CN201535450U - 一种适合照明的大功率led灯 - Google Patents

一种适合照明的大功率led灯 Download PDF

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Publication number
CN201535450U
CN201535450U CN2009201343643U CN200920134364U CN201535450U CN 201535450 U CN201535450 U CN 201535450U CN 2009201343643 U CN2009201343643 U CN 2009201343643U CN 200920134364 U CN200920134364 U CN 200920134364U CN 201535450 U CN201535450 U CN 201535450U
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China
Prior art keywords
led lamp
lighting
led
light led
wafers
Prior art date
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Expired - Fee Related
Application number
CN2009201343643U
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English (en)
Inventor
薛信燊
李美华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honglulan Photoelectric Science & Technology Co., Ltd., Shenzhen City
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SHENZHEN ZHONGMING SEMICONDUCTOR LIGHTING CO Ltd
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Priority to CN2009201343643U priority Critical patent/CN201535450U/zh
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Publication of CN201535450U publication Critical patent/CN201535450U/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

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  • Led Device Packages (AREA)

Abstract

本实用新型涉及一种适合照明的大功率LED灯，包括驱动电路、支架杯和LED晶片，在所述的支架杯内配置数个与支架杯固定连接的红光LED晶片和蓝光LED晶片，所述的红光LED晶片和蓝光LED晶片通过电极线与驱动电路板连接，在所述的蓝光LED晶片上涂荧光粉。实施本实用新型的一种适合照明的大功率LED灯，主要用来生产高显色指数、低色温的暖白光，可以增加暖白光LED的亮度，提高显色指数，使大功率LED灯更加适合照明，还可有效节约产品成本。

Description

一种适合照明的大功率LED灯
技术领域
本实用新型涉及半导体照明领域，更具体地说，涉及一种适合照明的大功率LED灯。
背景技术
半导体照明具有绿色环保、寿命超长、高效节能、抗恶劣环境、结构简单、体积小、重量轻、响应快、工作电压低及安全性好的特点，因此被誉为继白炽灯、日光灯和节能灯之后的第四代照明电光源，或称为21世纪绿色光源。
目前，市场上的适用于照明的暖白光主要是用蓝光LED晶片加红色荧光粉做成，荧光粉点在LED的支架杯中，在现有技术中，很难精确控制荧光粉的用量，浪费大量的荧光粉，增加了产品成本，同时也无法控制批量的一致性。
受目前荧光粉生产工艺的限制，红色荧光粉的光通量很低，使暖白光的光效很低，显色指数也只能在70到80左右，很难达到照明产品的要求。
实用新型内容
本实用新型要解决的技术问题在于，针对现有技术的上述缺陷，提供一种适合照明的大功率LED灯。
本实用新型解决其技术问题所采用的技术方案是：设计一种适合照明的大功率LED灯，包括驱动电路、支架杯和LED晶片，在所述的支架杯内配置数个与支架杯固定连接的红光LED晶片和蓝光LED晶片，所述的红光LED晶片和蓝光LED晶片通过电极线与驱动电路连接。
作为上述技术方案的进一步改进，以上所述的一种适合照明的大功率LED灯，合理调配蓝光与荧光粉发出的光的颜色，正常在3500-5000K左右，这样与红光波长的光混在一起，可以达到80Lm/W的光效，显色指数可达到85以上。
作为上述技术方案的进一步改进，以上所述的一种适合照明的大功率LED灯，在所述的支架杯上填充外观胶。所述的外观胶具有高折射率，可有效提高光效。
作为上述技术方案的进一步改进，以上所述的一种适合照明的大功率LED灯，在所述的蓝光LED上涂荧光粉。
实施本实用新型的一种适合照明的大功率LED灯，具有以下有益效果：
1、能有效提高LED灯具的光效，在显色指数大于85情况下，此款大功率LED的光效能达到80以上，比现有技术的产品光效提高至少20％以上，使LED灯具更适合照明。
2、本实用新型结构设计精巧，主要用来制作0.5W及以上的中、大功率LED，可以有效提高产品的可靠性、一致性，同时利用机器设备批量生产，可以大大提高生产效率，降低产品的成本。
3、有效控制荧光粉的用量，不仅可增加产品的光效，还可有效节约产品成本。
附图说明
下面将结合附图及实施例对本实用新型作进一步说明，附图中：
图1是本实用新型一种适合照明的大功率LED灯的结构示意图。
具体实施方式
如图1所示，在本实用新型的一种适合照明的大功率LED灯的实施例中，包括驱动电路、支架杯10和LED晶片，在所述的支架杯10内配置与支架杯10固定连接的两个红光LED晶片21和四个蓝光LED晶片22，所述的红光LED晶片和蓝光LED晶片通过电极线30与驱动电路连接，在所述的蓝光LED晶片22上涂荧光粉40。并在支架杯10上涂具有高折射率的外观胶，使LED的光效有效提高。
所述的两个红光LED晶片21位于支架杯10的中心，四个蓝光LED晶片22均匀分布在红光LED晶片21的四周。这样可使光斑均匀，出光效果最佳。
综上所述，如本技术领域中普通技术人员可以了解的，本说明书中所述的只是本实用新型的一个较佳实施例，凡依本实用新型的构思所做的改变或修饰，皆应在本实用新型的权利要求保护范围内。

