CN100581324C - 一种电路板及其焊接方法 - Google Patents
一种电路板及其焊接方法 Download PDFInfo
- Publication number
- CN100581324C CN100581324C CN200810144080A CN200810144080A CN100581324C CN 100581324 C CN100581324 C CN 100581324C CN 200810144080 A CN200810144080 A CN 200810144080A CN 200810144080 A CN200810144080 A CN 200810144080A CN 100581324 C CN100581324 C CN 100581324C
- Authority
- CN
- China
- Prior art keywords
- fpc
- pcb
- width
- silk
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810144080A CN100581324C (zh) | 2008-08-06 | 2008-08-06 | 一种电路板及其焊接方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810144080A CN100581324C (zh) | 2008-08-06 | 2008-08-06 | 一种电路板及其焊接方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101336049A CN101336049A (zh) | 2008-12-31 |
CN100581324C true CN100581324C (zh) | 2010-01-13 |
Family
ID=40198270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810144080A Active CN100581324C (zh) | 2008-08-06 | 2008-08-06 | 一种电路板及其焊接方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100581324C (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101945538A (zh) * | 2010-09-19 | 2011-01-12 | 华为终端有限公司 | 柔性电路板、柔性电路板与印刷电路板连接机构及方法 |
CN102699472B (zh) * | 2012-05-09 | 2015-10-28 | 深圳市福智软件技术有限公司 | 一种排线焊接定位治具 |
CN103648232A (zh) * | 2013-12-27 | 2014-03-19 | 广东威创视讯科技股份有限公司 | 一种用于解决信号过孔与封装焊盘短路的方法 |
CN111556651B (zh) * | 2020-06-28 | 2022-11-08 | 上海创功通讯技术有限公司 | 电子设备及fpc与电路板的连接方法 |
CN115815896A (zh) * | 2022-12-05 | 2023-03-21 | 平湖科谱激光科技有限公司 | 一种用于收发器与线路板组件焊接的装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN87101625A (zh) * | 1986-02-26 | 1987-09-09 | 株式会社日立制作所 | 印刷电路板的焊接方法 |
-
2008
- 2008-08-06 CN CN200810144080A patent/CN100581324C/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN87101625A (zh) * | 1986-02-26 | 1987-09-09 | 株式会社日立制作所 | 印刷电路板的焊接方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101336049A (zh) | 2008-12-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100581324C (zh) | 一种电路板及其焊接方法 | |
US20130016480A1 (en) | Printed circuit board having heat gathering structures and manufacturing process thereof | |
CN205670879U (zh) | 电路板 | |
CN110958787A (zh) | 一种多层互联fpc预设锡膏的焊接方法 | |
CN103052258B (zh) | 印刷电路板及其制造方法 | |
CN109548307B (zh) | 一种碳油板及其制备方法 | |
WO2009091219A2 (ko) | 인쇄 회로 기판의 장착 방법 | |
WO2017156981A1 (en) | Flexible circuit board, array substrate, fabricating method thereof, and display apparatus | |
US8528195B2 (en) | Layout method for electronic components of double-sided surface mount circuit board | |
CN105101630A (zh) | 一种印刷电路板拼板及其制作方法 | |
CN111328213A (zh) | 一种限高的多层fpc焊接方法 | |
CN110677988A (zh) | 一种防止焊盘堵孔的电路板 | |
CN108347829B (zh) | 防连锡的电路板及其制造方法 | |
KR100878228B1 (ko) | 정배열을 위한 pcb와 ffc | |
WO2005072032A1 (ja) | 回路基板、回路基板の実装構造および回路基板の実装方法 | |
JP4381248B2 (ja) | 電極端子の固定構造およびその固定方法 | |
CN111836474A (zh) | 电子设备及其制造方法、以及印刷基板及其制造方法 | |
CN206879217U (zh) | 移动终端及其电路板组件 | |
JP4618195B2 (ja) | 電子部品のプリント配線板への取付け方法 | |
CN113645758B (zh) | 柔性电路板及其制造方法、显示装置 | |
US11324125B2 (en) | Diversified assembly printed circuit board and method for making the same | |
CN210725493U (zh) | 一种防止焊盘堵孔的电路板 | |
KR102321374B1 (ko) | 연성인쇄회로기판의 연결 방법 | |
CN112135415A (zh) | 一种多层互联电子线路板 | |
US20060213058A1 (en) | Circuit board for surface-mount device to be mounted thereon |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: HUAWEI DEVICE CO., LTD. Free format text: FORMER NAME: SHENZHEN HUAWEI TECHNOLOGY CO. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Patentee after: HUAWEI DEVICE Co.,Ltd. Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Patentee before: Huawei Device Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee after: Huawei terminal (Shenzhen) Co.,Ltd. Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee before: HUAWEI DEVICE Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20181218 Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: HUAWEI DEVICE Co.,Ltd. Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee before: Huawei terminal (Shenzhen) Co.,Ltd. |