CN86103056A - 高介电常数瓷质组成物 - Google Patents

高介电常数瓷质组成物 Download PDF

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CN86103056A
CN86103056A CN86103056.7A CN86103056A CN86103056A CN 86103056 A CN86103056 A CN 86103056A CN 86103056 A CN86103056 A CN 86103056A CN 86103056 A CN86103056 A CN 86103056A
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藤原忍
佐藤纯
股部哲也
须藤纯一
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
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    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/495Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
    • C04B35/497Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides
    • C04B35/499Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides containing also titanates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1254Ceramic dielectrics characterised by the ceramic dielectric material based on niobium or tungsteen, tantalum oxides or niobates, tantalates

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Abstract

本发明是关于可将烧结温度降至1000℃以下的Pb(Mg1/3,Nb2/3)O3-PbTiO3-Pb(Mn1/3,Nb2/3)O3体系高介电常数瓷质组 成物,该组成物是由含有Pb(Mg1/3,Nb2/3)O395摩尔 %、PbTiO3、5摩尔%、Pb(Mn1/3,Nb2/3)O3 0.5重量%的主成份与含有PbO与ZnO的副成份所组成。

Description

本发明是有关被使用于分层瓷电容器Pb(Mg1/3,Nb2/3)O3-PbTiO3-Pb(Mn1/3,Nb2/3)O3体系高介电常数瓷质组成物。
传统式的Pb(Mg1/3,Nb2/3)O3-PbTiO3-Pb(Mn1/3Nb2/3)O3体系的瓷电介质,其介电常数εs显示高值,而介质损耗tanδ极小,绝缘电阻IR显示大值,对电气的种种特性颇为良好,但须要1150℃以上的烧结温度与高温区。
因此,烧结时,须要大量的热能,高温下窑设备与焙烧材料的热磨损更加激烈,所以有焙烧装置保全费用(维持费)增高的缺点,再者,在分层瓷电容器制造法上,有将电极嵌入瓷电介质烧结的必要。一般,Ag-Pd合金被使用作为内电极。因此随着电介质材料烧结温度的增高,Pd含有量亦须随着增多,非使用价格昂贵的东西作为电极不可,有导致制造成本上升的缺点。
因此,本发明旨在提供可用1000℃以下的低温烧结的瓷电介质。例如,使用这种瓷电介质作为分层瓷电容器时,可以使用银系(组)、镍系(组)铝系(组)等等廉价而熔点低的金属材料作为嵌入内电极,对于最终产品瓷电容器的制造成本极其有利。
本发明人鉴于上述之要求,经专心研究,发现在Pb(Mg1/3,N2/3)O3-PbTiO3-Pb(Mn1/3,Nb2/3)O3的混合组成物中,添加氧化铅与氧化锌、藉此添加,使烧结温度在1000℃以下的场合,亦可得到具有与传统式同样的各种电气特性之高介常数瓷器。
本发明是Pb(Mg1/3.Nb2/3)O3-PbTiO3-Pb(Mn1/3.Nb2/3)O3体系高介常数瓷质组合物,由含有Pb(Mg1/3.Nb2/3)O395摩尔%,PbTiO35摩尔%、Pb(Mn1/3.Nb2/3)O30.5重量%的主成份与含有PbO及ZnO之副成份所构成。
举一具体的实施例加以说明。在上述副成份中,PbO为ZnO的50~93重量%,而以67~90重量%较好。最理想的是在80~90重量%的范围内。
再者,在实施例中,上述的副成份与上述主成份的比率,在超过0.25重量%(0.25重量%不含在内),而低于1.25重量%(1.25重量%不含在内)的范围中,0.3以上1.25重量%以下亦可,但最理想的是0.5以上,1.25重量%的范围。
图1表示副成份PbO与ZnO之复比(重量%)与电气的各种特性之关系的示意图,图2表示与主成份相对比的副成份之添加量与电气的各种特性之关系的示意图。
现举本发明的一个较具体实施方案,并结合附图说明如下:
使用氧化铅、氧化铌氧化镁、氧化钛、氧化锰作为原始材料,依表1之复比,用合成树脂球磨机将这些原料湿式混合之后,以700~850℃的温度煅烧两小时,使起化学反应,再用球磨机将这些反应物磨成粒径0.2μm~5.0μm左右的微粒。再依表1所示之比率,用球磨机等物另外将氧化铅与氧化锌磨成0.1μm~2.0μm左右的微粒,混合后依表1所示的规定量将之添加于上述的母料粉碎混合物中,再用球磨机将之细磨成0.2μm~3.0μm左右的微粒。
在这些细磨混合物里,适当地添加聚氯乙烯作为烧结材料使成去沫稀浆、再以大约3吨/cm的造型压力将之作成直径16.5mm厚度0.6mm的圆盘形成形物,然后,为防止高温时,铅成份的蒸发,将上述成形物密封在用氧化镁瓷器制成的容器里,用大约950℃的温度正式地焙烧两个小时。然后再将制成的瓷器元件的两个端面烧接上银电极。
依此方法制成的样品,其各种电气特性测定的结果,示于表1上,这里用频率1KHz测定介常数εs及介质损耗tanδ、绝缘电阻以外接500V直流电在20℃的室温下测定之。
Figure 86103056_IMG1
如表1所示,依此法制成的高介电常数,瓷质组成物,其介电常数εs显示约16.500~20.500的高值,介质损耗tanδ约0.8~1.4%的小值,绝缘电阻IR,显示4×10″(Ω)非常大的值,而烧结温度,用950℃的低温度亦可烧结。
图1,以副成份氧化铅PbO与氧化锌ZnO的复比(重量%)为横轴,以各个绝缘电阻logIR,介质损耗tan(%),介电常数εs为纵轴。图2以与主成份相对比之副成份PbO/ZnO的添加量(重量%)为横轴,如前述一般地,以各个logIR、tanδ(%)、εs为纵轴。
由图1、图2可知,副成份组成的范围,即PbO50~93重量%,ZnO7~50重量%之范围外,即在PbO50重量%以下(ZnO超过50重量%)之场合瓷器的烧结性降低,低温度的烧结成为困难。而当PbO超过93重量%的场合(ZnO7重量%以下),烧结性固然甚好,但介电常数εs则急剧降低,本来盼求「高介电常数」的目的,变为不可能。再者,与主成份相对比的副成份添加量(重量%)范围,在0.25以上,1.25重量%以下的范围外,亦即当与主成份相对比的副成份之添加量在0.25重量%以下时,烧结不足够,(但提高烧结温度时,烧结即为可能),添加量在1.25重量%以上时,反应性则反常地提高,局部的反常料成长及垫料与瓷器发生反应,这样,要把它作为具备各种气特性瓷器使用是很困难的。
本发明在已知的Pb(Mg1/3.Nb2/3)O3-PbTiO3-Pb(Mn1/3.Nb2/3)O3体系高介电常数瓷器组成物中,添加PbO与ZnO,作为副成份添加,可能使烧结温度降至1000℃以下。因此,把它使用在分层瓷电容器的场合,可以使用银系(组)、镍系、铝系等较廉价,熔点低的金属作为埋置内电极。因此,较诸传统式高温区烧结材料,在制造费用上,可以减少热能,窑设备焙烧材料的保全费用,对最终产品的价格极为有利。

