CN101336049A - 一种电路板及其焊接方法 - Google Patents
一种电路板及其焊接方法 Download PDFInfo
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- CN101336049A CN101336049A CNA2008101440802A CN200810144080A CN101336049A CN 101336049 A CN101336049 A CN 101336049A CN A2008101440802 A CNA2008101440802 A CN A2008101440802A CN 200810144080 A CN200810144080 A CN 200810144080A CN 101336049 A CN101336049 A CN 101336049A
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- circuit board
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- 238000003466 welding Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims description 2
- 238000004080 punching Methods 0.000 abstract description 7
- ALFHIHDQSYXSGP-UHFFFAOYSA-N 1,2-dichloro-3-(2,4-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=CC=CC(Cl)=C1Cl ALFHIHDQSYXSGP-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 239000004744 fabric Substances 0.000 description 4
- 208000019901 Anxiety disease Diseases 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000036506 anxiety Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000010009 beating Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- -1 mobile phone Substances 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
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Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN200810144080A CN100581324C (zh) | 2008-08-06 | 2008-08-06 | 一种电路板及其焊接方法 |
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CN200810144080A CN100581324C (zh) | 2008-08-06 | 2008-08-06 | 一种电路板及其焊接方法 |
Publications (2)
Publication Number | Publication Date |
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CN101336049A true CN101336049A (zh) | 2008-12-31 |
CN100581324C CN100581324C (zh) | 2010-01-13 |
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CN200810144080A Active CN100581324C (zh) | 2008-08-06 | 2008-08-06 | 一种电路板及其焊接方法 |
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CN (1) | CN100581324C (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101945538A (zh) * | 2010-09-19 | 2011-01-12 | 华为终端有限公司 | 柔性电路板、柔性电路板与印刷电路板连接机构及方法 |
CN102699472A (zh) * | 2012-05-09 | 2012-10-03 | 福兴达科技实业(深圳)有限公司 | 一种排线焊接定位治具 |
CN103648232A (zh) * | 2013-12-27 | 2014-03-19 | 广东威创视讯科技股份有限公司 | 一种用于解决信号过孔与封装焊盘短路的方法 |
CN111556651A (zh) * | 2020-06-28 | 2020-08-18 | 上海创功通讯技术有限公司 | 电子设备及fpc与电路板的连接方法 |
CN115815896A (zh) * | 2022-12-05 | 2023-03-21 | 平湖科谱激光科技有限公司 | 一种用于收发器与线路板组件焊接的装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62198195A (ja) * | 1986-02-26 | 1987-09-01 | 株式会社日立製作所 | プリント基板等におけるはんだ付け方法 |
-
2008
- 2008-08-06 CN CN200810144080A patent/CN100581324C/zh active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101945538A (zh) * | 2010-09-19 | 2011-01-12 | 华为终端有限公司 | 柔性电路板、柔性电路板与印刷电路板连接机构及方法 |
CN102699472A (zh) * | 2012-05-09 | 2012-10-03 | 福兴达科技实业(深圳)有限公司 | 一种排线焊接定位治具 |
CN102699472B (zh) * | 2012-05-09 | 2015-10-28 | 深圳市福智软件技术有限公司 | 一种排线焊接定位治具 |
CN103648232A (zh) * | 2013-12-27 | 2014-03-19 | 广东威创视讯科技股份有限公司 | 一种用于解决信号过孔与封装焊盘短路的方法 |
CN111556651A (zh) * | 2020-06-28 | 2020-08-18 | 上海创功通讯技术有限公司 | 电子设备及fpc与电路板的连接方法 |
CN115815896A (zh) * | 2022-12-05 | 2023-03-21 | 平湖科谱激光科技有限公司 | 一种用于收发器与线路板组件焊接的装置 |
Also Published As
Publication number | Publication date |
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CN100581324C (zh) | 2010-01-13 |
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GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: HUAWEI DEVICE CO., LTD. Free format text: FORMER NAME: SHENZHEN HUAWEI TECHNOLOGY CO. |
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CP01 | Change in the name or title of a patent holder |
Address after: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Patentee after: HUAWEI DEVICE Co.,Ltd. Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Patentee before: Huawei Device Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |
Address after: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee after: Huawei terminal (Shenzhen) Co.,Ltd. Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee before: HUAWEI DEVICE Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20181218 Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: HUAWEI DEVICE Co.,Ltd. Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee before: Huawei terminal (Shenzhen) Co.,Ltd. |
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TR01 | Transfer of patent right |