CN2796104Y - 高亮度发光二极管的封装结构 - Google Patents

高亮度发光二极管的封装结构 Download PDF

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Publication number
CN2796104Y
CN2796104Y CNU2005200160844U CN200520016084U CN2796104Y CN 2796104 Y CN2796104 Y CN 2796104Y CN U2005200160844 U CNU2005200160844 U CN U2005200160844U CN 200520016084 U CN200520016084 U CN 200520016084U CN 2796104 Y CN2796104 Y CN 2796104Y
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王文峰
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

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Abstract

本实用新型提供了一种高亮度发光二极管的封装结构，由支架碗杯、晶片、基座、金线及绝缘胶组成，其中支架碗杯为一圆柱形，上端为支架，支架的中部设有一碗状凹槽，所述的基座设于凹槽的底部，所述的晶片设于基座的上端侧面，两根金线分别从晶片和基座上引出并与支架碗杯的支架相连，所述的绝缘胶充满凹槽并将晶片及底座密封，其中其中所述凹槽底部涂布有荧光胶，且所述晶片位于该荧光胶之上。本实用新型提高了白光二极管的发光效率以及亮度；同时也比传统制作工艺减少了一次烘烤工艺，减少了金线拖线的现象，减少了作业时间，降低了制作成本，并可以通过调配荧光粉的配比而获得各种色温的高亮度的白光二极管。

Description

高亮度发光二极管的封装结构
技术领域
本实用新型涉及一种半导体器件，具体与一种发光二极管的结构改良有关。
背景技术
发光二极管作为一种光学器件，具有体积小、电能损耗低等一系列的优点。尤其是白光二极管的问世，被誉为是21世纪可以取代日光灯照明的新型光源。如图1所示，现有的白光二极管的常规封装结构由支架碗杯1′、蓝色晶片2′、基座3′、金线4′及环氧树脂5′组成，其中支架碗杯1′为一圆柱形，上端为支架11′，支架11′的中部设有一碗状凹槽111′，所述的基座3′设于凹槽111′的底部，所述的蓝色晶片2′设于基座3′的上端侧面，两根金线4′分别从蓝色晶片2′和基座3′上引出并与支架碗杯1的支架11′相连，所述的环氧树脂5′充满凹槽111′并将蓝色晶片2′及基座3′密封，其中在蓝色晶片2′的表面上涂布有荧光胶21′。现有的白光二极管的发光方式多是蓝光晶粒涂上一层荧光物质，利用蓝光LED晶片照射此一荧光物质以产生与蓝光互补的黄光，再利用透镜原理将互补的黄光、蓝光予以混合，便可得出肉眼所需的白光，不过因为荧光粉布置于晶片的表面，阻碍了光的输出，激发蓝色晶片的效率不高，发光效率较差，亮度也提不起来。
另外，传统的白光二极管的制作工艺中，把蓝色晶片2′的正负极与支架11′的引脚连接起来，即焊线之后在蓝色晶片2′涂布荧光胶21′，然后会进行短烤，其后将晶片2′周围封入环氧树脂5′高温长烤，那么在这个过程中，环氧树脂有可能会拉断金线4′，就很容易造成金线4′的脱线，导致LED的不良。
实用新型内容
为了解决上述技术的不足，本实用新型的目的是提供一种改进的高亮度发光二极管的封装结构，一是可以提高激发光效率和亮度，二是可以使减少一次烘烤，减少了金线拖线的现象。
为了达到上述目的，本实用新型采用的技术方案如下：一种高亮度发光二极管的封装结构，由支架碗杯、晶片、基座、金线及环氧树脂组成，其中支架碗杯为一圆柱形，上端为支架，支架的中部设有一碗状凹槽，所述的基座设于凹槽的底部，所述的晶片设于基座的上端侧面，两根金线分别从晶片和基座上引出并与支架碗杯的支架相连，所述的环氧树脂充满凹槽并将晶片及底座密封，其中所述凹槽底部涂布有荧光胶，且所述晶片位于该荧光胶之上。
本实用新型采用在晶片底部和所述凹槽之间涂布有荧光粉，改变了传统荧光粉涂布在晶片的表面上形式结构，提高了白光二极管的发光效率以及亮度；同时也改变了白光二极管的制作工艺，即比传统制作工艺减少了一次烘烤工艺，可以减少金线拖线的现象，减少了制作过程中的作业时间，降低了制作成本。并可以通过调配荧光粉的配比而获得各种色温的高亮度的白光二极管。
附图说明
图1是传统的白光二极管的结构示意图；
图2是本实用新型的结构示意图。
具体实施方式
下面参照附图并结合实施例，对本实用新型做一详细的描述和说明。
如图2所示，本实用新型提供了一种高亮度发光二极管的封装结构，由支架碗杯1、蓝色晶片2、基座3、金线4及环氧树脂5组成，其中支架碗杯1为一圆柱形，上端为支架11，支架11的中部设有一碗状凹槽111，所述的基座位于凹槽111的底部，所述的蓝色晶片2设于基座3的上端侧面，两根金线4分别从蓝色晶片2和基座3上引出并与支架碗杯1的支架11相连，所述的环氧树脂5充满凹槽111并将蓝色晶片2及基座3密封，所述凹槽底部111涂布有荧光胶，且所述晶片2位于该荧光胶21之上。
将荧光粉21涂布在蓝色晶片2底部和所述凹槽底部111之间，改变了传统的涂布方式，免除了对蓝色晶片2表面的涂层，提高了光的输出，提高了激发蓝色晶片的效率、发光效率，也提高了LED的亮度。
另外，在其制作工艺中，将蓝色晶片2的正负极与支架11的引脚连接起来，即焊线之后，在蓝色晶片2底部和所述凹槽111底部的之间涂布荧光粉21，蓝色晶片2的表面则免除了荧光胶的涂布，这样就免除了该传统工艺之后的短烤程序，减少了一次烘烤，就减少了金线热胀冷缩的发生，就可以减少脱线的不良现象。
同时，本实用新型也减少了制作过程的作业时间，提高了制作效率，能降低制作成本。

