CS274365B1 - Flux filling on snpb base for tube solders - Google Patents
Flux filling on snpb base for tube solders Download PDFInfo
- Publication number
- CS274365B1 CS274365B1 CS874588A CS874588A CS274365B1 CS 274365 B1 CS274365 B1 CS 274365B1 CS 874588 A CS874588 A CS 874588A CS 874588 A CS874588 A CS 874588A CS 274365 B1 CS274365 B1 CS 274365B1
- Authority
- CS
- Czechoslovakia
- Prior art keywords
- soldering
- solder
- snpb
- flux filling
- flux
- Prior art date
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- 230000004907 flux Effects 0.000 title claims abstract description 27
- 229910000679 solder Inorganic materials 0.000 title abstract description 23
- 238000005476 soldering Methods 0.000 claims abstract description 16
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 6
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 5
- 229910007116 SnPb Inorganic materials 0.000 claims abstract description 5
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 231100000252 nontoxic Toxicity 0.000 abstract description 2
- 230000003000 nontoxic effect Effects 0.000 abstract description 2
- 238000009428 plumbing Methods 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 abstract 1
- 239000002529 flux (metallurgy) Substances 0.000 description 9
- 239000000945 filler Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 231100000331 toxic Toxicity 0.000 description 3
- 230000002588 toxic effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000004870 electrical engineering Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 239000012190 activator Substances 0.000 description 1
- 239000006286 aqueous extract Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Tevivové náplň makkých trubičkových spájok na bázi SnPb ( Tevivové náplň měkkých trubičkových spájok nn bázi Cnl'b je určená nejma na spáj?-;ovanie vo formě trubičkovej spájky v spojení 3 vhodným a běžným zdrojon tepla. Vo formě roztoku je dobře použitelná aj no. spájkovanie napr. dosák plošných spojov tekutou vlr.ou spájky a v pevnej forae, alebo vo formě roztoku je použitelná tiež no strojárske (klsmpiarske) spájkovanie běžných materiálov.Cnl'b low-voltage solder cartridges based on SnPb-based soft-solder cartridges are intended, in particular, for soldering in the form of tubular solder in conjunction with a suitable and common heat source. soldering, for example, printed circuit board by liquid wave solder and in solid form or in the form of a solution, it is also possible to use mechanical soldering of common materials.
Podstato tovivovej náplně spočívá v tóra, že hlovná zložka je založená no esterifikovanora vysokomolekulérnom alkohole, pólyetylénglykole, v spojení s kyselinou fosforečnou a etylénoxydora.The essence of the stuffing consists in the Torah that the gaseous component is based on the esterification of a high molecular weight alcohol, polyethylene glycol, in conjunction with phosphoric acid and ethyleneoxydora.
Zlepšuje roztekovosť spájky, aá vyššiu tepelná stabilitu, širšie použitie, pri spájkovaní je netoxická.It improves solder spacing, higher thermal stability, wider use and is non-toxic when soldering.
274 365 (11) (13) 31 (51) Int. CI?274 365 (11) (13) 31 (52) Int. CI?
25 £ 25/353 3 23 K 35/36225 £ 25/353 3 23 K 35/362
CS 274365 BlCS 274365 Bl
-V-IN
Vynález sa týká tavivovej náplně měkkých trubičkových spájok na bázi SnPb, pre spájkovanie v elektrotechnike a v elektrotechnickou! priemysle, ako aj pře strojárske spájkovanie.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flux filler of SnPb-based soft tube solders for soldering in electrical engineering and electrical engineering. as well as mechanical soldering.
Doposial' sú známe tavivové náplně trubičkových spájok na bázi SnPb, alebo aj samostatné tavívá, skladojúce sa spravidla z čistéj kolofónie, alebo zo zmesi kolofónie s chemickými zlúčeninami, zvyšujúcimi najme účinnost' čistiaceho procesu v priebehu spájkovonio, resp. zlepšujúcimi difúzne podmienky. Tieto chemické zlúčeniny e ich produkty majú aj negativno sprievodné znaky: zvýšenie korózneho vplyvu na časti spájkovaného spoja, náklady na jeho čistenie od zvyškov taviva, hygienická a ekologická závadnosť čÍ3tiacich látok, ako aj vlastnej základnej zložky, kolofónie, alebo tiež neželatel'ný vplyv na životné procesy za účasti áalších nepřijatelných chemických látok (reon).So far, flux fillers of SnPb-based tube solders or separate fluxes are known, consisting generally of a pure rosin or of a mixture of a rosin with chemical compounds, in particular increasing the efficiency of the purification process during soldering or brazing. improving diffusion conditions. These chemical compounds and their products also have negative side-effects: increasing the corrosive effect on the solder joint parts, the cost of cleaning it from the flux residues, the hygienic and ecological defect of the cleaning agents as well as its own constituent, rosin, or unwanted effect on life processes involving other unacceptable chemicals (reon).
