CN88103416A - 金属箔覆盖层压板 - Google Patents

金属箔覆盖层压板 Download PDF

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CN88103416A
CN88103416A CN198888103416A CN88103416A CN88103416A CN 88103416 A CN88103416 A CN 88103416A CN 198888103416 A CN198888103416 A CN 198888103416A CN 88103416 A CN88103416 A CN 88103416A CN 88103416 A CN88103416 A CN 88103416A
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laminate
foil covered
metal foil
matrix
sheet matrix
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刈屋一
野田雅之
山口贵宽
高桥克治
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Resonac Corp
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Shin Kobe Electric Machinery Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/14Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
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    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/047Reinforcing macromolecular compounds with loose or coherent fibrous material with mixed fibrous material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0346Organic insulating material consisting of one material containing N
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02Composition of the impregnated, bonded or embedded layer
    • B32B2260/021Fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04Impregnation, embedding, or binder material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/10Fibres of continuous length
    • B32B2305/18Fabrics, textiles
    • B32B2305/188Woven fabrics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/10Fibres of continuous length
    • B32B2305/20Fibres of continuous length in the form of a non-woven mat
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0145Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/0278Polymeric fibers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
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    • H05K2201/029Woven fibrous reinforcement or textile
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/0293Non-woven fibrous reinforcement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
    • Y10T428/31681Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T442/313Strand material formed of individual filaments having different chemical compositions
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Abstract

一种金属箔覆盖层压板,其中具有由间-芳族聚酰胺纤维、聚对苯二甲酸乙二醇酯纤维和玻璃纤维中的至少二种纤维形成并用含有在其主链端具有羧基的丙烯腈/丁二烯共聚物的环氧树脂浸渍的一种片材状基质和覆盖在所述片材状基质上的一层金属箔。

Description

已知有一种用来制造软性印刷电路的可弯曲的金属箔覆盖板,其中包括一层聚酰亚胺或聚酯的薄膜和覆盖在此薄膜上的金属箔。虽然此种金属箔覆盖板具有良好的反复弯曲的特性,但是它没有补强性的基质,因此在受热时,会导致该种板的尺寸发生很大的收缩。此种缺点限制了该种板的用途。
还知道一种金属箔覆盖层压板,其中包括一种玻璃非织造织物的片材状基质或一种用热固性树脂,例如环氧树脂和酚醛树脂,浸渍的纸的片材状基质,和一种通过加热而粘附在该片材状基质上的金属箔。如果此种层压板是相当薄的话,那么虽然它具有弯曲的特性,但是在弯曲的条件下,它是不适用的,因为在将它弯曲到超过180度时,它就会由于弯曲而很容易被损坏。
在日本专利申请公开第184,587/1984号中,推荐一种金属箔覆盖层压板,其中包括一种用环氧树脂浸渍的由玻璃和聚酯纤维的非织造织物形成的片材状基质和一种通过加热而粘附在该片材状基质上的金属箔。但是,在弯曲的时候,此种在其中含有惯用的环氧树脂的层压板是不适用的。此种先有技术始终未公开,应用哪种环氧树脂可以提供一种可弯曲的层压板。
在电子仪器的制造中,具有一种将厚度减到最薄、体积减到最小的趋势,此种趋势要求,在印刷电路板弯曲的时候,能够将其装在一个很小的空间中。但是,已经提出,没有一种印刷电路板具有良好的弯曲特性和最少的尺寸收缩率。
因此,本发明的一个主要目的是,提供一种具有一种改进的弯曲特性和最少的收缩率的金属箔覆盖层压板。
本发明的另一主要目的是,提供一种除了具有改进的弯曲特性和防止尺寸收缩外,还具有一种高拉伸强度的金属箔覆盖层压板。
本发明的再一个目的是,提供一种对软焊接具有极好的耐热性的金属箔覆盖层压板。
根据本发明,提供了一种包括下列组成的金属箔覆盖层压板:
一种由间-芳族聚酰胺纤维、聚对苯二甲酸乙二醇酯纤维和玻璃纤维中的至少二种纤维形成并用环氧树脂(含有在其末端具有羧基的丙烯腈/丁二烯共聚物)浸渍的片材状基质;和
一种覆盖在所述片材状基质上的金属箔。该片材状基质可由间-芳族聚酰胺纤维和聚对苯二甲酸乙二醇酯纤维、间-芳族聚酰胺和玻璃纤维、或玻璃纤维和聚对苯二甲酸乙二醇酯纤维组成。此外,该片材状基质还可以由织造织物或非织造织物组成。
丙烯腈/丁二烯共聚物是属于具有丙烯腈比例为10至30%(重量)的高腈共聚物,不过并不限于此比例。此种共聚物在其共聚物的主链的二端均具有羧基。用具有二个以上的环氧乙烷基的环氧树脂,将其酯化为预缩合材料。此种预缩合材料本身就可以使用或者将其与环氧树脂渗合后再使用。
环氧树脂中含有在其主链端具有羧基的丙烯腈/丁二烯共聚物,可使树脂具有良好的弯曲特性。当包含在共聚物中的丙烯腈量增加时,极性就优先地加强,从而使树脂具有粘性和软度。
芳族聚酰胺纤维是属于耐热有机合成纤维,具有一种由主要材料是间苯二胺和间苯二甲酸氯形成的聚间亚苯基-间苯二甲酰胺(polymetaphenylene-isophthalmide)的主要组分。芳族聚酰胺纤维具有间位和对位二种键合类型。将用于本发明的芳族聚酰胺限制在间位类型的原因是,间-芳族聚酰胺纤维具有比对-芳族聚酰胺高的绝缘电阻,因为间-芳族聚酰胺对于环氧树脂具有较好的湿润性,以及间-芳族聚酰胺具有比对-芳族聚酰胺好的模切工艺过程。
