CN101866912A - Luminous device - Google Patents
Luminous device Download PDFInfo
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- CN101866912A CN101866912A CN200910247043A CN200910247043A CN101866912A CN 101866912 A CN101866912 A CN 101866912A CN 200910247043 A CN200910247043 A CN 200910247043A CN 200910247043 A CN200910247043 A CN 200910247043A CN 101866912 A CN101866912 A CN 101866912A
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- emitting device
- spacer structure
- luminescence unit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Abstract
The invention relates to a luminous device which comprises at least one first substrate, a plurality of luminous units and a spacing structure. The luminous units are arranged in two dimensions on the first substrate, each luminous unit is provided with at least one LED crystal grain in wire bonding or flip chip bonding on the first substrate, and the spacing structure is correspondingly arranged on the periphery of each luminous unit. Accordingly, the luminous device is provided with a plurality of LED crystal grains in direct wire bonding or flip chip bonding on the first substrate so that the distance among the LED crystal grains can be effectively shortened compared with a publically-known technology, and the resolution of the luminous device can be further improved to improve the display quality.
Description
Technical field
The present invention relates to a kind of light-emitting device, particularly a kind of light-emitting device with LED crystal particle.
Background technology
Since light-emitting diode (Light Emitting Diode, LED) since the beginning commercialization, since have the life-span long, power consumption is few, the heating degree is little, so its range of application spreads all over the every articles for use in the daily life, as the indicator light of tame electrical article and various instrument or light source etc.In recent years, because of the development of multicolour and high brightnessization, range of application is more towards outdoor display development, for example large-scale outdoor display billboard and traffic signal light.
As shown in Figure 1, a kind of known light-emitting device 1 comprises a circuit board 11, a plurality of light-emitting diode 12 and a connector 13.Described light-emitting diode 12 is arranged on the circuit board 11, connector 13 is arranged on the edge of circuit board 11 and can utilizes a plurality of leads 131 and other electronic building brick (for example another circuit board) to electrically connect, and also can will driving signal by lead 131, to be sent to circuit board 11 luminous to drive described light-emitting diode 12.
Yet lead 131 is walked around the side of circuit board 11, therefore visually seems not attractive in appearance.And when desiring with light-emitting device 1,, make that the spacing between the described light-emitting diode 12 is difficult to dwindle further because described light-emitting diode 12 has encapsulated and finished as display unit, therefore, also cause the resolution of light-emitting device 1 also can't effectively promote.
Therefore, how known stereotype of escape and the light-emitting device of designing new architecture have become current important topic to reach the demand that improves display quality.
Summary of the invention
The purpose of this invention is to provide a kind of light-emitting device that can promote display quality.
The present invention can realize by the following technical solutions.
A kind of light-emitting device of the present invention comprises at least one first substrate, a plurality of luminescence unit and a spacer structure.Described luminescence unit be two-dimensional arrangements and position at first substrate, each luminescence unit has at least one LED crystal particle, the LED crystal particle routing engage or chip bonding at first substrate.The spacer structure correspondence be arranged on each luminescence unit around.
Aforesaid light-emitting device, wherein said light-emitting device are a display unit, a lighting device, a backlight module or a striation.
Aforesaid light-emitting device wherein has a gap or very close to each other between the described spacer structure of two adjacent luminescence unit correspondences.
Aforesaid light-emitting device, wherein said spacer structure are arranged on described first substrate.
Aforesaid light-emitting device, wherein said spacer structure is arranged on around each luminescence unit continuously or discontinuously.
Aforesaid light-emitting device, wherein said spacer structure and described luminescence unit center have a beeline, and the total length of described spacer structure is greater than three times of described beeline.
Aforesaid light-emitting device also comprises: one second substrate is provided with the described first substrate subtend.
Aforesaid light-emitting device, wherein said second substrate has a shielding layer, and it is corresponding to described luminescence unit that described shielding layer has a plurality of openings difference.
Aforesaid light-emitting device also comprises: a conductive component is arranged between described first substrate and described second substrate, and electrically connects described first substrate and described second substrate.
Aforesaid light-emitting device, the material of wherein said spacer structure comprise metal or alloy or macromolecular material or plastics or pottery or glass.
Aforesaid light-emitting device, wherein said first substrate has a shielding layer, and described shielding layer and described LED crystal particle are arranged on the same side of described first substrate, and it is corresponding to described luminescence unit to have a plurality of openings difference.
Aforesaid light-emitting device, wherein said first substrate also has a circuit layer, and described LED crystal particle and described circuit layer electrically connect.
