CS274368B1 - Flux filling on snpb base for tube solders - Google Patents
Flux filling on snpb base for tube solders Download PDFInfo
- Publication number
- CS274368B1 CS274368B1 CS874888A CS874888A CS274368B1 CS 274368 B1 CS274368 B1 CS 274368B1 CS 874888 A CS874888 A CS 874888A CS 874888 A CS874888 A CS 874888A CS 274368 B1 CS274368 B1 CS 274368B1
- Authority
- CS
- Czechoslovakia
- Prior art keywords
- solder
- soldering
- flux
- snpb
- solders
- Prior art date
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- 230000004907 flux Effects 0.000 title claims abstract description 33
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 29
- 238000005476 soldering Methods 0.000 claims abstract description 15
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000005711 Benzoic acid Substances 0.000 claims abstract description 6
- 229910007116 SnPb Inorganic materials 0.000 claims abstract description 6
- 235000010233 benzoic acid Nutrition 0.000 claims abstract description 6
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000000945 filler Substances 0.000 claims description 9
- 238000005219 brazing Methods 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 3
- 230000000717 retained effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 3
- 238000009428 plumbing Methods 0.000 abstract description 3
- 150000002191 fatty alcohols Chemical class 0.000 abstract description 2
- 231100000252 nontoxic Toxicity 0.000 abstract description 2
- 230000003000 nontoxic effect Effects 0.000 abstract description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 abstract 2
- 239000012530 fluid Substances 0.000 abstract 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 abstract 1
- 229960004889 salicylic acid Drugs 0.000 abstract 1
- 239000002529 flux (metallurgy) Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- JXQCUCDXLSGQNZ-UHFFFAOYSA-N 3-tert-butyl-2-hydroxy-6-methylbenzoic acid Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1C(O)=O JXQCUCDXLSGQNZ-UHFFFAOYSA-N 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000006286 aqueous extract Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- -1 η ? Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
(57) Tavivová náplň makkých trubičkových spájok na bázi SnPb je určená najma na spájkovanie vo formě trubičkovej spájky v spojení s vhodným a běžným zdrojom tepla. Vo formě roztoku je dobré použitelná aj na spájkovanie napr. dosák plošných spojov tekutou vlnou spájky a v pevnej formě roztoku je použiteťná tiež na strojárske (klampiarske) spájkovanie běžných materiálov.(57) The flux filler of SnPb based flux cored solder is intended, in particular, for flux-cored soldering in conjunction with a suitable and conventional heat source. In the form of a solution, it is also suitable for soldering e.g. printed circuit board with liquid wave solder and solid solution is also useful for mechanical (plumbing) soldering of common materials.
Podstata tavivovej náplně spočívá v tom, 2e hlavná zložka je založená na esterifikovanom neionogennom vyššom mastnom alkohole, etylénoxyde, v spojení s kyselinou benzoovou, alebo s kyselinou sóly cilovou.The essence of the flux filler is that the main component is based on an esterified nonionic, higher fatty alcohol, ethyleneoxyde, in conjunction with benzoic acid or tartaric acid.
Zlepšuje roztekavo3t’ spájky, ná vyššiu tepelnú stabilitu, širšie použitie; pri spájkovaní je netoxická.Improves solder flow, higher thermal stability, wider use; it is nontoxic when soldering.
274 368 (11) (13) Bl (51) Int. Cl.5 274 368 (11) (13) Bl (51) Int. Cl. 5
B 23 K 35/353 B 23 K 35/362B 23 K 35/353
CS 274368 BlCS 274368 Bl
Vynález, sn týká tnvivovej náplně makkých trubičkových spájok na bázi SnPb, pře spájkovnnie v elektrotechnike a v elektrotechnickou] priemysle, ako oj pre strojórske spájkovonie.The present invention relates to a flux-based filler of SnPb-based, flux cored solder solders, for brazing in the electrical and electrical industries, as a drawbar for machine brazing.
