering was: conductivity of the aqueous extract 340-470 us.cm - 1 , the amount of soluble acids in the water ranged from 14 to 78 mg.l - 1 , purity of the printed circuit boards bo1a in the range 0.60 to 1.05 µg NaCl.cm '. Water solubility: the fluxes tested were insoluble. Hygienic evaluation: smoke - fluxes give decomposition toxic toxic pyrolytic products of aldehyde character, the decomposition starts already at 180 ° C,
Při použití tavivovej náplně, resp. taviva podťa aktuálneho predmetu vynálezu, so dosiahla priememá roztekavosť R = 345 mm2 (Cu) a R = 138 mm2 (Me). Ebrózia zvyškov taviva po spájkovaní bola následovná: vodivost? vodného výluhu 185 až 195 us.cm-^, množstvo rozpustných kyselin vo vodě 1,29 mg.l“\ čistota dosák plošných spojov dosaΛ hovala hodn3t nižších ako 0,5 ug NaCl.cm“ . Vodorozpustnosť: veťmi dobrá už od 10 °C.When using a flux filler, resp. According to the present invention, an average flowability of R = 345 mm 2 (Cu) and R = 138 mm 2 (Me) was achieved. Erosion of flux residues after soldering was as follows: conductivity? water extract 185-195 us.cm - ^, the amount of the water-soluble acid 1.29 mg · l "\ pure circuit boards dosaΛ hova hodn3t below 0.5 ug NaCl.cm". Water solubility: very good from 10 ° C.
Hygienické hodnotenie: znížená dymnatosť (cca 50% hodnoty známých taviv a tavivových náplní), stabilita až do teploty 325 °C. Mechanická pevnost’ bola uchovaná v plnej miere. Elektrická vodivost’ spojov bola buó plné uchovaná, alebo sa mierne zlepšila (0 0,2%).Hygienic evaluation: reduced smoke density (approx. 50% of the value of known fluxes and fluxes), stability up to 325 ° C. The mechanical strength ’has been fully preserved. The electrical conductivity of the connections was either fully maintained or slightly improved (0 0.2%).
CS 274366 BlCS 274366 Bl
Vynález je využitelný pri všetkých druhoch raakkého spájkovania (aj ako přídavná spájka), najma však ako tavivová náplň měkkých trubičkových epájok, a to pre celá šířku typov spájok a ich použitia.The invention is applicable to all types of soldering (also as an additional solder), but in particular as a flux filler for soft tube solders, for a wide range of solder types and applications.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS874688A CS274366B1 (en) | 1988-12-27 | 1988-12-27 | Flux filling on snpb base for tube solders |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS874688A CS274366B1 (en) | 1988-12-27 | 1988-12-27 | Flux filling on snpb base for tube solders |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CS874688A1 CS874688A1 (en) | 1990-09-12 |
| CS274366B1 true CS274366B1 (en) | 1991-04-11 |
Family
ID=5438475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CS874688A CS274366B1 (en) | 1988-12-27 | 1988-12-27 | Flux filling on snpb base for tube solders |
Country Status (1)
| Country | Link |
|---|---|
| CS (1) | CS274366B1 (en) |
-
1988
- 1988-12-27 CS CS874688A patent/CS274366B1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CS874688A1 (en) | 1990-09-12 |
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