CN2854813Y - 发光二极管的封装结构改良 - Google Patents
发光二极管的封装结构改良 Download PDFInfo
- Publication number
- CN2854813Y CN2854813Y CNU2005201272870U CN200520127287U CN2854813Y CN 2854813 Y CN2854813 Y CN 2854813Y CN U2005201272870 U CNU2005201272870 U CN U2005201272870U CN 200520127287 U CN200520127287 U CN 200520127287U CN 2854813 Y CN2854813 Y CN 2854813Y
- Authority
- CN
- China
- Prior art keywords
- light
- substrate
- chip
- emitting diode
- encapsulating structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2005201272870U CN2854813Y (zh) | 2005-10-21 | 2005-10-21 | 发光二极管的封装结构改良 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2005201272870U CN2854813Y (zh) | 2005-10-21 | 2005-10-21 | 发光二极管的封装结构改良 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2854813Y true CN2854813Y (zh) | 2007-01-03 |
Family
ID=37581449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2005201272870U Expired - Lifetime CN2854813Y (zh) | 2005-10-21 | 2005-10-21 | 发光二极管的封装结构改良 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2854813Y (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101350383B (zh) * | 2007-07-18 | 2011-08-17 | 宁波安迪光电科技有限公司 | 大功率白光发光二极管的封装方法 |
CN102148312B (zh) * | 2010-02-05 | 2015-01-07 | 亿光电子工业股份有限公司 | 发光二极管封装结构及其制造方法和显示装置 |
-
2005
- 2005-10-21 CN CNU2005201272870U patent/CN2854813Y/zh not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101350383B (zh) * | 2007-07-18 | 2011-08-17 | 宁波安迪光电科技有限公司 | 大功率白光发光二极管的封装方法 |
CN102148312B (zh) * | 2010-02-05 | 2015-01-07 | 亿光电子工业股份有限公司 | 发光二极管封装结构及其制造方法和显示装置 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103700652A (zh) | 一种螺旋形led封装灯丝 | |
WO2010066128A1 (zh) | Led小功率发光芯片的封装模块 | |
CN101093068A (zh) | 白光器件及制造方法 | |
CN203659854U (zh) | 一种螺旋形led封装灯丝 | |
CN103700651A (zh) | 高显色led灯丝 | |
CN2867596Y (zh) | 发光二极体模组的结构改良 | |
CN101030610A (zh) | 大功率发光二极管及其荧光粉涂布方法 | |
CN203413560U (zh) | Led灯及其灯丝 | |
CN106195659B (zh) | 一种cob光源及集成模块及灯具 | |
CN202205744U (zh) | 提高多led芯片白光光源显色指数和光通量的封装结构 | |
CN2854813Y (zh) | 发光二极管的封装结构改良 | |
CN201232871Y (zh) | 基于高亮白led的照明发光体 | |
CN2835787Y (zh) | 一种新型彩虹led灯 | |
CN2911965Y (zh) | 白光发光二极管 | |
CN200979881Y (zh) | 大功率发光二极管光源装置及具有该光源装置的灯具 | |
CN201133611Y (zh) | Led与oled相配合的三基色器件 | |
CN201057603Y (zh) | 发光二极体模组的结构改良 | |
CN208862026U (zh) | 一种led产品封装结构 | |
CN203553164U (zh) | 高显色led灯丝 | |
CN2845171Y (zh) | 发光二极体的封装结构 | |
CN209418496U (zh) | 一种集成式led背光源封装结构 | |
CN101567323B (zh) | 一种显示屏用三基色发光二极管的制造方法 | |
CN2723812Y (zh) | 一种可散热式照明装饰灯 | |
CN107799643A (zh) | 一种用于汽车照明的双面发光的cob led | |
CN202662673U (zh) | 一种降低色温漂移的白光led结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Dongguan Oasis Electronic Technology Co., Ltd. Assignor: Lizhou Science-Technology Co., Ltd. Contract fulfillment period: 2008.6.1 to 2015.2.1 Contract record no.: 2009990001299 Denomination of utility model: Improved structure of package of LED Granted publication date: 20070103 License type: Exclusive license Record date: 20091130 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.6.1 TO 2015.2.1; CHANGE OF CONTRACT Name of requester: DONGGUAN LIZHOU ELECTRONIC SCIENCE AND TECHNOLOGY Effective date: 20091130 |
|
CX01 | Expiry of patent term |
Granted publication date: 20070103 |
|
EXPY | Termination of patent right or utility model |