Podstata tavivovej náplně měkkých trubičkových spájok, resp. samostatného taviva na spájkovanie makkými spájkami na bázi SnPb, spočívá v tom, že obsahuje polyetylénglykol v množstve 10 až 80% hmot., kyselinu fosforečná V množstve 1 až 10% hmot., a etylénozyd v množstve 10 až 89% hmot.The essence of the flux filling of soft tube solders, resp. It consists of polyethylene glycol in an amount of 10 to 80% by weight, phosphoric acid in an amount of 1 to 10% by weight, and ethylenozyd in an amount of 10 to 89% by weight.
Hlavr.é výhody tavivovej náplně měkkých trubičkových spájok, resp. samostatného taviva, spočívajú v tom, že hlavná zložka taviva je založená na esterifikovanom vysokomolekulárnom alkohole, ktorý preberá funkciu tenzidů, detergentů a spenovadla a v spojení s kyselinou fosforečnou o etylénoxydom, ako aktivátormi, tiež funkciu ochrany povrchu spájkovaného materiálu a spájky a funkcie podpory detergencie u hlavnej složky.The main advantages of the flux filling of soft tube solders, resp. The main component of the flux is based on an esterified high molecular weight alcohol, which assumes the function of surfactants, detergents and a foaming agent, and in conjunction with phosphoric acid with ethylene oxide as activators, as well as the surface protection of soldered material and solder and detergency support function. main component.
Vylučuje technologické zložitosti výroby taviv doposial' známých koncepcií, znižuje ekonomická náročnost'. Tavivová náplň. resp. tavivo má vysokú stálosť, koncentrácia jeho exhalátov za technologického tepla nie je toxická.. Je zmývatelVié vodou, alebo z hl'adiaka koróznosti je jeho přítomnost' na spájkovanom spoji zanedbatelná a neškodná. Je nekorózne.It eliminates the technological complexities of the production of fluxes of the previously known concepts, reducing economic demands. Flux filling. respectively. the flux has a high stability, the concentration of its exhalates under technological heat is not toxic. It is washable with water, or because of corrosion, its presence on the solder joint is negligible and harmless. It's non-corrosive.
SkúSky v jednom případe prebiehali s tavivovými náplňami, resp. tavivami v množstve 10 až 80% hmot. polyetylénglykolu, 1 až 10% hmot. kyseliny fosforečnej a 10 až 89% hmot. etylénoxydu.In one case, the tests were carried out with fluxes, respectively. % fluxes in an amount of 10 to 80 wt. % polyethylene glycol, 1 to 10 wt. % phosphoric acid and 10 to 89 wt. of ethylene oxide.
Vlastná spájka mala zloženie Sn6OPb4O, resp. Sn63Pb37. Skúšky ss týkali tavivovej r.áplne v trubičke spájky, resp. samostatného taviva vo formě roztoku s použitím na tekutej vine spájky, resp. použitia v podmienkach strojárskeho (klampiarskeho) spájkovar.ia. Pracovně teplota bola 195 až 280 °C. Použité boli technologie: spájkovačkou na tekutej vine.The solder itself had the composition Sn6OPb4O, respectively. Sn63Pb37. The tests concerned the flux filler in the solder tube, respectively. a separate flux in the form of a solution using a liquid brazing solder, respectively. use under mechanical (plumbing) soldering conditions. The working temperature was 195 to 280 ° C. The technologies used were liquid soldering iron.