在200℃温度下,芳族聚酰胺的热收缩率为0.5%,而聚对苯二甲酸乙二醇酯的热收缩率为8%。这就是说,芳族聚酰胺纤维的特性接近无机玻璃纤维的特性。因此,可以指出的是,加入芳族聚酰胺可防止层压板的尺寸收缩。由于弯曲的基质的伸展是在凸表面上进行,而收缩则是在凹表面上进行,因此可以假设,当层压板基质的揉曲性较好时,它对于弯曲特性是有用的。在测定各种不同的纤维的膨胀率中,间-芳族聚酰胺纤维的膨胀率为35%,而聚对苯二甲酸乙二醇酯纤维的膨胀率则约为45%,比间-芳族聚酰胺纤维的膨胀率好。这就是说,聚对苯二甲酸乙二醇酯和环氧树脂,可使层压板基质具有较好的弯曲特性。
应用间-芳族聚酰胺纤维和玻璃纤维形成的片材状基质,可提供一种具有较低的尺寸收缩率和对软焊接具有极好的耐热性的层压板,因为与膨胀率约为3%的玻璃纤维相比,膨胀率较高的间-芳族聚酰胺纤维改进了层压板的弯曲特性,还因为二种纤维的热收缩率都比较低,而二种纤维的耐热性则都比较高。
应用玻璃纤维和聚对苯二甲酸乙二醇酯形成的片材状基质,可提供一种具有良好的弯曲特性和防止尺寸收缩的层压板,因为玻璃纤维对于热具有尺寸稳定性,而聚对苯二甲酸乙二醇酯则具有较高的膨胀率。
应用织造织物形成的片材状基质,可提供一种具有高拉伸强度的层压板,因为织造织物的基质的拉伸强度为非织造织物的拉伸强度的几倍至10倍。
可以指出的是,通过一种特定树脂和基质的组合,本发明可达到良好的弯曲特性和防止尺寸收缩的目的。
还可以进一步指出的是,本发明可使层压板具有对软焊接的耐热性和高拉伸强度。
应该指出的是,本发明的意图不是仅用芳族聚酰胺形成的片材状基质,因为它具有较差的摸切加工工艺和较低的抗湿性。
从下面对本发明的实例的说明,就可以了解本发明的上述的和其他的目的和特点。
对于以非织造织物形式应用的间-芳族聚酰胺纤维和聚对苯二甲酸乙二醇酯纤维的片材状基质来说,从来都没有将这二种纤维的比例确定为某一特定的数值,但是当聚对苯二甲酸乙二醇酯的比例增加时,将大大改进反复弯曲性和抗湿性,但是尺寸收缩率则比较大。因此,应该指出的是,应该将这二种纤维的比例确定为某一合适的数值。
在以织造布形式应用的间-芳族聚酰胺纤维和聚对苯二甲酸乙二醇酯纤维的片材状基质的情况下,可以在将这二种纤维一起捻成一股线后再进行织造,或者是将这二种纤维分别捻成线后再进行织造。
在织造布的层压基质的情况下,间-芳族聚酰胺纤维的比例为40%(重量)时具有较好的结果。当间-芳族聚酰胺纤维的比例增加时,摸切加工工艺将变差。
在实例1至6中,应用间-芳族聚酰胺纤维和聚对苯二甲酸乙二醇酯纤维的片材状基质。
实例1
将80份重的二端都带有羧基的丙烯腈/丁二烯共聚物,(由日本宇部兴产(株)生产,商品名为CTBN×8),100份重的环氧树脂(由日本油化シェ
Figure 88103416_IMG1
(株)生产,商品名EP-828)和0.26份重的三苯膦催化剂混合并在180℃温度下进行反应4小时,以制得初反应物。在此反应物中加入高聚物环氧树脂(由日本油化シェ
Figure 88103416_IMG2
(株)生产,商品名为EP-1009),以便将10%(重量)的丙烯腈/丁二烯共聚物掺入所得到的树脂中,然后与作为固化剂的线型酚醛树脂渗混以制得树脂清漆。
将间-芳族聚酰胺纤维和聚对苯二甲酸乙二醇酯纤维以非织造布形式组合的基质材料(其间-芳族聚酰胺纤维与聚对苯二甲酸乙二醇酯的重量比为1/5)用上述所得到的树脂清漆浸渍,使其中含有80%的树脂。然后将其干燥即可制得预浸渍体,在此预浸渍体的二个表面上铺上一层厚度为35微米的铜箔,然后在170℃温度和30公斤/厘米2的压力下,加压30分钟,以提供一种厚度为0.2毫米的双面铜箔覆盖层压板。
实例2
用制造实例1的层压板的方法,制造本实例的层压板,但是在间-芳族聚酰胺纤维和聚对苯二甲甲酸乙二醇酯纤维以非织造布形式组合的基质中,间-芳族聚酰胺纤维与聚对苯二甲酸乙二醇酯的重量比为5/1。
对比实例1
在环氧树脂(日本油化シェ
Figure 88103416_IMG3
(株)生产,商品各为EP-1001)中加入双氰胺固化剂,使其含量为4%(重量),以制备树脂清漆。将实例1的非织造布基质用所得到的树脂清漆浸渍,使其中含有80%(重量)的树脂,然后将其干燥即可制得一种预浸渍体。在此预浸渍体的二个表面上铺上一层厚度为35微米的铜箔,并按实例1中所述的方法加热加压,以制备一种厚度为0.2毫米的双面铜箔覆盖层压板。
对比实例2
将非织造玻璃纤维布的基质用实例1中所用的树脂清漆浸渍,以制备预浸渍体,使其中含有80%(重量)的树脂,然后将其干燥。按实例1中所叙述的方法,应用所制得的预浸渍体,制造厚度为0.2毫米的双面铜箔覆盖聚层压板。
对比实例3