Claims (1)

1、一种高亮度发光二极管的封装结构，由支架碗杯、晶片、基座、金线及环氧树脂组成，其中支架碗杯为一圆柱形，上端为支架，支架的中部设有一碗状凹槽，所述的基座设于凹槽的底部，所述的晶片设于基座的上端侧面，两根金线分别从晶片和基座上引出并与支架碗杯的支架相连，所述的环氧树脂充满凹槽并将晶片及基座密封，其特征在于所述凹槽底部涂布有荧光胶，且所述晶片位于该荧光胶之上。
CNU2005200160844U 2005-04-19 2005-04-19 高亮度发光二极管的封装结构 Expired - Fee Related CN2796104Y (zh)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101409272B (zh) * 2007-10-09 2010-08-11 一诠精密工业股份有限公司 环形表面粘着型导线架
CN101807658A (zh) * 2010-03-25 2010-08-18 福建中科万邦光电股份有限公司 一种大功率led封装方法
WO2011032439A1 (zh) * 2009-09-16 2011-03-24 深圳市聚飞光电股份有限公司 一种白光发光二极管
CN102290522A (zh) * 2011-09-16 2011-12-21 陆学中 无线led封装结构及其制造方法
CN102496674A (zh) * 2011-12-23 2012-06-13 惠州市华阳多媒体电子有限公司 一种新型达成白光的led封装结构及封装方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101409272B (zh) * 2007-10-09 2010-08-11 一诠精密工业股份有限公司 环形表面粘着型导线架
WO2011032439A1 (zh) * 2009-09-16 2011-03-24 深圳市聚飞光电股份有限公司 一种白光发光二极管
CN101807658A (zh) * 2010-03-25 2010-08-18 福建中科万邦光电股份有限公司 一种大功率led封装方法
CN101807658B (zh) * 2010-03-25 2012-11-21 福建中科万邦光电股份有限公司 一种大功率led封装方法
CN102290522A (zh) * 2011-09-16 2011-12-21 陆学中 无线led封装结构及其制造方法
CN102496674A (zh) * 2011-12-23 2012-06-13 惠州市华阳多媒体电子有限公司 一种新型达成白光的led封装结构及封装方法

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Assignee: Shenzhen Top Century Optoelectronics Technology Co., Ltd.

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