CN2831439Y - Photoelectrical chip encapsulating structure with controlling chip - Google Patents
Photoelectrical chip encapsulating structure with controlling chip Download PDFInfo
- Publication number
- CN2831439Y CN2831439Y CNU2005200186666U CN200520018666U CN2831439Y CN 2831439 Y CN2831439 Y CN 2831439Y CN U2005200186666 U CNU2005200186666 U CN U2005200186666U CN 200520018666 U CN200520018666 U CN 200520018666U CN 2831439 Y CN2831439 Y CN 2831439Y
- Authority
- CN
- China
- Prior art keywords
- chip
- encapsulating structure
- photoelectric
- control chip
- photoelectric chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012780 transparent material Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 45
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000004381 surface treatment Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 230000005496 eutectics Effects 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 9
- 238000009434 installation Methods 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 6
- 238000005538 encapsulation Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004100 electronic packaging Methods 0.000 description 2
- 239000011469 building brick Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to a photoelectrical chip packaging structure with a control chip, which comprises a substrate, a photoelectric chip, a control chip and an outer filling packaging structure, wherein the substrate has a front side and a back side, and an inner circuit is distributed in the substrate. The photoelectric chip is arranged at the front side of the substrate and connected with the inner circuit, the control chip is arranged at the bottom of the photoelectric chip and connected with the substrate, and the control chip is also connected with the inner circuit. The outer filling packaging structure is composed of transparent materials, light sources can be penetrated out or in the outer filling packaging structure, and the outer filling packaging structure is arranged on the substrate and the photoelectric chip and covered on the photoelectric chip. The photoelectrical chip packaging structure having the advantages of easy installation and no interference of external light during light transmission can be used for advertising boards or shielding light and improving the rate of finished products and the quality of package.
Description
Technical field
The utility model relates to a kind of photoelectric chip encapsulating structure with control chip, relates in particular to a kind of photoelectric chip encapsulating structure that control chip is arranged on the bottom of photoelectric chip, joins with base material.
Background technology
In semiconductor packages industry, semiconductor packaging process is very important.Light-emitting diode (LED) and optical sensor packaging industrial also are accompanied by light, thin, short, the little and H.D requirement of electronic product and more show important, and the situation that has half share with conventional semiconductor package is arranged.The encapsulation technology of LED or semiconductor packages industry is constantly weeded out the old and bring forth the new especially, as photoelectric chip encapsulating structure BGA pin position, especially the pin position with control chip that meet surface installation technique (SMT) specification requirement need in its encapsulating structure more also to represent better base material; In like manner, its encapsulation back finished product brightness also is the important techniques requirement.
As use well-known greatly, after the Electronic Packaging technology is meant and completes from semiconductor integrated circuit and light-emitting diode, be contained among the on line structure with other electronic building brick mutual group, become an electronic product, to realize all process steps of a particular design function.The main function of Electronic Packaging has four, is respectively that electric energy transmits (Power Distribution), signal transmits (Signal Distribution), heat radiation (Heat Dissipation) and protection and supports (Protection and Support).As IC integrated circuit (IC) chip encapsulation commonly used and LED encapsulation.
As shown in Figure 1, it is the known photoelectric chip encapsulating structure with control chip, base material 30a adhesion photoelectric chip 20a and control chip 10a, and connect the base material internal circuit, again with the situation (can have several photoelectric chips 40a) of outside filling encapsulating structure 40a encapsulation and encapsulating, but the known photoelectric chip encapsulating structure with control chip 10a is when being installed in the flow process of base material 30a, has inconvenient mounting structure, prepare (material handling) nor be beneficial to material, be that photoelectric chip 40a and control chip 10a need be installed on respectively on the base material, operation is miscellaneous, and shared area is bigger, even influences luminous efficiency.When practical application, the horizontal area shared to packaging body also has negative effect.Therefore be necessary to develop a kind of encapsulating structure and method that is beneficial to fitting operation and can dwindles the horizontal area size, to satisfy requirement of actual application.
For now on the market major part need the light-emitting diode of base material, simplifying installation procedure and minification also be the important requirement of encapsulation process, and luminosity not disturbed by ambient light also be important functional requirement.
Summary of the invention
Main purpose of the present utility model is to provide a kind of have preferable luminous intensity and reduced size, and can make installation process keep having easily the photoelectric chip encapsulating structure of control chip, can be used for having luminous element (as light-emitting diode) or optical sensor with base material mutual encapsulation demand, realize low-cost high-quality packaging effect.