Claims (7)

1、一种高介电常数瓷质组成物,其特征在于由含有Pb(Mg1/3.Nb2/3)O395摩尔%、PbTiO35摩尔%,Pb(Mn1/3.Nb2/3)O30.5重量%主成份与含有PbO与ZnO之副成份组成Pb(Mg1/3、Nb2/3)O3-PbTiO3-Pb(Mn1/3、Nb2/3)O3体系。
2、按照权利要求1的高介电常数瓷质组成物,其特征在于其副成份中的PbO为ZnO的50-93重量%。
3、按照权利要求1的高介电常数瓷质组成物,其特征在于副成份为主成份的0.25以上1.25重量%以下。
4、按照权利要求2的高介电常数瓷质组成物,其特征在于其副成份中PbO为ZnO的67-90重量%。
5、按照权利要求3的高介电常数瓷质组成物,其特征在于副成份为主成份的0.3以上1.25重量%以下。
6、按照权利要求4的高介电常数瓷质组成物,其特征在于副成份中PbO为ZnO的80-90%。
7、按照权利要求5的高介电常数瓷质组成物,其特征在于副成份主成份的0.5以上1.25重量%以下。
CN86103056A 1985-05-02 1986-04-29 高介电常数瓷质组成物 Expired CN1012730B (zh)

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JPS63185853A (ja) * 1987-01-27 1988-08-01 ティーディーケイ株式会社 高誘電率磁器組成物
US5006956A (en) * 1988-11-07 1991-04-09 Matsushita Electric Industrial Co., Ltd. Dielectric ceramic composition
US5364840A (en) * 1989-12-05 1994-11-15 Vical, Inc. Synthetic calcitonin peptides
JP2564676B2 (ja) * 1990-02-22 1996-12-18 三菱マテリアル 株式会社 電子光学用組成物
KR970008754B1 (en) * 1994-12-23 1997-05-28 Korea Inst Sci & Tech Multilayer ceramic capacitor and production thereof
KR19980040840A (ko) * 1996-11-29 1998-08-17 조희재 저온 소결용 유전체 세라믹스 조성물
KR100324266B1 (ko) * 1999-07-19 2002-02-25 구자홍 고체 표시소자용 유전체후막 조성물
CN114436652B (zh) * 2022-01-28 2023-05-16 厦门乃尔电子有限公司 一种锆钛酸铅-铌钽镁酸铅压电陶瓷材料及其制备方法

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JPS5551761A (en) * 1978-10-06 1980-04-15 Tdk Electronics Co Ltd High dielectric constance ceramic composition
JPS5551760A (en) * 1978-10-06 1980-04-15 Tdk Electronics Co Ltd High dielectric constance ceramic composition
CA1108842A (en) * 1978-10-30 1981-09-15 Kiyoshi Furukawa High dielectric constant type ceramic composition
JPS6031797B2 (ja) * 1980-07-24 1985-07-24 株式会社村田製作所 誘電体磁器組成物
GB2107300B (en) * 1981-07-03 1985-04-24 Standard Telephones Cables Ltd Ceramic capacitors and dielectric compositions
US4530031A (en) * 1984-03-12 1985-07-16 E. I. Du Pont De Nemours And Company Dielectric composition

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