CN2859807Y - Photoelectricity chip array form packaging constitution - Google Patents
Photoelectricity chip array form packaging constitution Download PDFInfo
- Publication number
- CN2859807Y CN2859807Y CNU2005200186878U CN200520018687U CN2859807Y CN 2859807 Y CN2859807 Y CN 2859807Y CN U2005200186878 U CNU2005200186878 U CN U2005200186878U CN 200520018687 U CN200520018687 U CN 200520018687U CN 2859807 Y CN2859807 Y CN 2859807Y
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- CN
- China
- Prior art keywords
- packaging structure
- base material
- photoelectric chip
- photoelectric
- chip matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title claims description 44
- 230000005622 photoelectricity Effects 0.000 title 1
- 239000012780 transparent material Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 36
- 238000004381 surface treatment Methods 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 6
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004100 electronic packaging Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001149 cognitive effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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Abstract
A photoelectric chip array package structure comprise: substrate, in which internal circuit is distributed, multiple photoelectric chip, which is mounted on the front face of substrate and connected with the internal circuit, outer filling package structure mounted on the substrate and multiple photoelectric chips and covering the chips, made of transparent material capable of penetrating in or out light source, outer circuit interface touch point, mounted on a side edge of substrate or multiple presetted side edge and connected with internal circuit. The present utility is easy to assemble and is used in advertisement board and improve package eligibility and quality. Electronic chip package need is easy to achieve by using light-emitting diode or photosensor chip package. The present utility can solve the problem of brightness and that traditional photoelectric chip array package structure has overabundant joint.
Description
Technical field
The utility model is relevant for a kind of photoelectric chip matrix-like packaging structure, the packaging structure that promptly comprises semiconductor or luminous element, the advantage that not disturbed by ambient light mainly is that the method for utilizing external circuits interface contact to be located at a side of packaging body is improved property easy for installation and outer frame device and prevented that ambient light from disturbing; And more known photoelectric chip matrix-like packaging structure is good.
Background technology
In packaging industrial, what attract attention is semiconductor packages, and light-emitting diode (LED) and optical sensor packaging industrial also are accompanied by light, thin, short, the little and H.D requirement of electronic product and more show important simultaneously, and the situation that has half share with semiconductor packages is more arranged.The encapsulation technology of LED or semiconductor packages industry is more weeded out the old and bring forth the new, as the photoelectric chip matrix-like packaging structure BGA pin position, especially the pin position that meet surface mount technology (SMT) specification requirement need in its packaging structure more also to represent better base material; In like manner its encapsulation back finished product brightness also is important requirement.
As use popular cognitive, after the electronic packaging technology is meant and completes from semiconductor integrated circuit and light-emitting diode, be loaded among the on line structure with other electronic component mutual group, become an electronic product, to reach all processing procedures of a particular design function.The main function of electronic packaging has four aspects, is respectively that electric energy transmits (Power Distribution), signal transmits (Signal Distribution), heat abstraction (Heat Dissipation) and protection support (Protection and Support).As be usually used in IC integrated circuit (IC) chip encapsulation and LED encapsulation.
Please refer to as described in Figure 1, it is known photoelectric chip matrix-like packaging structure, base material 10a sticks together photoelectric chip 40a, and connect the base material internal circuit again with the situation (can have several photoelectric chips 40a) of outside hull shape packaging structure 20a encapsulation and encapsulating, but face when being installed on the printed circuit board (PCB) flow process, traditional photoelectric chip matrix-like packaging structure is in the face of taking BGA mount technology and the too much problem of contact and the brightness problem of cost, control as BGA contact solderability, sticked together the substrate structure that stress applies and perhaps can be twisted (base material is too thin to be taken place often), when practical application, can influence precision, and the encapsulation yield is also had negative effect.Therefore be necessary to develop a kind of requirement that the encapsulating structure of installing and construct tough and high brightness comes realistic application that is beneficial to.
Therefore, for now on the market major part need the light-emitting diode of base material, sealing, easily install and tool configuration intensity also becomes the important need in the encapsulation process, and it is important functional requirement also that luminosity is not disturbed by ambient light, causes the inventor to reach above-mentioned demand through making great efforts to develop the utility model.
