CS274364B1 - Flux filling on snpb base for tube solders - Google Patents
Flux filling on snpb base for tube solders Download PDFInfo
- Publication number
- CS274364B1 CS274364B1 CS874488A CS874488A CS274364B1 CS 274364 B1 CS274364 B1 CS 274364B1 CS 874488 A CS874488 A CS 874488A CS 874488 A CS874488 A CS 874488A CS 274364 B1 CS274364 B1 CS 274364B1
- Authority
- CS
- Czechoslovakia
- Prior art keywords
- soldering
- solder
- snpb
- flux filling
- flux
- Prior art date
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- 230000004907 flux Effects 0.000 title claims abstract description 26
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 19
- 238000005476 soldering Methods 0.000 claims abstract description 14
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 5
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 4
- 229910007116 SnPb Inorganic materials 0.000 claims abstract description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 238000009428 plumbing Methods 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 abstract 1
- 231100000252 nontoxic Toxicity 0.000 abstract 1
- 230000003000 nontoxic effect Effects 0.000 abstract 1
- 239000002529 flux (metallurgy) Substances 0.000 description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 239000012190 activator Substances 0.000 description 1
- 239000006286 aqueous extract Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Vynález sa týká tavivovej náplně mákkých trubičkových spájok na bázi SnPb, pre spájkovanie v elektrotechnike a v elektrotechnickom priemysle, ako aj pře strojařské spájkovanie.The invention relates to a flux filler for SnPb-based soft solder tubes for soldering in the electrical and electrical industries as well as for mechanical soldering.
Doposial’ sú známe tavivové náplně trubičkových spájok na bázi SnPb, alebo aj samostatné taviva, skladajúce sa spravidla z čistej kolofónie, alebo zo zmesi kolofónie s chemickými zlúčeninami, zvyšujúcimi najma účinnost čistiaceho procesu v priebehu spájkovania, resp. zlepšujúcimi difúzne podmienky. Tieto chemické zlúčeniny a ich produkty majú aj negativné sprievodné znaky: zvýšenie korózneho vplyvu na časti spájkovaného spoja, náklady na jeho čistenie od zvyškov taviva, hygienickú a ekologickú závadnosf čistiacich látok, ako aj vlastnej základnej zložky, kolofónie, alebo tiež neželatelný vplyv na životné procesy za účasti dalších nepřijatelných chemických látok (freon).So far, flux fillers of SnPb-based tubular solders or separate fluxes are known, generally consisting of a pure rosin or a mixture of rosin and chemical compounds, increasing in particular the efficiency of the cleaning process during soldering, respectively. improving diffusion conditions. These chemical compounds and their products also have negative accompanying features: increasing the corrosive effect on the solder joint parts, the cost of cleaning it from the flux residues, the hygienic and ecological defects of the cleaning agents as well as their own constituent, rosin, or unwanted impact on life processes with the participation of other unacceptable chemicals (freon).
Podstata tavivovej náplně mákkých trubičkových spájok, resp. samostatného taviva na spájkovanie mákkých spájkami na bázi SnPb, spočívá v tom, že obsahuje polyetylénglykol v množstve 90 až 99 % hmot., a kyselinu fosforečnú v množstve 1 až 10 % hmot.The essence of flux filling of soft tube solders, resp. It consists of a polyethylene glycol in an amount of 90 to 99% by weight and phosphoric acid in an amount of 1 to 10% by weight.
Hlavně výhody tavivovej náplně mákkých trubičkových spájok, resp. samostatného taviva, spočívajú v tom, že hlavná zložka taviva je založena na esterifikovanom vysokomolekulárnom alkohole, ktorý preberá funkciu tenzidů, detergentu a speňovadla a v spojení s kyselinou fosforečnou, ako aktivátorom tiež funkciu ochrany povrchu spájkového materiálu a· spájky. Vylučuje technologické zložitosti výroby taviv doposial známých koncepcií, znižuje ekonomická náročnost’. Tavivová náplň, resp. tavivo má vysokú stálost, koncentrácia jeho exhalátov za technologického tepla nie je toxická. Oe zmývatelné vodou, alebo z hladiska koróznosti je jeho přítomnost na spájkovanom spoji zanedbatelná a neškodná. Oe nekorózne. Skúšky v jednom případe prebiehali s tavivovými náplňami, resp. tavivami v množstve 90 až 99 % hmot. polyetylénglykolu a 1 až 10 % hmot. kyseliny fosforečnej.Main advantages of flux filling of soft tube solders, resp. The main component of the flux is based on an esterified high molecular weight alcohol which assumes the function of surfactants, detergent and foaming agent and, in conjunction with phosphoric acid, as an activator, also a function of protecting the solder material and solder. It eliminates the technological complexities of flux production of previously known concepts, reducing economic demands'. Flux filling, resp. the flux has a high stability, the concentration of its fumes at the technological heat is not toxic. It is negligible and harmless if it is washed with water or because of corrosion. Oe nekorózne. In one case, the tests were carried out with fluxes, respectively. % fluxes in an amount of 90 to 99 wt. % polyethylene glycol and 1 to 10 wt. phosphoric acid.
