CS233062B1 - Liquid cooler for power semiconductor elements cooling - Google Patents

Liquid cooler for power semiconductor elements cooling Download PDF

Info

Publication number
CS233062B1
CS233062B1 CS282783A CS282783A CS233062B1 CS 233062 B1 CS233062 B1 CS 233062B1 CS 282783 A CS282783 A CS 282783A CS 282783 A CS282783 A CS 282783A CS 233062 B1 CS233062 B1 CS 233062B1
Authority
CS
Czechoslovakia
Prior art keywords
liquid cooler
coolant
lids
chamber
cooling
Prior art date
Application number
CS282783A
Other languages
Czech (cs)
English (en)
Inventor
Vladimir Motycka
Karel Smrcek
Michal Pellant
Jiri Lanka
Timotej Simko
Karel Ramajzl
Original Assignee
Vladimir Motycka
Karel Smrcek
Michal Pellant
Jiri Lanka
Timotej Simko
Karel Ramajzl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vladimir Motycka, Karel Smrcek, Michal Pellant, Jiri Lanka, Timotej Simko, Karel Ramajzl filed Critical Vladimir Motycka
Priority to CS282783A priority Critical patent/CS233062B1/cs
Priority to DD26102784A priority patent/DD230735A3/de
Priority to DE19843411523 priority patent/DE3411523A1/de
Publication of CS233062B1 publication Critical patent/CS233062B1/cs

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
CS282783A 1983-04-20 1983-04-20 Liquid cooler for power semiconductor elements cooling CS233062B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CS282783A CS233062B1 (en) 1983-04-20 1983-04-20 Liquid cooler for power semiconductor elements cooling
DD26102784A DD230735A3 (de) 1983-04-20 1984-03-19 Fluessigkeitskuehler zum kuehlen von leistungs- halbleiterbauelementen
DE19843411523 DE3411523A1 (de) 1983-04-20 1984-03-28 Fluessigkeitskuehlkoerper zum kuehlen von leistungs-halbleiterbauelementen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS282783A CS233062B1 (en) 1983-04-20 1983-04-20 Liquid cooler for power semiconductor elements cooling

Publications (1)

Publication Number Publication Date
CS233062B1 true CS233062B1 (en) 1985-02-14

Family

ID=5366519

Family Applications (1)

Application Number Title Priority Date Filing Date
CS282783A CS233062B1 (en) 1983-04-20 1983-04-20 Liquid cooler for power semiconductor elements cooling

Country Status (3)

Country Link
CS (1) CS233062B1 (de)
DD (1) DD230735A3 (de)
DE (1) DE3411523A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06101524B2 (ja) * 1985-09-18 1994-12-12 株式会社東芝 半導体素子用冷却体
DE3740233A1 (de) * 1987-11-27 1989-06-08 Asea Brown Boveri Kuehldose zum abfuehren der verlustwaerme von halbleitern
DE3908996C2 (de) * 1989-03-18 1993-09-30 Abb Patent Gmbh Verfahren zur Herstellung eines Flüssigkeitskühlkörpers
DE4131739C2 (de) * 1991-09-24 1996-12-19 Behr Industrietech Gmbh & Co Kühleinrichtung für elektrische Bauelemente
JPH0637219A (ja) * 1992-07-16 1994-02-10 Fuji Electric Co Ltd パワー半導体装置の冷却装置
DE9212752U1 (de) * 1992-09-22 1993-03-04 Siemens Ag, 8000 Muenchen, De
US5287919A (en) * 1992-09-29 1994-02-22 Gas Research Institute Heat exchanger
DE4301865A1 (de) * 1993-01-25 1994-07-28 Abb Management Ag Kühldose
DE19849099C2 (de) * 1998-10-24 2001-02-15 Sollich Kg Vorrichtung zum kontinuierlichen Temperieren von zu verarbeitenden kakaobutterhaltigen oder ähnlichen fetthaltigen Massen
US8120915B2 (en) * 2008-08-18 2012-02-21 General Electric Company Integral heat sink with spiral manifolds
US20110317369A1 (en) * 2010-06-29 2011-12-29 General Electric Company Heat sinks with millichannel cooling
CN101984507A (zh) * 2010-08-27 2011-03-09 中国电力科学研究院 一种新型的晶闸管水冷散热器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE6600396U (de) * 1968-09-10 1969-01-16 Siemens Ag Gleichrichterzelle mit fluessigkeitskuehlung
CS191622B1 (en) * 1977-05-04 1979-07-31 Michal Pellant Liquid operable cooler,especially for both-sidedly cooled semiconductor power elements
CH654694A5 (de) * 1981-09-01 1986-02-28 Bbc Brown Boveri & Cie Verfahren zur kuehlung von halbleiterelementen und kuehler zur durchfuehrung des verfahrens.

Also Published As

Publication number Publication date
DE3411523A1 (de) 1984-10-25
DD230735A3 (de) 1985-12-11

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