CN2717027Y - 一种大功率发光二极管 - Google Patents
一种大功率发光二极管 Download PDFInfo
- Publication number
- CN2717027Y CN2717027Y CNU2004200713301U CN200420071330U CN2717027Y CN 2717027 Y CN2717027 Y CN 2717027Y CN U2004200713301 U CNU2004200713301 U CN U2004200713301U CN 200420071330 U CN200420071330 U CN 200420071330U CN 2717027 Y CN2717027 Y CN 2717027Y
- Authority
- CN
- China
- Prior art keywords
- heat sink
- electrode pin
- emitting diodes
- power light
- framework
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2004200713301U CN2717027Y (zh) | 2004-07-09 | 2004-07-09 | 一种大功率发光二极管 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2004200713301U CN2717027Y (zh) | 2004-07-09 | 2004-07-09 | 一种大功率发光二极管 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2717027Y true CN2717027Y (zh) | 2005-08-10 |
Family
ID=34873924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2004200713301U Expired - Lifetime CN2717027Y (zh) | 2004-07-09 | 2004-07-09 | 一种大功率发光二极管 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2717027Y (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008043206A1 (en) * | 2006-10-10 | 2008-04-17 | Jen-Shyan Chen | A semiconductor light-emitting module |
CN100399137C (zh) * | 2005-12-21 | 2008-07-02 | 友达光电股份有限公司 | 显示器的散热结构 |
CN101820045A (zh) * | 2010-04-09 | 2010-09-01 | 江苏伯乐达光电科技有限公司 | Led的封装支架、led封装方法及利用该方法制作的led |
CN101192637B (zh) * | 2006-11-27 | 2012-04-04 | 山西乐百利特科技有限责任公司 | 发光二极管元件 |
-
2004
- 2004-07-09 CN CNU2004200713301U patent/CN2717027Y/zh not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100399137C (zh) * | 2005-12-21 | 2008-07-02 | 友达光电股份有限公司 | 显示器的散热结构 |
WO2008043206A1 (en) * | 2006-10-10 | 2008-04-17 | Jen-Shyan Chen | A semiconductor light-emitting module |
EA013884B1 (ru) * | 2006-10-10 | 2010-08-30 | Необульб Текнолоджиз Инк. | Полупроводниковый мощный светоизлучающий модуль с теплоизоляцией |
US8193553B2 (en) | 2006-10-10 | 2012-06-05 | Neobulb Technologies, Inc. | Semiconductor high-power light-emitting module with heat isolation |
CN101192637B (zh) * | 2006-11-27 | 2012-04-04 | 山西乐百利特科技有限责任公司 | 发光二极管元件 |
CN101820045A (zh) * | 2010-04-09 | 2010-09-01 | 江苏伯乐达光电科技有限公司 | Led的封装支架、led封装方法及利用该方法制作的led |
CN101820045B (zh) * | 2010-04-09 | 2014-02-05 | 江苏伯乐达光电科技有限公司 | Led的封装支架、led封装方法及利用该方法制作的led |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101296564B (zh) | 具良好散热性能的光源模组 | |
US9175842B2 (en) | Heat sink assembly for opto-electronic components and a method for producing the same | |
US20080278917A1 (en) | Heat dissipation module and method for fabricating the same | |
WO2013090176A1 (en) | Light emitting system | |
CN201909192U (zh) | 一种改进的led模组 | |
CN107331659B (zh) | Led电路板、终端设备及led电路板的制作方法 | |
CN103456729A (zh) | 发光二极管显示屏 | |
KR100892224B1 (ko) | 핀 타입형 파워 엘이디(led) 방열구조 | |
CN1961431A (zh) | 表面安装型发光芯片封装件 | |
CN102064247A (zh) | 一种内嵌式发光二极管封装方法及封装结构 | |
CN102881806B (zh) | 一种smd led单元及其封装方法 | |
CN201149869Y (zh) | 一种led封装结构 | |
CN104412034A (zh) | Led灯用电极模块 | |
CN102781164B (zh) | 一种led照明灯具专用线路板 | |
CN2717027Y (zh) | 一种大功率发光二极管 | |
CN104051603B (zh) | 一种双面发光的led灯条的制造工艺 | |
CN204614783U (zh) | 一种智能功率模块 | |
CN102364684A (zh) | 一种led模组及其制造工艺 | |
CN212676298U (zh) | 具有双面胶体的发光二极管封装结构 | |
US20100302789A1 (en) | LED Light Source Module and Method for Producing the Same | |
CN102447043B (zh) | 发光二极管封装结构 | |
CN220439658U (zh) | 高功率集成面光源及灯具设备 | |
CN215636663U (zh) | 一种易于多向转弯安装的led灯带 | |
CN203456455U (zh) | 发光二极管显示屏 | |
CN201973499U (zh) | Led灯具 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: FUSHAN CITY GUOXING PHOTOELECTRIC CO., LTD. Free format text: FORMER NAME OR ADDRESS: FUSHAN CITY GUOXING PHOTOELECTRICITY TECHNOLOGY CO.,LTD. |
|
CP03 | Change of name, title or address |
Address after: 528000, No. 18, Huabao South Road, Chancheng District, Guangdong, Foshan Patentee after: Foshan Guoxing Photoelectric Co., Ltd. Address before: 528000, No. 24 Jiangbei Road, Chancheng District, Guangdong, Foshan Patentee before: Foshan Nationstar Optoelectronics Co., Ltd. |
|
C17 | Cessation of patent right | ||
CX01 | Expiry of patent term |
Expiration termination date: 20140709 Granted publication date: 20050810 |