Aforesaid light-emitting device, wherein said first substrate also has a patterned layer, and described spacer structure is arranged on described patterned layer.
Aforesaid light-emitting device, the material of wherein said patterned layer comprises copper.
Aforesaid light-emitting device, the height of wherein said spacer structure is greater than the height of described LED crystal particle.
Another kind of light-emitting device of the present invention comprises at least one first substrate, a plurality of luminescence unit and a spacer structure.First substrate has a substrate body and a patterned layer, and patterned layer is arranged on substrate body.Luminescence unit be two-dimensional arrangements and the position at first substrate, each luminescence unit has at least one LED crystal particle.The spacer structure correspondence be arranged on each luminescence unit around, and contraposition is arranged on the patterned layer, and the adhesive force of the material of spacer structure and patterned layer is greater than the adhesive force of spacer structure material and substrate body.
Aforesaid light-emitting device wherein has a gap or very close to each other between the described spacer structure of two adjacent luminescence unit correspondences.
Aforesaid light-emitting device, wherein said spacer structure is arranged on around each luminescence unit continuously or discontinuously.
Aforesaid light-emitting device, wherein said spacer structure and described luminescence unit center have a beeline, and the total length of described spacer structure is greater than three times of described beeline.
Aforesaid light-emitting device, the material of wherein said spacer structure comprises copper or tin.
Aforesaid light-emitting device, the material of wherein said patterned layer comprises copper.
Aforesaid light-emitting device, the height of wherein said spacer structure is greater than the height of described LED crystal particle.
By technique scheme, light-emitting device of the present invention has following advantage at least:
From the above, according to light-emitting device of the present invention have that the direct routing of a plurality of LED crystal particle engages or chip bonding at first substrate, spacing between the described whereby LED crystal particle is compared at known technology and can be dwindled effectively, and then the resolution that can improve light-emitting device is to improve display quality.In addition, light-emitting device of the present invention more by a spacer structure correspondence be arranged on each luminescence unit around, whereby,, can avoid the light between the different luminescence units to influence the problem that causes interference (cross talk) each other when light-emitting device during as display unit.And when light-emitting device during as backlight module, spacer structure then can be used as the glue-guard structure of encapsulating material to the described LED crystal particle is set, and uses and simplifies processing procedure and reduce cost of manufacture.
In addition, the material by spacer structure and the adhesive force of patterned layer can allow spacer structure aim at (self-align) automatically with patterned layer automatically greater than the adhesive force of spacer structure material and substrate body, promote processing procedure efficient greatly and reduce cost.
Description of drawings
Fig. 1 is a kind of schematic diagram of known light-emitting device;
Fig. 2 is the schematic diagram of the light-emitting device of first embodiment of the invention;
Fig. 3 A to Fig. 3 D is the schematic diagram of the different aspects of light-emitting device of first embodiment of the invention;
Fig. 4 A is the profile of the light-emitting device of second embodiment of the invention, and Fig. 4 B is the vertical view of the structure on first substrate of light-emitting device of second embodiment of the invention;
Fig. 5 is the profile of the light-emitting device of third embodiment of the invention; And
Fig. 6 A is the schematic top plan view of the light-emitting device of fourth embodiment of the invention, and Fig. 6 B is the described first substrate junction part enlarged drawing of the light-emitting device of fourth embodiment of the invention.
The main element symbol description:
1,2,2a～2d, 3,4,5: light-emitting device
11: circuit board
12: light-emitting diode
13: connector
131: lead
21,31,41,51: the first substrates
22,22a, 22b, 32,42,52: luminescence unit
221,321,421: LED crystal particle
23,23a, 23d, 33,43: spacer structure
311,411: circuit layer
312,442: connection gasket
313,443: guide hole
314: repair pad
315: patterned layer
34,44,54: the second substrates
341,416: shielding layer
35,35a, 45,45a: driven unit
36,46: link glue
37,47: encapsulating material
444: the reflector
48: conductive component
B: substrate body
D: gap
H: opening
M: center
S: beeline
Embodiment
Hereinafter with reference to correlative type, the light-emitting device according to the preferred embodiment of the present invention is described, wherein identical assembly will be illustrated with identical symbol.
First embodiment
Please refer to shown in Figure 2, the schematic top plan view of the light-emitting device 2 of first embodiment of the invention.Light-emitting device 2 for example can be a display unit, a traffic sign, a lighting device or a striation or a backlight module, is not limited at this.Light-emitting device 2 comprises at least one first substrate 21, a plurality of luminescence unit 22 and a spacer structure 23.
