CN2694491Y - Heat radiator and heat radiation module - Google Patents
Heat radiator and heat radiation module Download PDFInfo
- Publication number
- CN2694491Y CN2694491Y CN 200420043934 CN200420043934U CN2694491Y CN 2694491 Y CN2694491 Y CN 2694491Y CN 200420043934 CN200420043934 CN 200420043934 CN 200420043934 U CN200420043934 U CN 200420043934U CN 2694491 Y CN2694491 Y CN 2694491Y
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- Prior art keywords
- heat
- radiator
- heat abstractor
- diffusion sheet
- thermal diffusion
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Abstract
The utility model relates to a heat radiator and heat radiation module. The heat radiator and heat radiation module solves the problem that the heat diffusion film of the heat radiator of the prior art has high contact resistance and low heat conducting speed by adding a nanometer gold film to the bottom surface of the heat diffusion film or the radiator base. The heat radiator of the utility model comprises a radiator, a metal base which comprises the first surface and the second surface which is opposite to the first surface, a plurality of radiation fins extending upwards from the first surface of the base and a heat diffusion film arranged on the second surface of the base, wherein, the heat diffusion film is provided with a nanometer gold film. The utility model further provides another set of heat radiator and heat radiation module which is provided with the nanometer gold film.
Description
[technical field]
The utility model relates to a kind of heat abstractor and heat radiation module.
[background technology]
When cpu chip moves towards size granular, function integration, if the heat energy that its unit are produced can be through the heat pipe of too high thermal conduction characteristic, fast, evenly disperse to give the fin that is in contact with it, make hot localised points the assembly unsteadiness that may cause reduce to minimum, the reliability and the life-span that then may effectively strengthen assembly.
See also Fig. 1, present way mainly is: heater 20 sees through thermal interfacial material 21, and heat is reached radiator 22, by heat pipe 23 and fan 24 hot type is gone out then.Thermal interfacial material is the space that is used for filling up between heater and the radiator contact-making surface, to reduce thermal resistance, reaches quick purpose with transfer of heat.It should be noted that for reducing thermal resistance generally only note the reduction of contact heat resistance, but will reach the purpose that Rapid Thermal passes, the homodisperse mechanism of heat is indispensable.
For reaching hot aim of even dispersion, the existing method of industry is to add a thermal diffusion sheet between thermal interfacial material and fin, generally is made of copper.See also Fig. 2, No. 00228676.9 Chinese patent of bulletin discloses a kind of heat abstractor June 6 calendar year 2001, and it comprises an aluminium extruded type radiator (not indicating) and a bronze medal metal plate 30.This plate body 30 is as thermal diffusion sheet, is fixed in the bottom surface 15 of pedestal 14 by the flanging 18 of radiator, and it with bottom surface 15 between scribble the lower heat-conducting medium of thermal resistance value (scheming not show).
But the prepared thermal diffusion sheet surface smoothness of common process method is low, will improve contact heat resistance relatively, causes thermal conduction rate to reduce.
Therefore, be necessary to provide heat abstractor and the heat radiation module that a kind of contact heat resistance is low, heat conduction speed is high.
[summary of the invention]
For solving the thermal diffusion sheet contact heat resistance height and the low problem of heat conduction speed of heat abstractor in the prior art, the purpose of this utility model is to provide the heat abstractor that a kind of contact heat resistance is low, heat conduction speed is high.
Another purpose of the present utility model is to provide the heat radiation that a kind of contact heat resistance is low, heat conduction speed is high module.
For realizing the purpose of this utility model, a kind of heat abstractor provided by the utility model, comprise: a radiator, comprise one have a first surface and with the metal base of its opposing second surface and some from the upwardly extending radiating fin of this pedestal first surface; An and thermal diffusion sheet that places this pedestal second surface.Wherein, this thermal diffusion sheet is formed with a nano-gold film.