Summary of the invention
Main purpose of the present utility model is to provide a kind of installation easy, and can keep the photoelectric chip matrix-like packaging structure (can be used for advertisement plate or electromagnetic wave field shape detector) of high brightness, the luminous element (as light-emitting diode) or the optical sensor that can be used for tool and base material mutual encapsulation demand can provide low-cost high-quality processing procedure encapsulation effect.
In order to reach above-mentioned purpose, it serves as main structure to have external circuits interface, side contact base material or outer frame device that the utility model provides a kind of, cooperate conventional package processing procedure and the low ancillary equipment of processing procedure difficulty, respectively this fabrication steps combines and develops and the utility model.
The utility model structure comprises: base material, have front and reverse side, and have internal circuit and be distributed in wherein; A plurality of photoelectric chips, last and this internal circuit that is arranged at this base material front joins; Outside filling packaging structure by transparent material is constituted, can appear or penetrate light source, is located on this base material and these a plurality of photoelectric chips, and covers these a plurality of photoelectric chips; And external circuits interface contact, be arranged at one of this base material side or a plurality of predetermined side and be connected with this internal circuit.
The utility model has following advantage: (1) new processing procedure is provided with easily, requiredly newly add the side of price and neither big (2) the external circuits interface of specification requirement contact fully that the luminous brightness of the sealing of structure, property easy for installation good (3) conventional package equipment still available (4) is set is strong, can cooperate the conventional package processing procedure.
In order to enable further to understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet shown in accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the utility model is limited.
Description of drawings
Fig. 1 is the schematic diagram of known photoelectric chip matrix-like packaging structure;
Fig. 2 is the schematic diagram of the utility model embodiment photoelectric chip matrix-like packaging structure; And
Fig. 3 is the schematic diagram of another embodiment of the utility model photoelectric chip matrix-like packaging structure.
Symbol description among the figure:
The outside hull shape packaging structure of 10a base material 20a
10 base materials, 20 outside filling packaging structures
40 photoelectric chips, 50 external circuits interface contacts
70 surface treatments of 60 reflection box
Embodiment
Please refer to Fig. 2 is embodiment of the present utility model, wherein base material 10 can be lit-par-lit structure, have the front and (be generally the face of photoelectric chip 40, application examples at photoelectric chip 40, can be light-emitting diode or optical sensor) and reverse side, have internal circuit and be distributed in wherein (part can be considered the pattern of printed circuit board (PCB) as described in the lines on the figure); A plurality of photoelectric chips 40 are arranged on this base material front and join with this internal circuit; Outside filling packaging structure 20 by transparent material is constituted, can appear or penetrate light source, is located on this base material and these a plurality of photoelectric chips, and covers these a plurality of photoelectric chips 40; And external circuits interface contact 50 (near the connection of circuit board installation place that can connect lead and base material 10 opposite sides), be arranged at one of this base material side or a plurality of predetermined side and be connected with this internal circuit.Outside filling packaging structure 20 can appear light source, can be strong macromolecular material of light transmission such as resin.See through Fig. 2 and Fig. 3 of this specification, can find out general main structure of the present utility model.
Embodiment of the present utility model thin portion variation and while below will be described in detail in detail with reference to figure 3; Wherein this base material can be the structure of multilayer build-up; Wherein this photoelectric chip can be light-emitting diode or optical sensor; Wherein outside filling packaging structure can be polymer composite and constitutes; Wherein base material can be rectangle and external circuits interface contact, can be arranged at one of this rectangle base material side or a plurality of predetermined side; Wherein this base material can be the copper foil circuit panel material and constitutes; Wherein this external circuits interface contact can be located at the front or the reverse side of this base material side; Wherein outside filling packaging structure can have reflection box 60 and be located at the edge, is beneficial to prevent that ambient light from disturbing and optically focused (up assembling luminous) effect; Wherein outside filling packaging structure can have surface treatment 70; The surface treatment of wherein outside filling packaging structure can be grating or filter coating (filtering or arrangement light) are set; The spread geometry that wherein a plurality of photoelectric chip spread geometries can be rectangular or constitute with figure, numeral, literal is as trade mark or advertising thing shape.