The material of first substrate 21 can comprise glass or sapphire or quartzy or pottery or glass fibre or resinousness material or metal or macromolecular material.At this, the material of first substrate 21 is not limited, and is that a printed circuit board (PCB) is an example with first substrate 21.
Described luminescence unit 22 be two-dimensional arrangements and position at first substrate 21, each luminescence unit 22 has at least one LED crystal particle 221, LED crystal particle 221 routings engage (wirebonding) or chip bondings (flip chip) at first substrate 21.In the present embodiment, have a LED crystal particle 221 with each luminescence unit 22, and LED crystal particle 221 chip bondings explain at first substrate 21, so it is non-limiting.Wherein, LED crystal particle 221 for example can be that ruddiness or green glow or blue light or blue green light or other can send LED crystal particle or its combination of visible light.And the light that makes each luminescence unit 22 be sent is monochromatic light or mixed light (for example being white light).In addition, luminescence unit 22 also can be a striation (light bar does not show among the figure), and just a plurality of LED crystal particle are arranged on a microscler circuit board after encapsulation, striation is arranged on first substrate 21 again.
Please refer to shown in Fig. 2 and Fig. 3 A, wherein Fig. 3 A is another aspect schematic top plan view of light-emitting device 2a of present embodiment.Spacer structure 23,23a correspondence be arranged on each luminescence unit 22 around, and be arranged on first substrate 21, and spacer structure 23,23a can be discontinuously or continuously (shown in Fig. 2 to Fig. 3 C) be arranged on around each luminescence unit 22.Continuous spacer structure 23a can form a closed curve, and its shape can be in fact square or rectangle or circular or triangle or hexagon or polygon, is example at this with square, and so it is non-limiting.In addition, spacer structure 23,23a and luminescence unit 22 center M can have a beeline S, and the total length of spacer structure 23,23a is greater than three times of described beeline S.
Wherein, luminescence unit 22 center M represent the position of centre of gravity that the LED crystal particle 221 of luminescence unit 22 is arranged in fact.Is example at this with a LED crystal particle 221, and therefore, luminescence unit 22 center M ascend the throne at the position of centre of gravity of LED crystal particle 221.Shown in Fig. 3 B and Fig. 3 C the different aspect schematic diagrames of light-emitting device 2b, 2c.Shown in Fig. 3 B, if luminescence unit 22a is when having two LED crystal particle 221, the center M of luminescence unit 22a then can the corresponding described LED crystal particle 221 common position of centre of gravitys that form, and the position is between two LED crystal particle 221.Shown in Fig. 3 C, when if luminescence unit 22b has three LED crystal particle 221, similarly, the corresponding described LED crystal particle 221 common position of centre of gravitys that form of the center M of luminescence unit 22b meeting, and the position is between three LED crystal particle 221.
Referring again to shown in Figure 2,23 of the described spacer structures of two adjacent luminescence unit 22 correspondences have a clearance D.Certainly, 23 of the described spacer structures of two adjacent luminescence unit 22 correspondences can not have the gap yet, and shown in Fig. 3 D, the adjacent two spacer structure 23d of light-emitting device 2d do not have the gap on directions X or Y direction.In addition, two spacer structure 23d yet can not have the gap or do not having the gap on the Y direction on the directions X.In the gapless aspect of two spacer structure 23d, first substrate 21 of same area can be provided with more luminescence unit 22, and gapped or gapless aspect can be selected according to actual demand.
In addition, the height of spacer structure 23 is greater than the height of LED crystal particle 221.With red light emitting diodes crystal grain is example, it is 200 μ m highly approximately, if also need add the height of upper conductor with the routing juncture be 50 μ m approximately, so the height of spacer structure 23 needs to interfere with each other (crosstalk) greater than 250 μ m with the light of avoiding each luminescence unit 22 to be sent.
The material of spacer structure 23 comprises metal or alloy or macromolecular material or plastics or pottery or glass etc.Wherein, the material of metal for example can be copper or tin.And spacer structure 23 can utilize ejection formation (material for example utilizes macromolecular material or plastics), ink jet printing (material for example utilizes macromolecular material) or wire mark after sintering modes such as (material for example utilize pottery or glass) form.
Therefore, light-emitting device 2 is by LED crystal particle 221, with direct routing engage or chip bonding at first substrate 21, can make the spacing between the described luminescence unit 22 compare at known technology and can dwindle significantly, therefore, the resolution of light-emitting device 2 can further improve, and improves display quality, picture element size (pixel size) even can be less than 3mm.In addition, light-emitting device 2 more by a spacer structure 23 correspondences be arranged on each luminescence unit 22 around, whereby,, can avoid the light between the different luminescence units 22 interfering with each other when light-emitting device 2 during as display unit, cause the problem of colour cast.And when light-emitting device 2 during as backlight module, 23 of spacer structures can be used as the glue-guard structure of encapsulating material to the LED crystal particle 221 is set, and then can simplify processing procedure whereby and reduce cost of manufacture.