Be to realize the purpose of this utility model, another kind of heat abstractor provided by the utility model comprises: one have a first surface and with the metal base of its opposing second surface; And it is some from the upwardly extending radiating fin of this pedestal first surface.Wherein, the second surface of this pedestal is formed with a nano-gold film.
For realizing another purpose of the present utility model, heat radiation module provided by the utility model comprises: a pyrotoxin; And a heat abstractor of mainly forming by radiator, this radiator comprises one and has a first surface and and the metal base of its opposing second surface and some from the upwardly extending radiating fin of this pedestal first surface.Wherein, be provided with a nano-gold film between the second surface of this pyrotoxin and this radiator base.
The thickness of above-mentioned nano-gold film can be the 5-50 micron.
With respect to prior art, the utility model is set up a nano-gold film in the bottom surface of thermal diffusion sheet or radiator base, to improve its surperficial evenness.When the utility model is applied to the heat radiation module of CPU,, can significantly reduce contact heat resistance because of it has excellent contact surface.Based on the even diffusion property of good heat of gold copper-base alloy and the characteristic of Nanosurface structure, also heat evenly can be diffused to radiator fast, simultaneously to improve its integral heat sink efficient.
[description of drawings]
Fig. 1 is the work schematic diagram of the heat radiation module of existing heat abstractor and composition thereof;
Fig. 2 is the existing schematic diagram that is provided with the heat abstractor of thermal diffusion sheet;
Fig. 3 is the schematic diagram of the heat abstractor of first embodiment of the present utility model;
Fig. 4 is the schematic diagram of heat radiation module of the heat abstractor of employing first embodiment of the present utility model;
Fig. 5 is the schematic diagram of the heat abstractor of second embodiment of the present utility model.
[embodiment]
The utility model is described in further detail below in conjunction with accompanying drawing.
See also Fig. 3, the heat abstractor 6 that the utility model provides comprises: a radiator 60, form by a metal base 62 and some radiating fins 64; An and thermal diffusion sheet 70.Wherein, metal base 62 has end face 620 and bottom surface 622, and radiating fin 64 extends upward from the end face 620 of this pedestal 62.This thermal diffusion sheet 70 places the bottom surface 622 of this pedestal 62, and is formed with a nano-gold film 72.
Wherein, thermal diffusion sheet 70 can be made by high metals of the coefficient of heat conduction such as copper, aluminium or gold.The preferable range of its thickness is the 50-200 micron, and the best is 100 microns.Can apply thermal interfacial material between thermal diffusion sheet 70 and this base bottom surface 622 to fill up the space of its contact-making surface.
Nano-gold film 72 makes nanogold particle be deposited on thermal diffusion sheet 70 surfaces by sputter, evaporation or chemical vapour deposition technique and forms.The preferable range of its thickness is the 5-50 micron, and optimum thickness is 20 microns.Be understandable that it both can only be distributed in the surface of this thermal diffusion sheet 70 back to radiator, also can be distributed in this thermal diffusion sheet 70 simultaneously over against two surfaces that reach back to radiator.
In addition, this heat abstractor can further have a fixture, in order to this thermal diffusion sheet relative fixed in this radiator.
See also Fig. 4, adopt the heat radiation module 8 of above-mentioned heat abstractor 6, comprising: pyrotoxin 80, the heat abstractor of forming by radiator 60 and thermal diffusion sheet 70 6.Wherein, be formed at the nano-gold film 72 of thermal diffusion sheet 70 between pyrotoxin 80 and thermal diffusion sheet 70.
Wherein, pyrotoxin 80 is cpu chips.Also can apply a thermal interface material layer (figure does not show) between this pyrotoxin 80 and the nano-gold film 72.It mainly is made up of thermal paste, phase-change heat glue or thermal grease.
In addition, this heat radiation module also can further comprise heat pipe or the fan that is arranged at radiator 60, to improve radiating efficiency.