将间-芳族聚酰胺纤维和聚对苯二甲酸乙二醇酯纤维以非织造布形式组合的基质(其间-芳族聚酰胺纤维与聚对苯二甲酸乙二醇酯的重量比为1/5)用实例1中所用的树脂清漆浸渍,按实例1中所叙述的方法,制备一种预浸渍体。按实例1中所叙述的方法,应用所制得的预浸渍体,制造厚度为0.2毫米的双面铜箔覆盖层压板。
对比实例4
应用只有间-芳族聚酰胺纤维布的基质,制备一种预浸渍体,并按实例1中所叙述的方法,应用所制得预浸渍体,制造厚度为0.2毫米的双面铜箔覆盖层压板。
先有技术1
在厚度为0.13毫米的聚酰亚胺(杜邦公司生产的,商品名为Kapfon)的二个表面上粘上35微米的铜箔。
先有技术2
将非织造玻璃纤维布的基质用对比实例1中所用的树脂清漆浸渍,以制备一种预浸渍体,使其中含有80%(重量)的树脂,然后将其干燥。按实例1中所叙述的方法,应用所制得的预浸渍体,制造厚度为0.2毫米的双面铜箔覆盖层压板。
先有技术3
应用甲期酚醛树脂型酚醛树脂清漆浸渍一种纸基质,使其中含有45%的树脂,然后将其干燥,以制备一种预浸渍体。在此预浸渍体的表面上铺上一层厚度为35微米的铜箔,然后在170℃温度和100公斤/厘米2的压力下,加压30分钟,以制备一种厚度为0.2毫米的双面铜箔覆盖层压板。
表1列出上述实例、对比实例和先有技术中的层压板或片材的特性试验的结果。在此表中,“DCW”表示模切加工工艺,“RBC”表示180度反复弯曲特性,“IR”表示绝缘电阻(D-2/100)而“SSR”则表示尺寸收缩率(E-0.5/150)。
表Ⅰ
DCW    RBC    IR    SSR(%)
实例1 ○ 大于10次 5×10130.18
实例2 ○ 8次 2×10130.15
对比实例1 ○ × 8×10130.17
对比实例2 ○ × 6×10120.10
对比实例3 × 大于10次 2×1080.18
对比实例4 △ 2次 7×10120.14
先有技术1 △ 大于10次 2×10120.55
先有技术2 ○ × 5×10120.08
先有技术3 ○ × 8×1090.15
按下列步骤进行特性试验:
(1)模切加工工艺(DCW)
按ASTM方法将试验材料冲孔并评价所冲的孔和孔的周边的加工情况。在试验结果中,“○”表示结果良好,“△”表示仍然还有某些拉毛和飞边未切除,而“×”则表示仍然还有大量的纤维拉毛未切除。
(2)180度反复弯曲特性(RBC)
将试验材料切成尺寸为20×100毫米的试件,在其强度较低的横向反复弯曲180度来进行本试验。在进行弯曲试验时,记录在弯曲部分出现妨碍实际使用的裂缝的弯曲次数(其极限弯曲次数为10次)。在试验结果中,“×”表示只进行一次弯曲,试件即破裂。
(3)绝缘电阻(IR)
应用JIS-C-6481方法测量。
(4)尺寸收缩率(SSR)
在进行本试验时,先将试验材料切成尺寸为20×300毫米的试件,然后除去试件上的铜箔,并测量在150℃烘箱中进行30分钟热处理前后的试件的长度和宽度的尺寸。根据所测量出的最大的尺寸收缩率数值,通过下列表示式,即可获得试件的尺寸收缩率:
尺寸收缩率(%)= (热处理前的尺寸-热处理后的尺寸)/(热处理前的尺寸) ×100
实例3至5
将二端带有羧基的30份重的丙烯腈/丁二烯共聚物、40份重的不燃性环氧树脂(环氧树脂当量为400,溴夹杂物比例为48%,日本东都化成(株)生产,商品名为YDB-400)、20份重的环氧树脂(环氧树脂当量为195,日本油化シェ
Figure 88103416_IMG4
(株)生产,商品名为EP-828)和10份重的甲酚醛环氧树脂(环氧树脂当量为210,日本东都化成(株)生产,商品名为YDCN-704),在180℃温度和在有三苯膦催化剂存在的情况下,反应4小时。将此反应物与双氰胺固化剂掺混,以制备清漆。
制备以径纬与纬纱比为12/11的线的形式组合的间-芳族聚酰胺纤维和聚对苯二甲酸乙二醇酯纤维的织造布的基质材料。在实例3、4和5中,间-芳族聚酰胺的比例分别为10%(重量)、40%(重量)、70%(重量)。用上述清漆来浸渍上述各织造布的基质材料,以制备一种预浸渍体,使其含有60%的树脂,然后将其干燥。在此种预浸渍体的二个表面上铺上一层厚度为35微米的铜箔,然后在170℃温度和30公斤/厘米2的压力下,加压30分钟,以制备一种厚度为0.6毫米的双面铜箔覆盖层压板。
实例6
制备一种由间-芳族聚酰胺线和聚对苯二甲酸乙二醇酯线形成的织造布的基质,并同时调节上述线的直径和数目,使间-芳族聚酰胺的比例为40%(重量)。按上述实例3中所叙述的方法,应用上述基质,制备厚度为0.6毫米的双面铜箔覆盖层压板。
对比实例5