Second embodiment
Please refer to shown in Fig. 4 A and Fig. 4 B, wherein Fig. 4 A is the generalized section of the light-emitting device 3 of second embodiment of the invention, and Fig. 4 B is the part schematic top plan view of the structure on first substrate 31 of light-emitting device 3.Light-emitting device 3 comprises one first substrate 31, a plurality of luminescence unit 32, a spacer structure 33 and one second substrate 34.Second substrate 34 and the 31 subtend settings of first substrate are to protect described luminescence unit 32, and each luminescence unit 32 also has a plurality of LED crystal particle 321.In addition, in the present embodiment, light-emitting device 3 explains with display unit.
At this, be bonded on first substrate 31 with LED crystal particle 321 routings and explain, so it is non-limiting.Described LED crystal particle 321 for example can be the LED crystal particle of ruddiness or green glow or blue light or blue green light or other visible light, and the demand of visual product and being made up.First substrate 31 or second substrate 34 also can be provided with fluorescence coating to form required coloured light.In addition, light-emitting device 3 is as display unit, and described luminescence unit 32 can correspondence be a plurality of picture elements (pixel) P, and wherein, each luminescence unit 32 can comprise three LED crystal particle 321 such as ruddiness, blue light and green glow, can mixed light and form white light.Certainly, the quantity of LED crystal particle 321 also can be four, and two red light-emitting diode crystal grain 321 are for example mixed the LED crystal particle 321 of a green glow and a blue light again.By, the size of LED crystal particle 321 is less, so can make the size of luminescence unit 32 significantly dwindle, so that the size of the picture element of luminescence unit 32 correspondences is dwindled, for example the size of picture element can have only 0.5mm to 1mm, to improve resolution.
The material of second substrate 34 can comprise glass or sapphire or quartzy or pottery or glass fibre or light-transmitting materials such as resinousness material or macromolecular material, at this, is that glass substrate is an example with second substrate 34.Therefore, the light that described luminescence unit 32 is sent can be penetrated by second substrate 34, and the user can watch the shown picture of light-emitting device 3 by the bright dipping side of second substrate 34.
In addition, second substrate 34 can have a shielding layer 341, the material of shielding layer 341 can be photoresistance or macromolecule or materials such as pottery or metal, its correspondence is arranged on the projected position of spacer structure 33, in order to avoid stop the light that luminescence unit 32 is sent, shielding layer 341 also has a plurality of opening H difference correspondences at described luminescence unit 32.Shielding layer 341 can be used as black-matrix layer (black matrix), and its side that is connected with second substrate 34 can be a black, and a side of facing first substrate 31 then is a white.Whereby, one side of shielding layer 341 black can absorb the light that external environment condition is injected, and a side of white can be with the light reflected back luminescence unit 32 of LED crystal particle 321, penetrate so that the light that luminescence unit 32 sends is concentrated by opening H, can improve the contrast (contrast ratio) of the display frame of light-emitting device 3 whereby.What deserves to be mentioned is that shielding layer 341 also can be arranged on first substrate 31, and be arranged on the outside of spacer structure 33 relatively at luminescence unit 32.
Shown in Fig. 4 B, spacer structure 33 has a beeline S equally with the center M of luminescence unit 32, and the total length of spacer structure 33 is greater than three times of described beeline S.Wherein, be example at this with four LED crystal particle 321, therefore, the corresponding described LED crystal particle 321 common position of centre of gravitys that form of luminescence unit 32 center M meeting, and the position is between four LED crystal particle 321.In addition, 33 of the described spacer structures of two adjacent luminescence unit 32 correspondences also have clearance D.What deserves to be mentioned is, spacer structure 33 on being arranged on first substrate 31, also can be arranged on second substrate 34 in response to different requirements.
In addition, first substrate 31 can have a circuit layer 311 and a plurality of connection gasket 312.First substrate 31 for example can be single layer board or multilayer circuit board, is example with the multilayer circuit board at this.And circuit layer 311 can pass through guide hole (via) 313 conductings.Connection gasket 312 can utilize the wire mark mode to be formed on first substrate 31.LED crystal particle 321 can be earlier and connection gasket 312 electrically connect, electrically connect with circuit layer 311 via guide hole 313 again.
