CN87101625A - 印刷电路板的焊接方法 - Google Patents

印刷电路板的焊接方法 Download PDF

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Publication number
CN87101625A
CN87101625A CN198787101625A CN87101625A CN87101625A CN 87101625 A CN87101625 A CN 87101625A CN 198787101625 A CN198787101625 A CN 198787101625A CN 87101625 A CN87101625 A CN 87101625A CN 87101625 A CN87101625 A CN 87101625A
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China
Prior art keywords
circuit board
printed circuit
pcb
scolder
welding
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Withdrawn
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CN198787101625A
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English (en)
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CN87101625B (zh
Inventor
立冈修次
关山博史
石毛完治
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Hitachi Ltd
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Hitachi Ltd
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Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CN87101625A publication Critical patent/CN87101625A/zh
Publication of CN87101625B publication Critical patent/CN87101625B/zh
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

本发明涉及将印刷电路板浸入焊接槽中的熔融焊料以将电子元件焊接到印刷电路板的方法。当印刷电路板浸入焊接槽中的熔融焊料时，也一起浸入吸有熔融焊料的构件，而当印刷电路板从熔融焊料上拉时，是在构件的边缘和印刷电路板的焊料连接部分保持接触时进行的。在印刷电路板越出熔融焊料后，构件的边缘脱离印刷电路板以便用焊料的表面张力除去粘附在连接部分的过剩焊料。

Description

本发明一般涉及在印刷电路板上焊接电子元件，更具体地说，本发明涉及在其上装有高密度的窄引线间隙的电子元件的焊接印刷电路板的方法。
当电子元件被焊到一块印刷电路板上时，特别是在高密度的电子元件的情况下，过剩的焊料和焊料联接会变成严重的问题。下列两种方法过去已经被认为是除去焊接时产生的过剩焊料和焊料联接的方法。第一个方法是将一块烙铁直接放在焊料部分上，并吸去多余的焊料;第二个方法是用一根浸有焊药的扭曲铜线（例如C.S.C有限公司的一种“吸锡器”（Solder    Wick）借助毛细管现象吸去多余的焊料。
由于上述常用方法在某种意义上说是为了对抗已经形成的过剩焊料和焊料联接的措施，故自然就丝毫不去仔细考虑如何防止过剩焊料和焊料联接本身的形成，因而也就不会没有下列问题：
（a）当在扭曲线上过剩地聚集起焊料时，该线就不再吸去焊料，因此必须弃而不用。
（b）不论焊接是否做得满意，在使用焊烙铁或焊料吸线时必须用眼睛作进一步的认证。因此，如将烙铁或吸线放在已经完成了的焊料部分上，该处的焊料就会变得不足。
（c）自动检查焊接状况的设备是如此之贵，使得自动吸除过剩焊料的设备整个地变得价格高昂。
为了要消除上述先有技术存在的问题，故本发明打算提供一种在焊接印刷电路板时能防止形成过剩焊料的方法。
根据本发明提供的一种焊接印刷电路板的方法，其特征在于，当印刷电路板浸入焊接槽中的熔融焊料时，也一起浸入吸有熔融焊料的构件，当构件边缘和印刷电路板的焊料连接部分接触时，从焊接槽抽出印刷电路板，而在印刷电路板越出熔融焊料后，使该构件的边缘脱离印刷电路板。焊料吸收构件脱离印刷电路板后，由于表面张力，过剩粘附在连接部分的过剩焊料就被除去。
图1是焊接后的印刷电路板和连接件从底部向上看的透视图;以及
图2（a）和2（b）是说明本发明原理的剖面图。
下面将参考附图叙述本发明的一个最佳实施例。
图1为焊接后的基片1和连接件2从底部向上看的透视图。连接件2被嵌塞到基片1。参考数字4代表焊接槽里面的焊料表面，5是由42合金制成的细长薄板状焊料吸收构件。参考数字3代表悬挂焊料吸收构件5的弹簧。用弹簧3支承该焊料吸收构件5，并使构件5稳当地静止在焊料表面4上时，放低其上装有连接件2的基片1。当基片1在靠近焊料连接部分和在基片1及连接件引线6间的焊料连接部分处接触到焊料吸收构件5的边缘时，保持基片1下降时，要使得推下焊料吸收构件5以反抗弹簧3的复位力矩，然后将基片1浸入焊料表面4并加以焊接。之后，在保持接触焊料吸收构件5的边缘的同时，渐渐升起基片1，基片1越出在焊料表面上并继续上升。虽然焊料吸收构件5在升起基片1时也暂时跟上来，但当构件5因弹簧3的复位力矩而回到原来的停止位置时，它就不能再跟随基片1，从而脱离基片1。这时，基片1和连接件引线6间的过剩熔融焊料，由于表面张力，在整根焊料吸收构件5的基片1和连接件引线6间留下缝隙，并流向焊料表面4。于是，过剩焊料或焊料联接（在其它情况下可能出现在基片1和连接件引线6间）得以消除。
图2（a）和2（b）是说明本发明原理的剖面图。连接件引线6和焊料吸收构件5之间互相吸住过剩焊料7，而粘附在连接件引线6的过剩焊料7在整个焊料吸收构件5上由于表面张力而返回到焊接槽。于是，连接件引线6表面上的焊料联接和过剩焊料得以除去。
顺便要提到的是，任一种材料只要它们能耐得起熔融焊料的热度，在其上不会轻易粘附焊料又不污染焊料，就可以用作焊料吸收构件5。焊料吸收构件5最好具有细长扁薄的形状。这种薄板的厚度基本上等于焊料连接部分的宽度，而其长度至少要等于基片1焊料连接部分的长度。如果焊料吸收构件5的边缘是圆的，则可以把焊料明显地脱离出来。
在上述发明的实施例中，用弹簧3悬挂焊料吸收构件5，但也当然可以使用其它另外的机构，只要这些机构在基片从焊料表面4越出后在暂时保持接触的同时，能使焊料吸收构件5跟随基片1，然后使焊料吸收构件5脱离基片1，有这样性能的机构就可以加以使用。
本发明能完全消除焊接工作期间和焊接后的校正工作出现的过剩焊料和焊料联接。因此，本发明能够用于自动设备。