Claims (3)

1.一种适合照明的大功率LED灯，包括驱动电路、支架杯和LED晶片，其特征在于，在所述的支架杯内配置数个与支架杯固定连接的红光LED晶片和蓝光LED晶片，所述的红光LED晶片和蓝光LED晶片通过电极线与驱动电路连接。
2.根据权利要求1所述的一种适合照明的大功率LED灯，其特征在于，仅在所述的蓝色LED晶片上涂荧光粉。
3.根据权利要求1所述的一种适合照明的大功率LED灯，其特征在于，在所述的支架杯中填充外观胶。
CN2009201343643U 2009-08-03 2009-08-03 一种适合照明的大功率led灯 Expired - Fee Related CN201535450U (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101968171A (zh) * 2010-08-09 2011-02-09 上海光隧光电科技有限公司 能实现高显色指数的led照明光源装置
CN102374496A (zh) * 2010-08-18 2012-03-14 晶元光电股份有限公司 多维度发光装置
US9000457B2 (en) 2010-07-19 2015-04-07 Epistar Corporation Multi-dimensional light-emitting device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9000457B2 (en) 2010-07-19 2015-04-07 Epistar Corporation Multi-dimensional light-emitting device
US9385108B2 (en) 2010-07-19 2016-07-05 Epistar Corporation Light-emitting device having optoelectronic elements on different elevations
CN101968171A (zh) * 2010-08-09 2011-02-09 上海光隧光电科技有限公司 能实现高显色指数的led照明光源装置
CN102374496A (zh) * 2010-08-18 2012-03-14 晶元光电股份有限公司 多维度发光装置
CN102374496B (zh) * 2010-08-18 2015-03-25 晶元光电股份有限公司 多维度发光装置

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Owner name: HONGLULAN PHOTOELECTRIC SCIENCE + TECHNOLOGY CO.,

Free format text: FORMER OWNER: SHENZHEN ZHONGMING SEMICONDUCTOR LIGHTING CO., LTD.

Effective date: 20120529

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Effective date of registration: 20120529

Address after: 518000 Guangdong city of Shenzhen province Baoan District Shiyan town Tangtou village size Tang Lu Hongfa Technology Park D Building 5 floor

Patentee after: Honglulan Photoelectric Science & Technology Co., Ltd., Shenzhen City

Address before: 518000 Guangdong city of Shenzhen province D Baoan District science and Technology Park Hongfa Shiyan town building 4 floor

Patentee before: Shenzhen Zhongming Semiconductor Lighting Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100728

Termination date: 20150803

EXPY Termination of patent right or utility model