CS274367B1 - Flux filling on snpb base for tube solders - Google Patents
Flux filling on snpb base for tube solders Download PDFInfo
- Publication number
- CS274367B1 CS274367B1 CS874788A CS874788A CS274367B1 CS 274367 B1 CS274367 B1 CS 274367B1 CS 874788 A CS874788 A CS 874788A CS 874788 A CS874788 A CS 874788A CS 274367 B1 CS274367 B1 CS 274367B1
- Authority
- CS
- Czechoslovakia
- Prior art keywords
- soldering
- solder
- flux
- snpb
- flux filling
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 21
- 230000004907 flux Effects 0.000 title abstract description 26
- 238000005476 soldering Methods 0.000 claims abstract description 13
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910007116 SnPb Inorganic materials 0.000 claims abstract description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 5
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000000945 filler Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 abstract description 2
- 238000009428 plumbing Methods 0.000 abstract description 2
- 150000002191 fatty alcohols Chemical class 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 231100000252 nontoxic Toxicity 0.000 abstract 1
- 230000003000 nontoxic effect Effects 0.000 abstract 1
- 239000002529 flux (metallurgy) Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000006286 aqueous extract Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Vynález aa týká tavivovej náplně měkkých trubičkových spájok na bázi SnPb, pre spájkovanie v elektrotechnike a v elektrotechnickom priemysle, ako aj pre strojárske spájkovanie.The invention aa relates to a flux filling of SnPb-based soft tube solders for soldering in the electrical and electrical industries as well as for mechanical soldering.
Doposiaí’ sú známe tavivová náplně trubičkových spájok na bázi SnPb, alebo aj samostatné tavivá, skládájúce sa spravidla z čistéj kolofónie, alebo zo zmesi kolofónie s chemickými zlúčeninami, zvyšujúcimi najma účinnosť čistiaceho procesu v priebehu spájkovania, resp. zlepšujúcimi difúzne podmienky. Tieto chemické zlúčeniny a ich produkty majú aj negativné sprievodné znaky: zvýSenie korózneho vplyvu na časti spájkovaného spoja, náklady na jeho čistenie od zvyškov taviva, hygienická a ekologická závodnost) čiatiacich látok, ako aj vlastněj základnéj zložky, kolofónie, alebo tiež neželatďný vplyv no životné procesy za účasti ňalších nepřijatelných chemických látok (freon).So far, flux fillers of SnPb-based tube solders or separate fluxes are known, generally consisting of a pure rosin or a mixture of rosin and chemical compounds, in particular increasing the efficiency of the cleaning process during soldering or brazing. improving diffusion conditions. These chemical compounds and their products also have negative accompanying features: increasing the corrosive effect on the solder joint parts, the cost of cleaning it from flux residues, hygienic and ecological competency) of the cleaning agents, as well as the actual constituent, rosin, or unwanted environmental impact. processes involving other unacceptable chemicals (freon).
Podstata tavivovej náplně měkkých trubičkových spájok, resp. samostatného taviva na spájkovanie měkkými spéjkami na bázi SnPb, spočívá v tom, že obsahuje etylénoxyd v množstve 90 až 99% hmot. o kyselinu fosforečná v množstve 1 až 10% hmot.The essence of the flux filling of soft tube solders, resp. a separate SnPb-based soft solder flux comprising 90 to 99% by weight ethylene oxide. % phosphoric acid in an amount of 1 to 10 wt.
Hlavně výhody tavivovcj náplně měkkých trubičkových spájok, resp. samostatného taviva, spočívajú v tom, že hlavná zložka taviva je zeložená na esterifikovanom neionogennom vyššom maetnom alkohole, ktorý preberá funkciu tenzidu, detergentu a speňovaólo a v spojeni s kyselinou fosforečnou, ako aktivátorom tiež funkciu ochrany povrchu spájkovaného materiálu a spájky.In particular, the advantages of the flux filler of soft tube solders, respectively. The main component of the flux is greened on an esterified non-ionic, higher alcohol, which assumes the function of a surfactant, a detergent and a foaming agent, and in conjunction with phosphoric acid as an activator, also a function of protecting the solder material and solder.
Vylučuje technologické zložitosti výroby taviv doposiaí’ známých koncepcií, snižuje ekonomická náročnosť. Tavivová náplň, resp. tavivo má vysokú stálosť koncentrácie jeho exhalátov za technologického tepla nie je toxické. Je zmývateťné vodou, alebo z híadiska koróznosti je jeho přítomnost' na spájkovanom spoji zanedbateťná a neškodná.It eliminates the technological complexities of flux production up to now known concepts, reducing economic demands. Flux filling, resp. the flux has a high stability of the concentration of its fumes at the technological heat is not toxic. It is washable with water, or its presence on the solder joint is negligible and harmless in terms of corrosion.
Je nekorózne.It's non-corrosive.
Skúšky v jednom případe prebiehali s tavivovými néplňami, resp. tavivami v množstve 90 ež 99% hmot. etylénoxydu a 1 až 10% hmot. kyseliny fosforečnej.In one case, the tests were carried out with flux fillers, respectively. % fluxes in the range of 90 to 99 wt. % of ethyleneoxyde and 1 to 10 wt. phosphoric acid.