Feature of the present utility model and convenience are, change traditional photoelectric chip matrix-like packaging structure encapsulation into external circuits interface contact, can be arranged at one of this rectangle base material side or a plurality of predetermined side; Reach increase reflection box 60 or surface treatment 70 as grating or filter coating (filtering or arrangement light), make packaging structure be improved sealing, property easy for installation and strengthen luminous intensity, and it is low and little to traditional light-emitting diode chip for backlight unit packing producing line influence that cost is set.
The plant equipment that side that must know external circuits of the present utility model interface contact is provided with structure and increases reflection box 60 or surface treatment 70 is not high price or the equipment that is difficult for obtaining, therefore of the present utility model the setting easily; And substrate structure of the present utility model is taken into account luminous intensity and is constructed tough and tensile; The utility model is little to the process sequence influence of conventional package program simultaneously, can incorporate fully in the middle of the old canned program, and old encapsulation board need significantly not revised, and makes the useful creation of actual state for meeting.
In sum, the utility model is a rare utility model product in fact, has usability on the industry, novelty and progressive, meets the utility application important document fully, files an application according to Patent Law.
Claims (11)
1. a photoelectric chip matrix-like packaging structure is characterized in that, comprises:
Base material has front and reverse side, has internal circuit and is distributed in wherein;
A plurality of photoelectric chips, last and this internal circuit that is arranged at this base material front joins;
Outside filling packaging structure by transparent material is constituted, can appear or penetrate light source, is located on this base material and these a plurality of photoelectric chips, and these a plurality of photoelectric chips of covering; And
External circuits interface contact is arranged at one of this base material side or a plurality of predetermined side and is connected with this internal circuit.
2. photoelectric chip matrix-like packaging structure as claimed in claim 1 is characterized in that this base material is the structure of multilayer build-up.
3. photoelectric chip matrix-like packaging structure as claimed in claim 1 is characterized in that this photoelectric chip is light-emitting diode or optical sensor.
4. photoelectric chip matrix-like packaging structure as claimed in claim 1 is characterized in that outside filling packaging structure is constituted by polymer composite.
5. photoelectric chip matrix-like packaging structure as claimed in claim 1 is characterized in that, base material is rectangle and external circuits interface contact, is arranged at one of this rectangle base material side or a plurality of predetermined side.
6. photoelectric chip matrix-like packaging structure as claimed in claim 1 is characterized in that this base material is constituted by the copper foil circuit panel material.
7. photoelectric chip matrix-like packaging structure as claimed in claim 1 is characterized in that this external circuits interface contact can be located at the front or the reverse side of this base material side.
8. photoelectric chip matrix-like packaging structure as claimed in claim 1 is characterized in that outside filling packaging structure has reflection box and is located at the edge.
9. photoelectric chip matrix-like packaging structure as claimed in claim 1 is characterized in that outside filling packaging structure has surface treatment.
10. photoelectric chip matrix-like packaging structure as claimed in claim 9 is characterized in that the surface treatment of outside filling packaging structure is for being provided with grating or filter coating.
11. photoelectric chip matrix-like packaging structure as claimed in claim 1 is characterized in that a plurality of photoelectric chip spread geometries are rectangular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005200186878U CN2859807Y (en) | 2005-05-18 | 2005-05-18 | Photoelectricity chip array form packaging constitution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005200186878U CN2859807Y (en) | 2005-05-18 | 2005-05-18 | Photoelectricity chip array form packaging constitution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2859807Y true CN2859807Y (en) | 2007-01-17 |
Family
ID=37612665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2005200186878U Expired - Fee Related CN2859807Y (en) | 2005-05-18 | 2005-05-18 | Photoelectricity chip array form packaging constitution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2859807Y (en) |
-
2005
- 2005-05-18 CN CNU2005200186878U patent/CN2859807Y/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070117 Termination date: 20120518 |