Shown in Fig. 4 B, first substrate 31 also can have a plurality of repairing pads (repairing pads) 314, with described connection gasket 312 corresponding settings, when wherein a LED crystal particle 321 is damaged, repair pad 314 for two that get final product short circuit LED crystal particle 321 correspondences respectively.Thus, if described LED crystal particle 321 is to be connected in series, light-emitting device 3 can't because of wherein one damage and fully can't be luminous, to save cost and to avoid waste of material.
In addition, first substrate 31 also can have a patterned layer (patterned layer) 315, and spacer structure 33 is arranged on the patterned layer 315.Wherein, the material of patterned layer 315 comprises copper.Certainly, patterned layer 315 can with circuit layer 311 with layer or different layers, this with patterned layer 315 with circuit layer 311 different layers and do not have that to electrically connect be example, so it is non-limiting.And at this, patterned layer 315 is arranged on a substrate body B of first substrate 31, and patterned layer 315 can be arranged on the substrate body B or in the substrate body B, be example at this with the upper surface that is arranged on substrate body B.
If the material of spacer structure 33 is a tin, when spacer structure 33 is arranged on the patterned layer 315 that material is a copper, can form between patterned layer 315 and the spacer structure 33 for example is Jie's metallic compound (Inter-MetalCompound of a tinization three bronze medals (Cu3Sn) or five tinization, six bronze medals (Cu6Sn5), IMC), when wire mark is formed on first substrate 31 tin cream reflow (reflow) as spacer structure 33, tin cream can because form Jie's metallic compound so aim at (self-align) with patterned layer 315 automatically.Therefore, setting by patterned layer 315, can around described luminescence unit 32, form the spacer structure 33 of self-contraposition (self alignment), with the mistake of avoiding in the known technology being produced when structure 33 directly utilizes wire mark to be provided with at interval of crossing, and can't accurately be arranged on described LED crystal particle 321 around.
Certainly, the relation between above-mentioned spacer structure 33 and the patterned layer 315 only illustrates, and is not the material of limit interval structure 33 and patterned layer 315.More broadly, the spacer structure 33 of present embodiment can form the phenomenon of self-contraposition on patterned layer 315, mainly due to the adhesive force (adhesion) of spacer structure 33 and patterned layer 315 greater than the adhesive force of spacer structure 33 with substrate body B material (or patterned layer 315 material around), make the material of spacer structure 33 attached on the patterned layer 315, but not be diffused on the material around of patterned layer 315.Is example with the material of first substrate 31 with the circuit board of FR-4, and FR-4 is mainly formed by glass fibre blending epoxy (epoxy), and the green lacquer of printing insulation is arranged on it.Just spacer structure 33 and the adhesive force of patterned layer 315 is greater than the adhesive force of spacer structure 33 with glass fibre or epoxy resin or green lacquer, and makes spacer structure 33 attached to patterned layer 315.
In addition, also can be between the present embodiment less than the adhesive force between spacer structure 33 and the patterned layer 315 every the cohesive force (cohesion) of structure 33, make spacer structure 33 not form spherical and can be attached to patterned layer 315.
The material by spacer structure and the adhesive force of patterned layer can allow spacer structure aim at (self-align) with patterned layer automatically greater than the adhesive force of spacer structure material and substrate body, promote processing procedure efficient greatly and reduce cost.
What deserves to be mentioned is, usually the external circuit layer of printed circuit board (PCB) or patterned layer 315 can by tin (Sn) for example, silver (Ag), nickel gold (Ni Au), nickel palladium gold (Ni Pd Au) or organic solderability preservative (Organic Solderability Preservative, OSP) etc. material carries out final Treatment of Metal Surface (metal finish), crosses for a long time and oxidation to avoid external circuit layer or patterned layer 315 ingresss of air.
In addition, light-emitting device 3 can comprise that also at least one driven unit 35, one links a glue 36 and an encapsulating material 37, and so it is non-in order to restriction the present invention.
Encapsulating material 37 covers at least one LED crystal particle 321, is example at this to cover whole LED crystal particle 321, and so it is non-limiting.Encapsulating material 37 for example can cover each LED crystal particle 321 or whole all LED crystal particle 321 that cover in each luminescence unit 32 in each luminescence unit 32 respectively by a glue mode.Except encapsulating material 37, also can be between first substrate 31 and second substrate 34 filling liquid, to increase the thermal conductivity of luminescence unit 32, liquid can be high heat-conducting.When selecting liquid for use, should consider characteristics such as insulating properties, corrosivity, solidifying point, thermal coefficient of expansion, can select oils or solvent based for use at this, oils for example is mineral oil or silicone oil (Silicone oil) or glycerine (Glycerol), and solvent based for example is trimethylbenzene (Mesitylene).