S použitím známých taviv na báze kolofónie (napr. FB 12-11) sa dosiahla priemerná roztekavosť 5 = 120 mm3 (Cu) o E = 80 mm3 (Ms). Korózia zvyškov taviva po spájkovaní bole: vodivost1 vodného výluhu 340 až 470 us.cm“1, množstvo rozpustných kyselin vo vodě sa pohybovalo v množstve od 14 do 78 mg.l“\ čistota dosák plošných spojov bola v rozo pátí 0,60 až 1,05 ug NaCl.cm-'. Vodorozpustnosť: Skúšané tavivá boli nerozpustné. Hygienické hodnotenie: dymnatosť - tavivá dávajú rozkladné toxické pyrolytické produkty aldehydického charakteru, pričom rozklad začíno už pri 180 °C.Using known rosin-based fluxes (e.g. FB 12-11) an average flow rate of 5 = 120 mm 3 (Cu) of E = 80 mm 3 (Ms) was achieved. Corrosion of flux residues after brazing: conductivity 1 of aqueous extract 340 to 470 us.cm -1 , the amount of soluble acids in the water ranged from 14 to 78 mg.l "\ cleanliness of printed circuit boards ranged from 0.60 to 1.05 ug NaCl.cm - '. Water Solubility: The fluxes tested were insoluble. Hygienic evaluation: smoke - fluxes give decomposition toxic toxic pyrolytic products of aldehyde character, the decomposition starts already at 180 ° C.
Pri použiti tavivovej náplně, resp. taviva podl’a aktuálneho předmětu vynálezu, sa 2 2 dosiahla priemerná roztekavosť E = 385 mm (Cu) a E = 172 mm (Ms). Korózia zvyškov taviva po spájkovaní bola následovně: vodivost1 vodného výluhu 182 až 195 us.cm-\ množstvo rozpustných kyselin vo vodě 1,28 mg.l-1, čistota dosák plošných spojov dosahovala hodnot nižších ako 0,5 ug NaCl.cm-2. Vodorozpustnosť: vel'mi dobrá už od 10 °C. Hygienické hodnotenie: znižená dymnatosť (cca 50% hodnoty známých taviv a tavivových náplní), stabilito až do teploty 325 °C. Mechanická pevnost’ bola uchovaná v plnej miere.When using flux filler, resp. According to the present invention, an average flow rate of E = 385 mm (Cu) and E = 172 mm (Ms) was achieved. The corrosion of the flux residues after soldering was as follows: conductivity 1 of aqueous leachate 182 to 195 us.cm - \ quantity of soluble acids in water 1.28 mg.l -1 , the purity of printed circuit boards reached values lower than 0.5 µg NaCl.cm - 2 . Water solubility: very good from 10 ° C. Hygienic evaluation: reduced smoke density (approx. 50% of the value of known fluxes and fluxes), stability up to 325 ° C. The mechanical strength was fully maintained.
CS 274365 BlCS 274365 Bl
Elektrická vodivost’ spojov bola buň plné uchovaná, alebo sa mierne zlepšilo (0 0,2%).The electrical conductivity of the connections was fully maintained or improved slightly (0 0.2%).
Vynález je využitelný pri vSetkých druhoch měkkého spájkovania (aj ako přídavná spájka), najma však ako tavivová náplň měkkých trubičkových spájok, a to pre celá šířku typov spájok a ich použitia.The invention is applicable to all types of soft soldering (also as an additional solder), but in particular as a flux filler for soft tube solders, for the full range of solder types and their applications.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS874588A CS274365B1 (en) | 1988-12-27 | 1988-12-27 | Flux filling on snpb base for tube solders |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS874588A CS274365B1 (en) | 1988-12-27 | 1988-12-27 | Flux filling on snpb base for tube solders |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CS874588A1 CS874588A1 (en) | 1990-09-12 |
| CS274365B1 true CS274365B1 (en) | 1991-04-11 |
Family
ID=5438462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CS874588A CS274365B1 (en) | 1988-12-27 | 1988-12-27 | Flux filling on snpb base for tube solders |
Country Status (1)
| Country | Link |
|---|---|
| CS (1) | CS274365B1 (en) |
-
1988
- 1988-12-27 CS CS874588A patent/CS274365B1/en unknown
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| Publication number | Publication date |
|---|---|
| CS874588A1 (en) | 1990-09-12 |
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