CN2805084Y - Improved structure of heat conducting tube type radiator - Google Patents

Abstract

The utility model discloses an improved structure of a heat conducting tube type radiator, which comprises an absorber plate which is in contact with a CPU and a plurality of heat pipes. Under the condition that a main board is vertically arranged, heat absorbing sections of the heat pipes are vertically fixed to the absorber plate and are arranged in parallel, the heat pipes are upwards extended from the absorber plate and are bent and folded, and horizontal or upwards inclined radiating sections can be formed, and at least one of the upper and the lower sides of each heat radiating section is combined with a radiating assembly. Each radiating assembly is composed of a radiating plate and fins, wherein one side of the radiating plate is connected with the radiating section, and the other side deviating the radiating section is combined with the fins. As the radiating section of each heat pipe forms an upwards inclined shape, each heat pipe can exert the action, thereby, the better radiating effect can be achieved. The radiating sections of the heat pipes are all connected with the fins through the radiating plates, the heat can be transferred to the radiating plates and all fins, and the radiating effect is good.

Description

The structure-improved of heat pipe radiator

Technical field:

The utility model relates to field of computer technology, especially relates to a kind of heat pipe radiator that the CPU of computer is dispelled the heat.

Background technology:

Along with the speed of computer CPU (central processing unit) is accelerated gradually, the heat fast rise that CPU produces.In order to solve heat dissipation problem, radiator still is difficult to satisfy the needs that CPU speed promotes after making copper fin-type radiator into from the aluminium extruded type radiator in past.The radiator of the central cpu of desktop computer begins to install additional heat pipe at present, conducts heat to the fin top near fan from the absorber plate that attaches cpu chip.Because of the heat transfer rate of heat pipe greater than aluminium matter or copper fin several times, so can be with heat propagating into the fin top than fin faster speed near the fan place, thereby improve radiating effect.

But installed the radiator behind the heat pipe at present additional, its performance boost is limited, and reason is general heat pipe radiator, and its heat pipe arrangement mode has following four kinds:

First kind be heat pipe 02 (for example 2～5) more than 2 under the vertically disposed situation of mainboard, arrange in absorber plate 01 position vertical parallel, and weld together; Through after the bending once, its radiating segment and endotherm section are orthogonal at an end of absorber plate 01, and fin 03 is plugged on the radiating segment of heat pipe 02, shown in accompanying drawing 1A and accompanying drawing 1B.

Second kind be heat pipe 02 (for example 2～5) more than 2 under the vertically disposed situation of mainboard, arrange in absorber plate 01 position horizontal parallel, and weld together; Stretch out at two ends at absorber plate 01, and after once bending, it is used to plug the radiating segment and the endotherm section orthogonal (seeing shown in accompanying drawing 2A and the accompanying drawing 2B) of fin 03.

The shortcoming of this kind mode is as follows: all heat pipes 02 are for being horizontally disposed with, and all cause considerable damage for the performance of heat pipe 02.

The third be heat pipe 02 (for example 2～5) more than 2 under the vertically disposed situation of mainboard, position water is capable is arranged in parallel at absorber plate 01, and welds together; Stretch out at two ends at absorber plate 01, and after twice bending, its radiating segment inserts the round hole (seeing shown in the accompanying drawing 3A) in the fin 03.Wherein, fin 03 and absorber plate 01 are orthogonal and be connected.This kind design another kind of like example be, the radiating segment of heat pipe 02 links with heating panel 04, and heating panel 04 and absorber plate 01 are parallel to each other and all with fin 03 two ends bindings (seeing shown in the accompanying drawing 3B).

The shortcoming of this kind mode is as follows: all heat pipes 02 are for being horizontally disposed with, and all cause considerable damage for the performance of heat pipe 02.

The 4th kind is that the endotherm section of 4 heat pipes 02 is to intersect and arranges, and through after the bending once, radiating segment and endotherm section are orthogonal, see shown in accompanying drawing 4A and the accompanying drawing 4B at absorber plate 01.

The shortcoming of this kind mode is as follows: for the heat pipe radiator that 4 heat pipes are the intersection arrangement, when being applied in upright mainboard, it has two heat pipes 02 to be level from absorber plate 01 position towards the folding that tilts again earlier, then downward-sloping folding again is level to two heat pipes 02 from absorber plate 01 position in addition, and fin 03 is inserted on the heat pipe 02; Because 02 heat-sinking capability of heat pipe down is poor, so in fact the radiator of this form has only two heat pipes to play a role, radiating effect is desirable not to the utmost.