Vlastná spájka mala zloženie Sn6OPb4O, resp. Sn63Pb37. Skúšky sa týkali tavivovej náplně v trubičke spájky, reep. samostatného taviva vo formě roztoku s použitím na tekutej vine spájky, resp. použitia v podmienkach strojárskeho (klampiarskeho) spájkovania. Pracovně teplota bola 195 až 280 °C. Použité boli technologie: epájkovačkou, na tekutej vine.The solder itself had the composition Sn6OPb4O, respectively. Sn63Pb37. The tests concerned the flux in the solder tube, reep. a separate flux in the form of a solution using a liquid brazing solder, respectively. for use in mechanical (plumbing) soldering conditions. The working temperature was 195 to 280 ° C. The technologies used were: soldering iron, liquid wine.
S použitím známých taviv na báze kolofónie (napr. FB 12-11) aa dosiahla priemerp p t ná roztekavosť R - 120 mm (Cu) a R = 80 mm (Ms). Kbrozia zvyškov taviva po spájkovaní bola: vodivost’ vodného výluhu 340 až 470 us.cm~\ množstvo rozpustných kyselin vo vodě sn pohybovalo od 14 do 78 mg.l-\ čistota dosák plošných spojov bola v rozpětí 0,60 až 1,05 ug NaCl.cm . Vodorozpustnosť: skúšané tavivá boli nerozpustné. Hygienické hodnotenie: dymnatost1 - tavivá dávajú rozkladné toxické pyrolytické produkty aldehydického charakteru, pričom rozklad začína už při 180 °C.Using the known fluxes rosin (e.g. FB 12-11) and on reaching priemerp P T to R flowability - 120 mm (Cu), and R = 80 mm (MS). The amount of soluble acids in water ranged from 14 to 78 mg.l - the purity of the printed circuit boards ranged from 0.60 to 1.05 µg. NaCl.cm. Water solubility: the fluxes tested were insoluble. Hygienic evaluation: Smokiness 1 - fluxes give decomposition of toxic pyrolytic products of aldehyde character, the decomposition starts at 180 ° C.
Pri použití tnvivovej náplně, resp. tavivo podťa aktuálneho predmetu vynálezu sa p p dosiahla priememá roztekovosť R = 380 mm (Cu) o R = 175 mm (Ms). Korózia zvyškov taviva po spájkovaní bola následovně: vodivost' vodného výluhu 192 us.cm-1, množstvo rozpustných kyselin vo vodě 1,29 mg.I-1, čistota dosák plošných spojov dosahovala hodnot nižších ako 0,5 ub NoCl.cm-“. Vodorozpustnosť: velmi dobrá už od 10 °C. Hygienické hodnotenie: znížená dymnatost/ (cca 60% hodnoty známých taviv o tavivových náplní), stabilita už čo teploty 300 °C. Mechanická pevnost' bola uchovaná v plnej miere. Elektrická vodivost’ spojov bola buň plné uchovaná, alebo so mierne zlepšila (0 0,2%).When using tnvivovej filling, respectively. flux according to the present invention, pp achieved an average pitch R = 380 mm (Cu) of R = 175 mm (Ms). The corrosion of the flux residues after soldering was as follows: conductivity of the aqueous extract 192 us.cm -1 , the amount of soluble acids in water 1.29 mg.I -1 , the cleanliness of the printed circuit boards was less than 0.5 µb NoCl.cm - " . Water solubility: very good from 10 ° C. Hygiene evaluation: reduced smoke / (approx. 60% of known fluxes of flux fillers), stability as low as 300 ° C. The mechanical strength was fully maintained. The electrical conductivity of the connections was fully maintained or slightly improved (0 0.2%).
Vynález je využiteťný pri všetkých druhoch měkkého spájkovania (aj ako přídavnáThe invention is applicable to all kinds of soft soldering (also as an additional
C3 27436 31 spájka), najma však ako tavivová náplň měkkých trubičkových opájok a to pre celá šířku typov spájok a ich použitie.C3 27436 31 solder), but in particular as a flux filler for soft tube solders for the entire width of solder types and their use.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS874788A CS274367B1 (en) | 1988-12-27 | 1988-12-27 | Flux filling on snpb base for tube solders |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS874788A CS274367B1 (en) | 1988-12-27 | 1988-12-27 | Flux filling on snpb base for tube solders |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CS874788A1 CS874788A1 (en) | 1990-09-12 |
| CS274367B1 true CS274367B1 (en) | 1991-04-11 |
Family
ID=5438489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CS874788A CS274367B1 (en) | 1988-12-27 | 1988-12-27 | Flux filling on snpb base for tube solders |
Country Status (1)
| Country | Link |
|---|---|
| CS (1) | CS274367B1 (en) |
-
1988
- 1988-12-27 CS CS874788A patent/CS274367B1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CS874788A1 (en) | 1990-09-12 |
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