CN2867596Y - 发光二极体模组的结构改良 - Google Patents
发光二极体模组的结构改良 Download PDFInfo
- Publication number
- CN2867596Y CN2867596Y CNU2005201300902U CN200520130090U CN2867596Y CN 2867596 Y CN2867596 Y CN 2867596Y CN U2005201300902 U CNU2005201300902 U CN U2005201300902U CN 200520130090 U CN200520130090 U CN 200520130090U CN 2867596 Y CN2867596 Y CN 2867596Y
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- CN
- China
- Prior art keywords
- light
- supporting part
- different
- emittingdiode
- luminescence chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Led Device Packages (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2005201300902U CN2867596Y (zh) | 2005-11-02 | 2005-11-02 | 发光二极体模组的结构改良 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2005201300902U CN2867596Y (zh) | 2005-11-02 | 2005-11-02 | 发光二极体模组的结构改良 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2006201665304U Division CN201057603Y (zh) | 2005-11-02 | 2005-11-02 | 发光二极体模组的结构改良 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2867596Y true CN2867596Y (zh) | 2007-02-07 |
Family
ID=37703302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2005201300902U Expired - Lifetime CN2867596Y (zh) | 2005-11-02 | 2005-11-02 | 发光二极体模组的结构改良 |
Country Status (1)
Country | Link |
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CN (1) | CN2867596Y (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101354121B (zh) * | 2007-07-25 | 2010-12-08 | 群康科技(深圳)有限公司 | 背光模组 |
CN102881684A (zh) * | 2012-10-15 | 2013-01-16 | 南昌绿扬光电科技有限公司 | 一种led封装结构及方法 |
CN101452917B (zh) * | 2007-12-05 | 2013-02-20 | 财团法人工业技术研究院 | 光源装置 |
CN104009146A (zh) * | 2014-06-09 | 2014-08-27 | 深圳雷曼光电科技股份有限公司 | 一种smd led平板支架结构和led芯片 |
CN104393143A (zh) * | 2014-10-20 | 2015-03-04 | 深圳市迈克光电子科技有限公司 | U形高压360度发光器件及生产工艺 |
CN105826310A (zh) * | 2016-03-17 | 2016-08-03 | 广东华辉煌光电科技有限公司 | 一种大功率led多芯片光源模组 |
-
2005
- 2005-11-02 CN CNU2005201300902U patent/CN2867596Y/zh not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101354121B (zh) * | 2007-07-25 | 2010-12-08 | 群康科技(深圳)有限公司 | 背光模组 |
CN101452917B (zh) * | 2007-12-05 | 2013-02-20 | 财团法人工业技术研究院 | 光源装置 |
CN102881684A (zh) * | 2012-10-15 | 2013-01-16 | 南昌绿扬光电科技有限公司 | 一种led封装结构及方法 |
CN104009146A (zh) * | 2014-06-09 | 2014-08-27 | 深圳雷曼光电科技股份有限公司 | 一种smd led平板支架结构和led芯片 |
CN104393143A (zh) * | 2014-10-20 | 2015-03-04 | 深圳市迈克光电子科技有限公司 | U形高压360度发光器件及生产工艺 |
CN105826310A (zh) * | 2016-03-17 | 2016-08-03 | 广东华辉煌光电科技有限公司 | 一种大功率led多芯片光源模组 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Dongguan Oasis Electronic Technology Co., Ltd. Assignor: Lizhou Science-Technology Co., Ltd. Contract fulfillment period: 2008.6.1 to 2015.2.1 Contract record no.: 2009990001299 Denomination of utility model: Modified luminous diode modular structure Granted publication date: 20070207 License type: Exclusive license Record date: 20091130 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.6.1 TO 2015.2.1; CHANGE OF CONTRACT Name of requester: DONGGUAN LIZHOU ELECTRONIC SCIENCE AND TECHNOLOGY Effective date: 20091130 |
|
CX01 | Expiry of patent term |
Granted publication date: 20070207 |
|
EXPY | Termination of patent right or utility model |