Comprehensive relatively above various types of existing heat pipe Design of for heat sinks as can be known, design shown in drawings attached 1A and the 1B is fit to be applied in the vertically disposed situation of mainboard, because of the endotherm section of heat pipe 02 among accompanying drawing 1A, the 1B is vertical the setting, though radiating segment is for being horizontally disposed with, but still the cohesive force that can utilize water retracts the water of radiating segment.And other design is under the vertically disposed situation of mainboard, and whole heat pipe is and is horizontally disposed with, and efficiency ratio is also low under the horizontally disposed situation of mainboard.

Yet, the design of accompanying drawing 1A and 1B still has shortcoming, because of the connected mode of its heat pipe 02 with fin 03, all is that heat pipe 02 is directly inserted in the round hole that stamps out on the parallel fin 03 of a row, fin 03 contacts with heat pipe 02, only limits to the small space of fin 03 thickness.Because the deficiency of machining accuracy, round hole inner edge on the fin 03 is also non-fully closely with contacting of heat pipe 02, for example round hole inner edge is not parallel fully with heat pipe, the tolerance of heat pipe external diameter also is not very accurate, therefore, heat pipe 02 takes heat the fin 03 of radiator top to by the absorber plate 01 that is attached at CPU, heat can not be passed to effectively radiating fin 03 and makes it to spread apart.

Another design is arranged at present, is earlier during the round hole on the punching press fin, stamps out an annulus perpendicular to fin simultaneously, and annulus and fin are as a whole, and again with the heat pipe insertion, heat pipe like this can contact with the annulus on each fin.But like this still can not tackle the problem at its root, because still can't combine closely between heat pipe and the annulus, even coat heat-conducting glue or help also little with the tin cream welding.Because the thermal conductivity of heat-conducting glue itself is lower, to weld then the Chang Yinwei processing difficulties and cause welding not tight with tin cream, the situation of normal free weldering occurs.In addition, the punching press annulus also has a defective, it can change intrametallic lattice structure, causes the actual thermal conductivity between annulus and the fin to descend, can not 100% reach utilizing the integrated annulus of punching press to absorb heat and be delivered to the purpose of fin in the ideal.

The utility model content:

The purpose of this utility model is to provide a kind of structure-improved of heat pipe radiator, and the heat pipe radiator heat-dissipation effect after this improvement is better, and every heat pipe all can play a role.

For achieving the above object, the utility model comprises an absorber plate that contacts with CPU and many heat pipes, under the vertically disposed situation of mainboard, the endotherm section of heat pipe is vertically fixed on the absorber plate, and be and be arranged in parallel, heat pipe extends upward the back bending from absorber plate, formation level or acclivitous radiating segment, radiating segment descends the side in the both sides to be combined with radiating subassembly at least thereon, described radiating subassembly is made of heating panel and fin, wherein, heating panel is connected with radiating segment with the one side, and its opposite side that deviates from radiating segment then combines with fin.

The angle that radiating segment and endotherm section were of described heat pipe is 90～135 degree.

Described heating panel and fin are formed in one.

That fixing side of the heating panel of radiating subassembly and radiating segment offers semi-circular grooves, and described radiating segment is fixed in the groove.

The both sides up and down of the radiating segment of described heat pipe all are combined with radiating subassembly.

The beneficial effects of the utility model are: the heat pipe radiator of this form mainboard be horizontally disposed with vertically disposed situation under, the radiating segment of its heat pipe is neither downward-sloping state can to occur, every heat pipe is all played a role, and can make condensed water flow to endotherm section fast downwards, the then less condensed water of radiating segment is assembled, avoid being subjected to the influence of water vapour and more liquid vapour common phase is arranged, can reduce the condensing water temperature of getting back to endotherm section; Even radiating segment is for being horizontally disposed with, but because of endotherm section is vertical the setting, the cohesive force that still can utilize water retracts the water of radiating segment fast, thus effect design than other in whole heat pipe be horizontally disposed with in addition part better downwards.In addition, because the radiating segment of heat pipe all links to each other with fin by heating panel, heat can be delivered to heating panel and all fins, heat-transfer effect is good, avoid other design heat pipe directly to be inserted in the round hole that stamps out on the parallel fin of a row, because of the not good bad phenomenon that causes thermal conductivity to descend of contact.