将90份重的不燃性环氧树脂(环氧树脂当量为500,溴夹杂物比例为22%,日本东都化成(株)生产,商品名为ESB-500)、10份重的YDCN-704和3份重的双氰胺固化剂掺混,以制备清漆。用所得到的清漆来浸渍实例4的织造织物基质,以制备一种预浸渍体。按实例4中的所述的方法,应用上述预浸渍体,制备厚度为0.6毫米的双面铜箔覆盖层压板。
表Ⅱ列出实例3至6、对比实例5和先有技术Ⅰ的特性试验的结果。在此表1,“DCW”和“SSR”所表示的与表Ⅰ中的相同,而“BAF”则表示芳族聚酰胺纤维的掺混比(%),“BC”表示弯曲特性(毫米),“TS”表示拉伸强度(公斤/毫米2
表Ⅱ
DCW    BAF    BC    TS    SSR(%)
实例3    ○    10    2.5    23    0.25
实例4    ○    40    2.8    28    0.20
实例5    △    70    2.9    30    0.17
实例6    ○    40    2.8    28    0.20
对比实例5    ○    40    10.5    29    0.36
先有技术1    △    -    易弯曲    3    0.55
在表Ⅱ中,通过测量层压板在既不破裂亦无裂缝处的最小弯曲半径来进行弯曲特性试验。用JIS-C-6481方法测量拉伸强度。其它试验则按对表Ⅰ所相似的方法进行。
在实例7和8中,应用间-芳族聚酰胺纤维和玻璃纤维的片材状基质。虽然并未将间-芳族聚酰胺纤维与玻璃纤维的掺混比确定为某一特定的数值,但是由于当玻璃纤维的数量增加时,就会大大地防止了尺寸收缩,而从降低了弯曲特性。因此,应该指出的是,应该将它们的比例调节在某一合适的数值。
实例7
将间-芳族聚酰胺和具有纤维直径为9微米和长度为25毫米的E玻璃纤维以非织造布形式组合的基质(其间-芳族聚酰胺纤维与E玻璃香味的重量比为2/1)用实例1中所用的树脂清漆浸渍,并按实例1中所叙述的方法干燥,以制备一种预浸渍体。在此种预浸渍体的二个方表面上铺上一层厚度为35微米的铜箔,然后在170℃温度和30公斤/厘米2的压力下,加压30分钟,以制备一种厚度为0.2毫米的双面铜箔覆盖层压板。
实例8
制备一种以间-芳族聚酰胺纤维和E玻璃纤维的组合形式形成的非织造布的基质,使间-芳族聚酰胺纤维与E玻璃纤维的重量比为1/2,按实例7中所叙述的方法,应用此种基质,制备厚度为0.2毫米的双面铜箔覆盖层压板。
对比实例6
在环氧树脂(日本油化シェ
Figure 88103416_IMG5
(株)生产,商品名为EP-1001)中加入双氰胺固化剂,使其含量4%(重量)以制备树脂清漆。将实例7的非织造织物基质用所得到的树脂清漆浸渍,使其中含有80%(重量)的树脂,然后将其干燥即可制得一种预浸渍体。在此预浸渍体的表面上铺上一层厚度为35微米的铜箔,并按实例7中所叙述的方法加压,以制备一种厚度为0.2毫米的双面铜箔覆盖层压板。
对比实例7
制备一种以间-芳族聚酰胺纤维和E玻璃纤维的组合形式形成的非织造布的基质,使间-芳族聚酰胺纤维和E玻璃纤维的重量比为1/2,按实例7中所叙述的方法,应用此种基质,制备厚度为0.2毫米的双面铜箔覆盖层压板。
表Ⅲ列出实例7和8、对比实例6和7以及先有技术1至3的层压板的特性试验的结果。在此表中,“DCW”、“IR”和“SSR”所表示的与表Ⅰ中的相同,而“180BC”则表示弯曲180度的特性,“TR”表示在260℃下对软焊接的耐热性(D-2/100)。
表Ⅲ
DCW    180BC    TR    IR    SSR(%)
实例7 ○ ○ 40至 8×10120.12
60
实例8 ○ ○ ~ 40至 8×10120.11
△    60
对比实例6 ○ × 40至 7×10120.11
60
对比实例7 × ○ 10至 2×1080.12
20
先有技术1 △ ○ 5 2×10120.55
先有技术2 ○ × 40至 5×10120.08
60
先有技术3 ○ × 15 8×1090.15
在表Ⅲ中,弯曲180度的特性试验,是先将试验材料切成尺寸为20×100毫米的试件,然后再将它们弯曲180度,通过评价在该试件上的裂缝来进行的。在180BC试验中,“○”表示无裂缝,“△”表示所出现的细裂缝在实际应用中是不会发生问题的,而“×”则表示试件已破裂,不能实际应用。用JIS-C-6481方法进行对软焊接的耐热性试验。其它试验则按表1中所叙述的方法进行。
在实例9至11中,应用一种玻璃纤维和聚对苯二甲酸乙二醇酯的组合形式的线的片材状基质。虽然并未将间-芳族聚酰胺纤维与玻璃纤维的掺混比确定为某一特定的数值,但是,在玻璃纤维的掺混比为10%(重量)的情况下,获得了较好的结果。当玻璃纤维的掺混比增加时,降低了弯曲特性,但改进了尺寸稳定性。