ΒοροΒΐδΐ' sá známe tavivové náplně trubičkových spájok na bázi SnPb, alebo aj samostatné tavivá, skladajúce so 3providla z čistej kolofónie, alebo zo zmesi kolofónie s chemickými sláčer.inami, zvyšujúcimi najma účinnost’ čistiaceho procesu v priebehu spájkovania, resp. zlepšujácimi difúzne podmienky. Tieto chemické zlúčeniny’ a ich produkty majú aj negativné sprievodné znaky: zvýšenie korózneho vplyvu no časti apájkovoného spoja, náklady na jeho čistenie od zvyškov taviva, hygienická a ekologická závadnosť čistiacich látok, oko aj vlastnej základnéj zložky, kolofónie, alebo tiež neželateťný vplyv na životné procesy za účasti ňalších nepřijatelných chemických látok (freon).ZnámeοροΒΐδΐ 'are known flux cartridges of SnPb-based tubular solders, or even separate fluxes consisting of pure rosin or a mixture of rosin and chemical compounds, increasing in particular the efficiency of the cleaning process during soldering or brazing. improving diffusion conditions. These chemical compounds and their products also have negative accompanying features: increasing the corrosive effect of the part and solder joint, the cost of cleaning it from the flux residues, the hygienic and ecological defect of the cleaning agents, the eye and its own constituent, rosins, or processes involving other unacceptable chemicals (freon).
Podstata tavivovej náplně makkých trubičkových spájok, resp. samostatného tavivo na spójkovonie makkými spájkami na bázi SnPb, spočívá v tom, že obsahuje etylénoxyd v množstve 80 až 95% hmot. a kyselinu benzoová, alebo kyselinu salycilová v množstve 5 až 20% hmot.The essence of the flux filler of macerol solder tubes, resp. A separate solder flux based on SnPb based brazing solders is characterized in that it contains ethyleneoxy in an amount of 80 to 95% by weight. and benzoic acid or salycilic acid in an amount of 5 to 20 wt.
Hlavné výhody tavivovej náplně makkých trubičkových spájok, resp. samostatného taviva, spočívajú v tom, že hlavná zložka tavivo je založená na esterifikovanom neionogennom vyššom mostnora alkohole, ktorý preberá funkciu tenzidu, detergentu a speňovodla s nižším opeňovacím efektom, o v spojení s kyselinou benzoovou, alebo kyselinou salycilovou, oko aktivétorom, tiež funkciu ochrany povrchu spéjkovaného materiálu a spájky a funkciu podpox-y hlavnej zložky taviva.The main advantages of the flux filler of the flux cored solder, respectively. The main component of the flux is based on an esterified non-ionic higher alcohol bridgehead, which assumes the function of a surfactant, a detergent and a foaming agent with a lower foaming effect, in conjunction with benzoic acid or salycilic acid, eye activator, as well as surface protection function. of the sintered material and solder; and the function of the main flux component.
Vylučuje technologické zložitosti výroby taviv doposial’ známých koncepcí, znižuje ekonomická náročnost'. Tavivová náplň, resp. tavivo má vysoká stálost1, koncentrácia jeho exhalátov za technologického tepla nie je toxická. Je zmývateťné vodou, alebo z hladiska koróznosti je jeho přítomnost' na spájkovanom spoji zanedbatelná a neškodná. Je nekorózne.It eliminates the technological complexities of the production of fluxes of the previously known concepts, reducing economic demands. Flux filling, resp. the flux has a high stability of 1 , the concentration of its fumes at the technological heat is not toxic. It is washable with water, or because of its corrosion, its presence on the solder joint is negligible and harmless. It's non-corrosive.
Skášky v jednom případe prebiehali s tavivovými náplňami, resp. tavivami v množstve 80 až 95% hmot. etylénoxydu a 5 až 20% hmot. kyseliny benzoovej, alebo kyseliny salycilovej.In one case, jumps were conducted with fluxes, respectively. % fluxes in an amount of 80 to 95 wt. % of ethyleneoxyde and 5 to 20 wt. benzoic acid or salycilic acid.
Vlastná spájka mala zloženie Sn60Pb40, resp. Sn63Pb37. Skášky sa týkali tavivovej náplně v trubičke spájky, resp. samostatného taviva vo formě rozteče 8 použitím no tekutá j vine spájky, resp. použitia v podmienkach strojárskeho (klampiarskeho) spájkovania. Prncovná teploto bola 195 až 280 °G. Použité b-íli technologie: spájkovačkou, η?, tekutej vine.Own solder had composition Sn60Pb40, respectively. Sn63Pb37. The jumps concerned the flux in the solder tube, respectively. of a separate flux in the form of a pitch 8 using a no-liquid solder, respectively. for use in mechanical (plumbing) soldering conditions. The initial temperature was 195-280 ° C. Used b-white technology: soldering iron, η ?, liquid wine.