See also Fig. 5, the heat abstractor 9 of another embodiment of the present utility model is that with the main difference of last embodiment nano-gold film 92 directly is formed at the bottom surface 91 of radiator base (not indicating).
In like manner, the heat abstractor 9 of present embodiment also can be used for forming corresponding heat radiation module (figure does not show).
In addition, it will be understood by those skilled in the art that the radiator of other form in prior art field also can be used for the utility model, be not necessarily limited to the foregoing description.Be understandable that, when the work of heat radiation module, also can further comprise other servicing unit, as fastener or buckle design etc.
With respect to prior art, the utility model is set up a nano-gold film in the bottom surface of thermal diffusion sheet or radiator base, to improve its surperficial evenness.When the utility model is applied to the heat radiation module of CPU,, can significantly reduce contact heat resistance because of it has excellent contact surface.Based on the even diffusion property of good heat of gold copper-base alloy and the characteristic of Nanosurface structure, also heat evenly can be diffused to radiator fast, simultaneously to improve its integral heat sink efficient.
Claims (10)
1. heat abstractor comprises: a radiator, comprise one have a first surface and with the metal base of its opposing second surface and some from the upwardly extending radiating fin of this pedestal first surface; And a thermal diffusion sheet that places this pedestal second surface, it is characterized in that this thermal diffusion sheet is formed with a nano-gold film.
2. heat abstractor as claimed in claim 1 is characterized in that, the thickness of above-mentioned nano-gold film is the 5-50 micron.
3. heat abstractor as claimed in claim 1 is characterized in that above-mentioned thermal diffusion sheet is made by high metals of the coefficient of heat conduction such as copper, aluminium or gold.
4. heat abstractor as claimed in claim 1 is characterized in that, the thickness of above-mentioned thermal diffusion sheet is the 50-200 micron.
5. heat abstractor as claimed in claim 1 is characterized in that, the thickness of above-mentioned thermal diffusion sheet is 100 microns.
6. heat abstractor as claimed in claim 1 is characterized in that, scribbles thermal interfacial material between above-mentioned thermal diffusion sheet and this pedestal second surface.
7. heat abstractor comprises: a radiator, comprise one have a first surface and with the metal base of its opposing second surface; And it is some from the upwardly extending radiating fin of this pedestal first surface; It is characterized in that the second surface of this pedestal is formed with a nano-gold film.
8. heat abstractor as claimed in claim 7 is characterized in that, the thickness of above-mentioned nano-gold film is the 5-50 micron.
9. a heat radiation module comprises: a pyrotoxin; Reach a heat abstractor of mainly forming by radiator, wherein this radiator comprise one have a first surface and with the metal base of its opposing second surface and some from the upwardly extending radiating fin of this pedestal first surface, it is characterized in that, be provided with a nano-gold film between the second surface of this pyrotoxin and this radiator base.
10. heat radiation module as claimed in claim 9 is characterized in that, the thickness of above-mentioned nano-gold film is the 5-50 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420043934 CN2694491Y (en) | 2004-03-20 | 2004-03-20 | Heat radiator and heat radiation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420043934 CN2694491Y (en) | 2004-03-20 | 2004-03-20 | Heat radiator and heat radiation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2694491Y true CN2694491Y (en) | 2005-04-20 |
Family
ID=34775083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420043934 Expired - Lifetime CN2694491Y (en) | 2004-03-20 | 2004-03-20 | Heat radiator and heat radiation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2694491Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105325067A (en) * | 2013-06-19 | 2016-02-10 | 日进材料股份有限公司 | Conductive heat-dissipating sheet, and electrical parts and electronic devices comprising same |
-
2004
- 2004-03-20 CN CN 200420043934 patent/CN2694491Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105325067A (en) * | 2013-06-19 | 2016-02-10 | 日进材料股份有限公司 | Conductive heat-dissipating sheet, and electrical parts and electronic devices comprising same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20140320 Granted publication date: 20050420 |