Vlastná spájka mala zloženie Sn60Pb40, resp. Sn63Pb37. Skúšky sa týkali tavivovej náplně v trubičke spájky, resp. samostatného taviva vo formě roztoku s použitím na tekutej vine spájky, resp. použitia v podmienkach strojárskeho (klampiarskeho) spájkovania. Pracovna teplota bola 195 °C až 280 °C, Použité boli technologie: spájkovačkou, na tekutej vine.Own solder had composition Sn60Pb40, respectively. Sn63Pb37. The tests concerned the flux in the solder tube, respectively. a separate flux in the form of a solution using a liquid brazing solder, respectively. for use in mechanical (plumbing) soldering conditions. The working temperature was 195 ° C to 280 ° C, technologies were used: soldering iron, liquid wine.
S použitím známých taviv na báze kolofónie (napr. FB 12-11) sa dosiahla priemerná roztěkavost 5 = 120 mm (Cu) a r = 80 mm (Ms). Korozia zvyškov taviva po spájkovaní bola: vodivost vodného výluhu 340 až 470 us.cm-', množstvo rozpustných kyselin vo vodě sa pohybovalo v množstve od 14 do 78 mg.l-''', čistota dosák plošných spojov bola v rozpátí 0,60 až _2Using known rosin-based fluxes (e.g. FB 12-11), an average flowability of 5 = 120 mm (Cu) and r = 80 mm (Ms) was achieved. Corrosion of flux residues after soldering has: a conductivity of aqueous extract 340-470 us.cm - ", the amount of water-soluble acid in an amount ranged in 14-78 mg · l - ''', the purity of the printed circuit boards were in the range of 0.60 to _2
1,05 ug NaCl.cm . Vodorozpustnosť: skúšobné tavívá boli nerozpustné. Hygienické hodnotenie: dymnatost - tavívá dávajú rozkladné toxické pyrolytické produkty aldehydického charakteru, pričom rozklad začína už při 180 °C.1.05 µg NaCl.cm. Water solubility: test fluxes were insoluble. Hygienic evaluation: smoke - melting gives decomposition toxic pyrolytic products of aldehyde character, the decomposition starts already at 180 ° C.
Pri použití tavivovej náplně, resp. taviva podía aktuálneho predmetu vynálezu sa do2 2 * siahla priemerná roztekavosť R - 360 mm (Cu) a R = 150 mm (Ms). Korozia zvyškov taviva po spájkovaní bola nasledovná: vodivost vodného výluhu 180 až 195 us.cm ', množstvo rozpustných kyselin vo vodě 1,28 mg.l-', čistota dosák plošných spojov dosahovala hodnfit nižších ako 0,5 ug BaCl.cm-“?. Vodorozpustnosť: velmi dobrá už od 10 °C. Hygienické hodnotenie: znížená dymnatost (cca 38 % hodnoty známých taviv a tavivových náplní), stabilita až do teploty 350 °C. Mechanická pevnost bola uchovaná v plnej miere. Elektrická vodivost spojov bola buď plné uchovaná, alebo sa mierne zlepšila (0 0,2 %).When using a flux filler, resp. According to the present invention, the average flow rate R - 360 mm (Cu) and R = 150 mm (Ms) were reached. Corrosion of flux residues after soldering were as follows: Conductivity of water extract 180-195 us.cm ', the amount of water-soluble acid of 1.28 mg · l -', the purity of the printed circuit boards hodnfit reached below 0.5 ug BaCl.cm - " ?. Water solubility: very good from 10 ° C. Hygienic evaluation: reduced smoke density (approx. 38% of known fluxes and fluxes), stability up to 350 ° C. The mechanical strength was fully maintained. The electrical conductivity of the connections was either fully preserved or slightly improved (0 0.2%).
Vynález je využitelný pri všetkých druhoch mákkého spájkovania (aj ako přídavná spájka), najma však ako tavivová náplň mákkých trubičkových spájok, a to pře celú šířku typov spájok a ich použitia.The invention is applicable to all types of soft soldering (also as an additional solder), but in particular as a flux filler for soft tube solders over a wide range of solder types and their applications.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS874488A CS274364B1 (en) | 1988-12-27 | 1988-12-27 | Flux filling on snpb base for tube solders |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS874488A CS274364B1 (en) | 1988-12-27 | 1988-12-27 | Flux filling on snpb base for tube solders |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CS874488A1 CS874488A1 (en) | 1990-09-12 |
| CS274364B1 true CS274364B1 (en) | 1991-04-11 |
Family
ID=5438451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CS874488A CS274364B1 (en) | 1988-12-27 | 1988-12-27 | Flux filling on snpb base for tube solders |
Country Status (1)
| Country | Link |
|---|---|
| CS (1) | CS274364B1 (en) |
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1988
- 1988-12-27 CS CS874488A patent/CS274364B1/en unknown
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| Publication number | Publication date |
|---|---|
| CS874488A1 (en) | 1990-09-12 |
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