použitím známých taviv na báze kolofónie (napr. FB 12-11) sa dosiahla priemerná roztekavosť R = 120 mm (Cu) a S = 80 mm tMs). Korozia zvyškov taviva po spájkovaní bola: vodivost' vodného výluhu 340 ež 470 us.cm-1, množstvo rozpustných kyselin vo vod·' sn pohybovalo v množstve od 14 do 78 mg.l1, čistota dosák plošných spojov bola v rozpatí 0,60 až 1,05 ug NaCl.ca . Vodorozpustno3lJ: skášaná tavivá boli nerozpustné. Hygienické hodnotenie: dymnatosť- tavivá dávnjá rozkladné toxické pyrolytické produkty aldehydického charakteru, pričom rozklad začína už pri 180 °C.using known rosin-based fluxes (e.g. FB 12-11), an average flow rate of R = 120 mm (Cu) and S = 80 mm tMs) was achieved. The corrosion of the flux residues after soldering was: conductivity of the aqueous extract 340 to 470 us.cm -1 , the amount of soluble acids in the water ranged from 14 to 78 mg.l 1 , the purity of the printed circuit boards was in the range of 0.60 up to 1.05 µg NaCl.ca. Water-soluble fluxes to be tested were insoluble. Hygiene evaluation: fuming-fluxes of ancient toxic pyrolytic decomposition products of aldehydic character, the decomposition begins at 180 ° C.
Při použití tavivovej náplně, resp. taviva podťa aktuálneho predmetu vynálezu sa dosiahla priemerná roztekavosť R = 375 mm2 (Cu) a R = 170 mra3 (Ms). korózia zvyškov taviva po spájkovaní bola nasledovná: vodivost' vodného výluhu 190 us.cm1, množstvo rozpustných kyselin vo vodě 1,29 mg.l-1, čistota dosák plošných spojov dosahovala hodnot nižších ako 0,5 ug NuCl.cra2. Vodorozpustnosť: veťmi dobré už od 10 °C. Hygienické hodnotenie: znížená dymnatosť (cca 58% hodnoty známých taviv a tavivových náplní),When using a flux filler, resp. According to the present invention, an average flow rate of R = 375 mm 2 (Cu) and R = 170 mra 3 (Ms) was achieved. corrosion of flux residues after soldering were as follows: conductivity of the water extract 190 us.cm 1, the amount of water-soluble acid of 1.29 mg · l -1, the purity of the circuit boards reaching values of less than 0.5 ug NuCl.cra second Water solubility: very good from 10 ° C. Hygiene evaluation: reduced smoke (approx. 58% of the value of known fluxes and fluxes),
CS 274368 Bl stabilita ož do teploty 300 °C. Mechanická pevnost1 bola uchovaná v plnej miere. Elektrická vodivost' spojov bola buň plné uchovaná, alebo sa mieme zlepšila (0 0,2%).CS 274368 B1 stability up to 300 ° C. Mechanical strength 1 was fully maintained. The electrical conductivity of the connections was fully maintained or slightly improved (0 0.2%).
Vynález je využiteťný při všetkých druhoch měkkého spájkovania (aj ako přídavná spájka), najmě však ako tavivová náplň měkkých trubičkových spájok a to pře celá šířku typov spájok a ich použitia.The invention is applicable to all kinds of soft soldering (also as an additional solder), but in particular as a flux filler for soft tube solders over a wide range of solder types and their applications.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS874888A CS274368B1 (en) | 1988-12-27 | 1988-12-27 | Flux filling on snpb base for tube solders |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS874888A CS274368B1 (en) | 1988-12-27 | 1988-12-27 | Flux filling on snpb base for tube solders |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CS874888A1 CS874888A1 (en) | 1990-09-12 |
| CS274368B1 true CS274368B1 (en) | 1991-04-11 |
Family
ID=5438500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CS874888A CS274368B1 (en) | 1988-12-27 | 1988-12-27 | Flux filling on snpb base for tube solders |
Country Status (1)
| Country | Link |
|---|---|
| CS (1) | CS274368B1 (en) |
-
1988
- 1988-12-27 CS CS874888A patent/CS274368B1/en unknown
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| Publication number | Publication date |
|---|---|
| CS874888A1 (en) | 1990-09-12 |
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