The 3rd embodiment
Please refer to shown in Figure 5, the generalized section of the light-emitting device 4 of third embodiment of the invention.Light-emitting device 4 comprises first substrate 41, luminescence unit 42, spacer structure 43, second substrate 44, driven unit 45, links glue 46 and encapsulating material 47.Wherein, first substrate 41 is an example with the glass substrate, and the material of second substrate 44 is not limited, and is that printed circuit board (PCB) is an example with second substrate 44.In addition, explain at first substrate 41 with chip bonding in the described LED crystal particle 421 of this luminescence unit 42, so it is non-limiting.
In the present embodiment, spacer structure 43 is arranged on second substrate 44.And first substrate 41 has a shielding layer 416, and shielding layer 416 and described LED crystal particle 421 are arranged on the same side of first substrate 41, and the corresponding projected position that is arranged on spacer structure 43, and it is corresponding to described luminescence unit 42 to have a plurality of opening H difference.Wherein, the material of shielding layer 416 can be identical with the shielding layer 341 in the previous embodiment, do not repeat them here.
In addition, second substrate 44 also can have a reflector 444 and be arranged on the side of second substrate 44 in the face of first substrate 41, is incident upon the light of second substrate 44 in order to reflection LED crystal particle 421.Wherein, the material in reflector 444 can comprise metal, metal oxide, alloy or white paint.Therefore, the light that the LED crystal particle 421 of described luminescence unit 42 is sent, part can directly be passed first substrate 41 and be penetrated; Another part then can pass first substrate 41 again via the reflection in reflector 444 and penetrate, and that is to say that first substrate 41 is bright dipping sides of light-emitting device 4, and the user can watch the shown picture of light-emitting device 4 by the bright dipping side of first substrate 41.
In addition, in the present embodiment, driven unit 45,45a are arranged on the side of second substrate 44 back to first substrate 41.Certainly, driven unit 45,45a also can be arranged on the side of second substrate 44 in the face of first substrate 41.Link glue 46 and also be arranged between first substrate 41 and second substrate 44, to link first substrate 41 and second substrate 44.Encapsulating material 47 is an example to cover whole LED crystal particle 421, and so it is non-limiting.Except encapsulating material 47, also can be between first substrate 41 and second substrate 44 filling liquid to increase the thermal conductivity of luminescence unit 42.Wherein spacer structure 43, binding glue 46 and encapsulating material 47 available materials and architectural feature describe in detail in the aforementioned embodiment, do not repeat them here.
Because driven unit 45,45a are arranged on the different substrates with described LED crystal particle 421, for driven unit 45,45a and described LED crystal particle 421 can be electrically connected, light-emitting device 4 comprises that also a conductive component 48 is arranged between first substrate 41 and second substrate 44, to electrically connect first substrate 41 and second substrate 44.
Conductive component 48 can have multiple pattern, for example is conductive pole (rod), conducting sphere or conducting resinl.Present embodiment does not limit the material of conductive component 48, and it can comprise metal or alloy or semi-conducting material, for example copper, aluminium, silicon (doped silicon).When conductive component 48 is conductive pole, can be when LED crystal particle 421 be arranged on the processing procedure of first substrate 41, in the lump conductive component 48 is arranged on first substrate 41, and the viscose of tool conductivity is set, in the corresponding position of conductive component 48 and first substrate 41 and second substrate 44 conductive component 48 is cemented between first substrate 41 and second substrate 44.In addition, when conductive component 48 is conducting resinl, then can be formed on first substrate 41 by the wire mark mode.
In the present embodiment, second substrate 44 can have a plurality of connection gaskets 442 in the side in the face of first substrate 41, and it is used with conductive component 48 and electrically connects.Wherein, connection gasket 442 can be a tin cream, and can utilize the wire mark mode to be formed on second substrate 44.Thus, driven unit 45 can pass through guide hole 443, connection gasket 442, conductive component 48 and circuit layer 411 in regular turn and electrically connect with LED crystal particle 421.
Therefore, by driven unit 45 being arranged on second substrate 44, and electrically connect two substrates 41,44, can simplify the processing procedure and the structure complexity of first substrate 41, to reduce cost and to increase make efficiency by conductive component 48.