In order to realize above-mentioned purpose, the utility model adopts following technical scheme:
A kind of photoelectric chip encapsulating structure with control chip is characterized in that comprising:
Base material has front and reverse side, and has internal circuit to be distributed in wherein;
Photoelectric chip is arranged on this base material face side, joins with this internal circuit;
Control chip is arranged on the bottom of this photoelectric chip and is connected with base material, and described control chip is connected with this internal circuit; And
Outside filling encapsulating structure by transparent material is constituted, can appear or penetrate light source, is located on this base material and this photoelectric chip, and covers this photoelectric chip.
That the utility model can be used for is backlight, light fixture and advertisement plate or electromagnetic wave field shape detector, has the following advantages:
(1) new process is provided with easily, requiredly adds newly that fully price and specification requirement are neither big;
(2) control chip 10 be hidden in not can stray light electrical chip 20 luminous route place and volume little, easy for installation;
(3) conventional package equipment is still available;
(4) luminous brightness is strong, can cooperate the conventional package operation.
Description of drawings
Below, with embodiment the utility model is further described in conjunction with the accompanying drawings.
Fig. 1 is the schematic diagram of the known photoelectric chip encapsulating structure with control chip;
Fig. 2 is the described performing step schematic diagram with photoelectric chip encapsulating structure of control chip of first embodiment of the present utility model;
Fig. 3 is the described schematic diagram with photoelectric chip encapsulating structure of control chip of first embodiment of the present utility model;
Fig. 4 is the described schematic diagram with photoelectric chip packed part structure of control chip of second embodiment of the present utility model;
Fig. 5 is the described schematic diagram with photoelectric chip encapsulating structure of control chip of the 3rd embodiment of the present utility model.
Embodiment
Fig. 2 and Fig. 3 are first embodiment of the present utility model, and wherein base material 30 can be stepped construction, have front (being generally the face at photoelectric chip 20 places) and reverse side, have internal circuit and are distributed in wherein.Photoelectric chip 20 is arranged on these base material 30 fronts, joins with this control chip 10; This photoelectric chip 20 can be light-emitting diode or optical sensor, and its quantity can be a plurality of.As Fig. 2, shown in Figure 3, earlier photoelectric chip 20 and control chip 10 are joined and be arranged on again on this base material front, control chip 10 is arranged on the bottom of this photoelectric chip 20 and is connected with base material 30, and above-mentioned control chip 10 also is connected with this internal circuit simultaneously; Outside filling encapsulating structure 40 is constituted by transparent material, can appear or penetrate light source, be located at this base material with should (a plurality of) photoelectric chip on, and (a plurality of) photoelectric chip 20 is somebody's turn to do in covering; It can have the external circuits interface, is arranged on a side of this base material or a plurality of predetermined side and is connected with this internal circuit.This external circuits interface can connect near the side that internal circuit and base material 30 be positioned at base material to be installed in the middle of the specific electronic devices.Outside filling encapsulating structure 40 can appear light source, can be strong macromolecular material of light transmission such as resin.
Below, with reference to figure 4 and Fig. 5, change describing the thin portion that other embodiment of the present utility model disclosed in detail.Wherein, this base material 30 can be the superimposed structure of multilayer material.This photoelectric chip 10 can be light-emitting diode or optical sensor.Outside filling encapsulating structure 40 can be polymer composite and constitutes, and can have phosphor powder and be distributed in wherein; This phosphor powder can be the mixing of gold-tinted phosphor powder or green glow phosphor powder or aforementioned two kinds of phosphor powders.This base material 30 can be the copper foil circuit panel material and constitutes.Outside filling encapsulating structure 40 can have reflection box 50 and be located at the edge, so that up assemble luminous.Outside filling encapsulating structure 40 also can have surface treatment; Its surface treatment can be grating or filter coating are set, so that filter or arrangement light.This photoelectric chip 20 can be a plurality of, and this plural number photoelectric chip 20 can be arranged as rectangular or totem pole, as trade mark or advertising thing shape.In addition, can to blend together light be white light to this plural number photoelectric chip 20; The utility model also can further have external circuits interface 35, is arranged on a side of this base material 30 or a plurality of predetermined side or the reverse side of base material 30 and is connected with this internal circuit.Wherein this control chip 10 or this photoelectric chip 20 can be connected by the internal circuit of metal wire 60 with this base material 30 as shown in Figure 4.This control chip 10 or this photoelectric chip 20 can adopt the eutectic structure of metal to metal to be connected with the internal circuit of this base material 30.