Claims (4)

1、将印刷电路板浸入焊接槽中的熔融焊料的焊接印刷电路板的方法，其特征在于，装在印刷电路板边缘的一个构件，其宽度基本上等于而长度至少等于所说印刷电路板的焊料连接部分的宽度和长度，当所说印刷电路板浸入所说熔融焊料时，也一起浸入所说构件，当所说印刷电路板从所说熔融焊料拉出时，所说构件的边缘和所说焊料连接部分保持接触，而在所说印刷电路板越出所说熔融焊料后，所说构件的边缘脱离所说连接部分，以便用表面张力除去粘附在所说连接部分的焊料部分。
2、如权利要求1所规定的焊接印刷电路板的方法，其特征在于，所说构件用弹簧悬挂，借助于所说印刷电路板反抗所说弹簧的复位力矩，将所说构件推下并浸入所说熔融焊料，而在所说构件越出所说熔融焊料后，因所说弹簧的复位力矩使所说构件回到原先停止的位置，并使之脱离继续上升的所说印刷电路板。
3、如权利要求1所规定的焊接印刷电路板的方法，其特征在于，所说构件是一块细长扁薄的薄板。
4、如权利要求1所规定的焊接印刷电路板的方法，其特征在于，所说连接部分是所说印刷电路板和连接件引线间的连接部分。
CN87101625A 1986-02-26 1987-02-26 印刷电路板的焊接方法 Expired CN87101625B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP40784/86 1986-02-26
JP61040784A JPS62198195A (ja) 1986-02-26 1986-02-26 プリント基板等におけるはんだ付け方法

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CN87101625A true CN87101625A (zh) 1987-09-09
CN87101625B CN87101625B (zh) 1988-09-21

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US (1) US4819327A (zh)
JP (1) JPS62198195A (zh)
KR (1) KR880009542A (zh)
CN (1) CN87101625B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100493295C (zh) * 2005-08-09 2009-05-27 三菱电机株式会社 扁平封装ic装配印制线路板及其焊接方法、空气调节器
CN100581324C (zh) * 2008-08-06 2010-01-13 深圳华为通信技术有限公司 一种电路板及其焊接方法
CN107027283A (zh) * 2016-01-07 2017-08-08 白光株式会社 加热设备以及电子元件的拆卸方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5944536A (en) * 1996-10-31 1999-08-31 Thomas & Betts Corporation Cover for an edge mounted printed circuit board connector
TW517613U (en) * 2001-11-13 2003-01-11 Asustek Comp Inc Jig framework featuring with solder attracting function
JP4543205B2 (ja) * 2008-07-16 2010-09-15 千住金属工業株式会社 プリント基板の部分はんだ付け方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5269194A (en) * 1992-05-28 1993-12-14 Eaton Corporation Transmission mainshaft thrust washer combination

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100493295C (zh) * 2005-08-09 2009-05-27 三菱电机株式会社 扁平封装ic装配印制线路板及其焊接方法、空气调节器
CN100581324C (zh) * 2008-08-06 2010-01-13 深圳华为通信技术有限公司 一种电路板及其焊接方法
CN107027283A (zh) * 2016-01-07 2017-08-08 白光株式会社 加热设备以及电子元件的拆卸方法
CN107027283B (zh) * 2016-01-07 2019-09-20 白光株式会社 加热设备以及电子元件的拆卸方法

Also Published As

Publication number Publication date
CN87101625B (zh) 1988-09-21
US4819327A (en) 1989-04-11
JPS62198195A (ja) 1987-09-01
KR880009542A (ko) 1988-09-15

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