Description of drawings:

Below in conjunction with accompanying drawing the utility model is described further:

Accompanying drawing 1A is the structural representation of one of existing heat pipe radiator

Accompanying drawing 1B is the end view of accompanying drawing 1A

Accompanying drawing 2A is two structural representation of existing heat pipe radiator

Accompanying drawing 2B is the end view of accompanying drawing 2A

Accompanying drawing 3A is three structural representation of existing heat pipe radiator

Accompanying drawing 3B is four structural representation of existing heat pipe radiator

Accompanying drawing 4A is five structural representation vertical view (not comprising fin) of existing heat pipe radiator

Accompanying drawing 4B is the end view of accompanying drawing 4A

Accompanying drawing 5 is the end view of one of the utility model embodiment

Accompanying drawing 6 is two the end view of the utility model embodiment

The structural representation that accompanying drawing 7 closes for the radiating segment in the accompanying drawing 6 and heating panel

Embodiment:

The following stated only is preferred embodiment of the present utility model, does not therefore limit protection range of the present utility model.

Accompanying drawing 5 is depicted as one of embodiment of the present utility model, this heat pipe radiator has an absorber plate that contacts with CPU 10 and many heat pipes 30, wherein, heat pipe 30 is one group, under the vertically disposed situation of mainboard, the endotherm section 31 of heat pipe 30 is the tile vertically setting, and be fixed together with absorber plate 10, heat pipe 30 extends upward the back bending from absorber plate 10, form the radiating segment 32 (angle between radiating segment 32 and the endotherm section 31 is good with 90～135 degree) that tilts, the below of radiating segment 32 combines with radiating subassembly 20, this radiating subassembly 20 is made of heating panel 21 and fin 22, heating panel 21 is fixing with one side and radiating segment 32, and an opposite side is then one-body molded fin 22.

Accompanying drawing 6 is depicted as two of embodiment of the present utility model, and as can be seen from the figure, the both sides up and down of the radiating segment 32 of heat pipe 30 all are combined with a radiating subassembly 20.In addition, can see from accompanying drawing 7 that the inboard that combines with radiating segment 32 of the heating panel 21 of the radiating subassembly 20 at two ends all offers semi-circular grooves 211 up and down, the upper and lower side of the radiating segment 32 of heat pipe 30 all is connected with groove 211.

Certainly, for the situation of having only one group of radiating subassembly 20, on heating panel 21 and that end face that the radiating segment 32 of heat pipe 30 links to each other, can offer the semi-circular grooves 211 that cooperates with radiating segment 32 equally.

Claims (5)

1. the structure-improved of heat pipe radiator, it comprises an absorber plate that contacts with CPU (10) and many heat pipes (30), under the vertically disposed situation of mainboard, the endotherm section (31) of heat pipe (30) is vertically fixed on the absorber plate (10), and be and be arranged in parallel, heat pipe (30) extends upward the back bending from absorber plate (10), formation level or acclivitous radiating segment (32), it is characterized in that: radiating segment (32) descends the side in the both sides to be combined with radiating subassembly (20) at least thereon, described radiating subassembly (20) is made of heating panel (21) and fin (22), wherein, heating panel (21) is connected with radiating segment (32) with the one side, and its opposite side that deviates from radiating segment (32) then combines with fin (22).

2. the structure-improved of heat pipe radiator according to claim 1 is characterized in that: the radiating segment (32) of described heat pipe (30) is 90～135 degree with the angle that endotherm section (31) is.

3. the structure-improved of heat pipe radiator according to claim 2 is characterized in that: described heating panel (21) is formed in one with fin (22).

4. according to the structure-improved of each described heat pipe radiator in the claim 1 to 3, it is characterized in that: the heating panel (21) of radiating subassembly (20) offers semi-circular grooves (211) with that side that radiating segment (32) is fixed, and described radiating segment (32) is fixed in the groove (211).

5. the structure-improved of heat pipe radiator according to claim 4 is characterized in that: the both sides up and down of the radiating segment (32) of described heat pipe (30) all are combined with radiating subassembly (20).

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