The utility model changes traditional 20 encapsulating structures of the photoelectric chip with control chip 10 into control chip 10 is hidden in not luminous route that can stray light electrical chip 20 position, can make things convenient for the assembling of electronic component; A side or a plurality of predetermined side of external circuits interface in a rectangle base material 30 is set; Increase as shown in Figure 5 reflection box 50 or surface treatment such as grating or filter coating, so that optical filtering or arrangement light, make be improved property easy for installation and strengthen luminous intensity of this encapsulating structure, and it is low that cost is set, little to traditional light-emitting diode chip for backlight unit packing producing line influence.
Claims (16)
1. photoelectric chip encapsulating structure with control chip is characterized in that comprising:
Base material has front and reverse side, and has internal circuit to be distributed in wherein;
Photoelectric chip is arranged on this base material face side, joins with this internal circuit;
Control chip is arranged on the bottom of this photoelectric chip and is connected with base material, and described control chip is connected with this internal circuit; And
Outside filling encapsulating structure by transparent material is constituted, can appear or penetrate light source, is located on this base material and this photoelectric chip, and covers this photoelectric chip.
2. the photoelectric chip encapsulating structure with control chip as claimed in claim 1 is characterized in that:
This base material is the superimposed structure of two layers of material at least.
3. the photoelectric chip encapsulating structure with control chip as claimed in claim 1 is characterized in that:
This photoelectric chip is light-emitting diode or optical sensor.
4. the photoelectric chip encapsulating structure with control chip as claimed in claim 1 is characterized in that:
Described outside filling encapsulating structure is constituted by polymer composite.
5. the photoelectric chip encapsulating structure with control chip as claimed in claim 1 is characterized in that:
Described outside filling encapsulating structure has the phosphor powder that is distributed in wherein.
6. the photoelectric chip encapsulating structure with control chip as claimed in claim 5 is characterized in that:
This phosphor powder is the mixing of gold-tinted phosphor powder or green glow phosphor powder or aforementioned two kinds of phosphor powders.
7. the photoelectric chip encapsulating structure with control chip as claimed in claim 1 is characterized in that:
This base material is constituted by the copper foil circuit panel material.
8. the photoelectric chip encapsulating structure with control chip as claimed in claim 1 is characterized in that:
Described outside filling encapsulating structure has the reflection box of being located at the edge.
9. the photoelectric chip encapsulating structure with control chip as claimed in claim 1 is characterized in that:
Described outside filling encapsulating structure has surface treatments.
10. the photoelectric chip encapsulating structure with control chip as claimed in claim 9 is characterized in that:
The surface treatment of described outside filling encapsulating structure is for being provided with grating or filter coating.
11. the photoelectric chip encapsulating structure with control chip as claimed in claim 1 is characterized in that:
This photoelectric chip is a plurality of.
12. the photoelectric chip encapsulating structure with control chip as claimed in claim 11 is characterized in that:
This plural number photoelectric chip and be rectangular.
13. the photoelectric chip encapsulating structure with control chip as claimed in claim 11 is characterized in that:
It is white light that this plural number photoelectric chip blendes together light.
14. the photoelectric chip encapsulating structure with control chip as claimed in claim 11 is characterized in that:
This base material has the external circuits interface, is arranged on a side of this base material or a plurality of predetermined side or the reverse side of base material and is connected with this internal circuit.
15. the photoelectric chip encapsulating structure with control chip as claimed in claim 1 is characterized in that:
This control chip or this photoelectric chip are connected with the internal circuit of this base material by metal wire.
16. the photoelectric chip encapsulating structure with control chip as claimed in claim 1 is characterized in that:
This control chip or this photoelectric chip adopt the eutectic structure of metal to metal to be connected with the internal circuit of this base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005200186666U CN2831439Y (en) | 2005-05-20 | 2005-05-20 | Photoelectrical chip encapsulating structure with controlling chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005200186666U CN2831439Y (en) | 2005-05-20 | 2005-05-20 | Photoelectrical chip encapsulating structure with controlling chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2831439Y true CN2831439Y (en) | 2006-10-25 |
Family
ID=37136367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2005200186666U Expired - Fee Related CN2831439Y (en) | 2005-05-20 | 2005-05-20 | Photoelectrical chip encapsulating structure with controlling chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2831439Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108766974A (en) * | 2018-08-08 | 2018-11-06 | 苏州晶方半导体科技股份有限公司 | A kind of chip-packaging structure and chip packaging method |
-
2005
- 2005-05-20 CN CNU2005200186666U patent/CN2831439Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108766974A (en) * | 2018-08-08 | 2018-11-06 | 苏州晶方半导体科技股份有限公司 | A kind of chip-packaging structure and chip packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061025 Termination date: 20100520 |