The 4th embodiment
Please refer to shown in Fig. 6 A and Fig. 6 B, wherein Fig. 6 A is the schematic top plan view of the light-emitting device 5 of fourth embodiment of the invention, and Fig. 6 B is described first substrate, the 51 junction part enlarged drawings of light-emitting device 5.Light-emitting device 5 comprises a plurality of first substrates 51 and one second substrate 54.Each first substrate 51 has a plurality of luminescence units 52.Wherein, first substrate 51 and second substrate 54 can comprise first substrate and the technical characterictic of second substrate or the combination of its technical characterictic of above-mentioned all embodiment, do not repeat them here.
Described first substrate 51 can adjoin each other or binding (tiling) mutually by side, and constitute a large-area display unit, wherein, when adjoining each other, first substrate 51 can pass through coupling assembling (for example framework) or utilize bind or mode such as engaging and splicing mutually with another first substrate 51, mutually combines with one second substrate 54 and forms light-emitting device 5.Wherein, described first substrate 51 is except that utilizing another housing with four the first substrate 51 butts combinations earlier, maybe can utilize another loading plate (not shown), and four first substrates 51 are fixed on the loading plate, again described first substrate 51 and second substrate 54 are mutually combined, to form a large-area display unit, lighting device or backlight.Be noted that each first substrate 51 is example at this with a rectangle, but also can be circular, oval, other polygon or the concave polygon for example in the picture mosaic, and loading plate can be printing opacity or light tight material.In addition, the quantity of described first substrate 51 is non-limiting, with requirement different numbers can be arranged according to different designs.
When if 2 first substrates 51 directly connect, owing to do not have winding displacement between the first adjacent substrate 51, so no any seam produces, and then can promote the display quality of light-emitting device 5, and it is because seamless spliced, when the first adjacent substrate 51 spliced, the light-emitting diode of the luminescence unit 52 on each first substrate 51 was a crystal grain respectively, so the clearance D of each luminescence unit 52 can be contracted to 0.3mm to 1mm.Therefore, the position is on different first substrates 51, and the clearance D may command of hithermost two luminescence units 52 is identical with the clearance D of two adjacent luminescence units 52 on one first substrate 51 wherein.Because described luminescence unit 52 is arrangement regulations, and the luminescence unit 52 between different first substrates 51 of splicing place also has identical clearance D, so human eye do not see the splicing vestige, can improve the quality of light-emitting device 5.
In addition, in the present embodiment, the size of second substrate 54 is greater than the size of first substrate 51, if when constituting light-emitting device 5 with a plurality of first substrates 51 by a plurality of second substrates 54, then the size of second substrate 54 is less than the size of one first substrate 51, so that described first substrate 51 can side adjoined each other or link mutually and constitute large-area display unit, lighting device or backlight module.In addition, the light-emitting device 5 of present embodiment also can be that strip splices or splices with other shape except being the matrix splicing.
In sum, according to light-emitting device of the present invention have that the direct routing of a plurality of LED crystal particle engages or chip bonding at first substrate, spacing between the described whereby LED crystal particle is compared at known technology and can be dwindled effectively, and then the resolution that can improve light-emitting device is to improve display quality.In addition, light-emitting device of the present invention more by a spacer structure correspondence be arranged on each luminescence unit around, whereby,, can avoid the light between the different luminescence units to influence the problem that causes interference each other when light-emitting device during as display unit.And when light-emitting device during as backlight module, spacer structure then can be used as the glue-guard structure of encapsulating material to the described LED crystal particle is set, and can simplify processing procedure whereby and reduce cost of manufacture.In addition, when a plurality of first substrates spliced, the first adjacent substrate can abut one another, and can not have the slit after the splicing, and then reached seamless spliced to promote product competitiveness.
In addition, the material by spacer structure and the adhesive force of patterned layer can allow spacer structure aim at automatically with patterned layer automatically greater than the adhesive force of spacer structure material and substrate body, promote processing procedure efficient greatly and reduce cost.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be included in the claim institute restricted portion its equivalent modifications of carrying out or change.
Claims (22)
1. a light-emitting device is characterized in that, comprising:
At least one first substrate;
A plurality of luminescence units, it is two-dimensional arrangements and is positioned at described first substrate, each luminescence unit has at least one LED crystal particle, described LED crystal particle routing engage or chip bonding in described first substrate; And
One spacer structure, correspondence be arranged on each luminescence unit around.
2. light-emitting device according to claim 1 is characterized in that, described light-emitting device is a display unit, a lighting device, a backlight module or a striation.
3. light-emitting device according to claim 1 is characterized in that, has a gap or very close to each other between the described spacer structure of two adjacent luminescence unit correspondences.
4. light-emitting device according to claim 1 is characterized in that, described spacer structure is arranged on described first substrate.
5. light-emitting device according to claim 1 is characterized in that described spacer structure is arranged on around each luminescence unit continuously or discontinuously.