实例9至11
制备以经纱与纬纱比为4/3的线的形式组合的玻璃纤维和聚对苯二甲酸乙二醇酯纤维的织造布的基质材料。在实例9、10和11中,玻璃纤维的比例分别为5%(重量)、10%(重量)和30%(重量)。应用实例3中所用的清漆来浸渍上述各织造布的基质材料,以制备一种预浸渍体,使其含有60%的树脂,然后将其干燥。按实例3中所叙述的方法,制备厚度为0.6毫米的双面铜箔覆盖层压板。
实例12
制备一种由玻璃纤维线和聚对苯二甲酸乙二醇酯纤维线形成的织造布的基质,并同时调节上述线的直径和数目,使玻璃纤维的比例为10%(重量)。按实例9中所叙述的方法,应用上述基质,制备厚度为0.6毫米的双面铜箔覆盖层压板。
实例13
应用玻璃纤维和聚对苯二甲酸二乙醇酯纤维的组合形式形成的非织造布的基质(其玻璃纤维比例为10%(重量)),按实例9中所叙述的方法,制备厚度为0.6毫米的双面铜箔层压板。
对比实例8
应用对比实例5的清漆来浸渍实例10的织造布,以制备厚度为0.6毫米的双面铜膜覆盖层压板。
表Ⅳ列出实例9至13和对比实例8以及先有技术1的层压板的特性试验结果。在此表中,“BC”、“SSR”和“TS”所表示与表Ⅱ中的相同,而“BRG”则表示玻璃纤维的掺混比(%)。
表Ⅳ
BRG    BC    SSR(%)    TS
实例9    5    3.5    0.45    25
实例10    10    4.0    0.25    28
实例11    30    6.5    0.20    30
实例12    10    4.0    0.25    28
实例13    10    4.0    0.28    10
对比实例8    10    15.5    0.23    29
先有技术1    -    易弯曲    0.55    3
虽然说明和叙述了本发明的一些实例,但是,本技术领域中的技术人员都认识到,在不脱离本发明的精神和范围的情况下,可以进行各种改变和修正,而这些实例只是用来说明本发明的权利要求的。

Claims (7)

1、一种金属箔覆盖层压板,其中具有:由间-芳族聚酰胺纤维、聚对苯二甲酸乙二醇酯纤维和玻璃纤维中的至少二种纤维形成并用含有在其主链端具有羧基的丙烯腈/丁二烯共聚物的环氧树脂浸渍的一种片材状基质,
和覆盖在所述片材状基质的至少一个表面上的一层金属箔。
2、权利要求1的金属箔覆盖层压板,其中所述片材状基质是由间-芳族聚酰胺纤维和聚对苯二甲酸乙二醇酯纤维形成的。
3、权利要求1的金属箔覆盖层压板,其中所述片材状基质是由间-芳族聚酰胺纤维和玻璃纤维形成的。
4、权利要求1的金属箔覆盖层压板,其中所述片材状基质是由玻璃纤维和聚对苯二甲酸乙二醇酯纤维形成的。
5、权利要求1的金属箔覆盖层压板,其中所述片材状基质是以非织造布的形式。
6、权利要求1的金属箔覆盖层压板,其中所述片材状基质是以织造布的形式。
7、权利要求1的金属箔覆盖层压板,其中所述的含有在其主链端具有羧基的丙烯腈/丁二烯共聚物的环氧树脂是一种在其主链端具有羧基的丙烯腈/丁二烯共聚物和环氧树脂的预反应的产物。
CN198888103416A 1987-06-04 1988-06-03 金属箔覆盖层压板 Pending CN88103416A (zh)

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JP14018887 1987-06-04
JP14018987 1987-06-04
JP140,189/87 1987-06-04
JP140,188/87 1987-06-04
JP4344588A JPS6486589A (en) 1987-06-04 1988-02-26 Metal-foiled laminated plate
JP43,445/88 1988-02-26

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EP0295816A3 (en) 1990-06-13
JPH0513557B2 (zh) 1993-02-22
EP0295816A2 (en) 1988-12-21
JPS6486589A (en) 1989-03-31
CA1307453C (en) 1992-09-15
US4883708A (en) 1989-11-28

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