6. light-emitting device according to claim 1 is characterized in that, described spacer structure and described luminescence unit center have a beeline, and the total length of described spacer structure is greater than three times of described beeline.
7. light-emitting device according to claim 1 is characterized in that, also comprises:
One second substrate is provided with the described first substrate subtend.
8. light-emitting device according to claim 7 is characterized in that, described second substrate has a shielding layer, and described shielding layer has a plurality of openings and corresponds respectively to described luminescence unit.
9. light-emitting device according to claim 7 is characterized in that, also comprises:
One conductive component is arranged between described first substrate and described second substrate, and electrically connects described first substrate and described second substrate.
10. light-emitting device according to claim 1 is characterized in that, the material of described spacer structure comprises metal or alloy or macromolecular material or plastics or pottery or glass.
11. light-emitting device according to claim 1, it is characterized in that, described first substrate has a shielding layer, and described shielding layer and described LED crystal particle are arranged on the same side of described first substrate, and has a plurality of openings and correspond respectively to described luminescence unit.
12. light-emitting device according to claim 1 is characterized in that, described first substrate also has a circuit layer, and described LED crystal particle and described circuit layer electrically connect.
13. light-emitting device according to claim 12 is characterized in that, described first substrate also has a patterned layer, and described spacer structure is arranged on described patterned layer.
14. light-emitting device according to claim 13 is characterized in that, the material of described patterned layer comprises copper.
15. light-emitting device according to claim 1 is characterized in that, the height of described spacer structure is greater than the height of described LED crystal particle.
16. a light-emitting device is characterized in that, comprising:
At least one first substrate has a substrate body and a patterned layer, and described patterned layer is arranged on described substrate body;
A plurality of luminescence units, it is two-dimensional arrangements and is positioned at described first substrate that each luminescence unit has at least one LED crystal particle; And
One spacer structure, correspondence be arranged on each luminescence unit around, and contraposition is arranged on the described patterned layer, and the adhesive force of the material of described spacer structure and described patterned layer is greater than the adhesive force of described spacer structure material and described substrate body.
17. light-emitting device according to claim 16 is characterized in that, has a gap or very close to each other between the described spacer structure of two adjacent luminescence unit correspondences.
18. light-emitting device according to claim 16 is characterized in that, described spacer structure is arranged on around each luminescence unit continuously or discontinuously.
19. light-emitting device according to claim 16 is characterized in that, described spacer structure and described luminescence unit center have a beeline, and the total length of described spacer structure is greater than three times of described beeline.
20. light-emitting device according to claim 16 is characterized in that, the material of described spacer structure comprises copper or tin.
21. light-emitting device according to claim 16 is characterized in that, the material of described patterned layer comprises copper.
22. light-emitting device according to claim 16 is characterized in that, the height of described spacer structure is greater than the height of described LED crystal particle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910247043A CN101866912A (en) | 2009-04-15 | 2009-12-25 | Luminous device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910134963 | 2009-04-15 | ||
| CN200910134963.X | 2009-04-15 | ||
| CN200910247043A CN101866912A (en) | 2009-04-15 | 2009-12-25 | Luminous device |
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| Publication Number | Publication Date |
|---|---|
| CN101866912A true CN101866912A (en) | 2010-10-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910247043A Pending CN101866912A (en) | 2009-04-15 | 2009-12-25 | Luminous device |
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| CN (1) | CN101866912A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102610603A (en) * | 2011-01-25 | 2012-07-25 | 启耀光电股份有限公司 | Luminous device |
| CN102738089A (en) * | 2012-03-07 | 2012-10-17 | 苏州晶方半导体科技股份有限公司 | Semiconductor packaging structure and module thereof |
| US11195970B2 (en) | 2019-05-29 | 2021-12-07 | Au Optronics Corporation | Light emitting diode panel and tiling display apparatus |
-
2009
- 2009-12-25 CN CN200910247043A patent/CN101866912A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102610603A (en) * | 2011-01-25 | 2012-07-25 | 启耀光电股份有限公司 | Luminous device |
| CN102738089A (en) * | 2012-03-07 | 2012-10-17 | 苏州晶方半导体科技股份有限公司 | Semiconductor packaging structure and module thereof |
| CN102738089B (en) * | 2012-03-07 | 2018-02-23 | 苏州晶方半导体科技股份有限公司 | Semiconductor package and its module |
| US11195970B2 (en) | 2019-05-29 | 2021-12-07 | Au Optronics Corporation | Light emitting diode panel and tiling display apparatus |
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Application publication date: 20101020 |