CN2805086Y

CN2805086Y - Improved structure of radiator scales

Info

Publication number: CN2805086Y
Application number: CN 200520060249
Authority: CN
Inventors: 陈弘岳
Original assignee: 杨开艳
Priority date: 2005-06-27
Filing date: 2005-06-27
Publication date: 2006-08-09
Anticipated expiration: 2015-06-27

Abstract

The utility model relates to the technical field of the radiator of a computer CPU and discloses an improved structure of a radiator fin. The surface of the fin of the utility model has a layer of fin recesses, and the depths of which are between 0.02 mm and 0.1 mm. the layer of the fin recesses of the surface of the fin of the utility model is compared with the circular or square bulges of the surface of the existing fin, the surface area is greatly increased, thereby, the heat transfer rate and the heat radiating effect can be obviously improved.

Description

A kind of fin structure-improved of radiator

Technical field:

The utility model relates to the heat sink technology field of computer CPU, especially relates to a kind of fin of radiator.

Background technology:

Along with the speed of calculator CPU (central processing unit) is accelerated gradually, the heat fast rise that CPU produces.In order to solve heat dissipation problem, radiator still is difficult to satisfy the needs that CPU speed promotes after changing copper fin-type radiator into from the aluminium extruded type radiator in past.The radiator of the CPU of desktop computer begins to install additional heat pipe at present, conducts heat to the fin top near fan from the absorber plate that attaches cpu chip.Accompanying drawing 1 and accompanying drawing 2 are depicted as existing two kinds of radiators, in these two kinds of radiators, directly insert in the round hole that is attached on the fin 03 with the heat pipe 02 that heating panel 01 welds together, because of the heat transfer rate of heat pipe 02 greater than aluminium matter or copper fin 03 several times, so can be, thereby improve radiating effect with heat propagating into fin top than fin faster speed near the fan place.

For the heat pipe radiator of compact computer, see shown in the accompanying drawing 3: it generally has heating panel 01, heat pipe 02, fin 03 and absorber plate 04, wherein, fin 03 is L-shaped, its short section 031 welds together with heating panel 01, the one section 032 performance thermolysis that it is long.

Even but above-mentioned improvement in actual applications, still has many radiators to have the problem of heat-sinking capability deficiency, its reason is as follows:

1. many computer cabinets are compact, and for example notebook computer can't hold large-scale radiator.

2. be subject to metal heat transfer speed, even it is also limited to increase the fin width effectiveness of radiator.

Therefore, the previous considerable problem of order is: how under limited radiator volume, promote heat-sinking capability.

In order to increase heat-sinking capability, some radiator is provided with on the surface of fin 03 and integrated circle of fin or square protruding 05 (seeing shown in the accompanying drawing 4); The strip bulge 06 of many weak points also can be set on fin 03, except increasing area of dissipation, also can have guide functions (seeing shown in the accompanying drawing 5) concurrently.According to experimental result, above-mentioned two kinds of improvement can increase heat-sinking capability 15%.Yet, in these two kinds of designs, because the etching copper foil circuit during the production technology of moulding round point shape or strip projected parts and pcb board are produced on fin 03 is similar, be subjected to the restriction of manufacturing process, the width and the spacing of projection are more than the 0.5mm, too coarse, make the area of dissipation of increase limited, and further granular to increase area of dissipation.

The utility model content:

Content of the present utility model is to provide at the weak point of prior art existence a kind of structure-improved of copper fin of radiator.The fin of the radiator after this improvement can make rate of heat transfer and radiating effect further strengthen.

For achieving the above object, the surface of the utility model fin all has the fine and closely woven depression of one deck.

Described depression is directly molded on the surface of fin.

Described fin surface attachment has the layer of metal powder, forms depression between the metal powder particle, and metal powder and fin surface are because of partly fusion of sintering.

Have metal level between described fin surface and the depression, depression is positioned on the metal level.

The degree of depth of described depression is between 0.02～0.1mm.

The beneficial effects of the utility model are: fin fine and closely woven depression of lip-deep that one deck and existing circle or square convexity, its surface area greatly increases, thereby can show raising rate of heat transfer and radiating effect.

Description of drawings:

Below in conjunction with accompanying drawing the utility model is described further:

Accompanying drawing 1 is the structural representation of one of existing radiator

Accompanying drawing 2 is two structural representation of existing radiator

Accompanying drawing 3 is three structural representation of existing radiator

Accompanying drawing 4 is the structural representation of existing a kind of radiator fins

Accompanying drawing 5 is the structural representation of existing another kind of radiator fins

Accompanying drawing 6 is the sectional structure schematic diagram of one of embodiment of the present utility model

Accompanying drawing 7 is two the sectional structure schematic diagram of embodiment of the present utility model

Accompanying drawing 8 is three the sectional structure schematic diagram of embodiment of the present utility model

Embodiment:

The following stated only is preferred embodiment of the present utility model, does not therefore limit protection range of the present utility model.

See shown in the accompanying drawing 6: in this embodiment, two surperficial straight formings up and down of copper fin 10 have the fine and closely woven depression of one deck 20, and the degree of depth of depression 20 is being the best between 0.02～0.1mm.The forming method of depression 20 comprises: mechanical systems such as fine steel needle stamp method, sand-blast, polish-brush method, and electro-erosion process, chemical microetch method, shine chemical methodes such as line method.

For fear of because of copper fin 10 oxidations shoal depression 20, go back the extremely thin nickel of electrodepositable one deck.Afterwards, should promote the thermal conductivity of copper fin in the mode of high-temperature heat treatment, because adopt mechanical system when fin 10 surface forming depressions 20, can influence the performance of material, so must handle to recover even to surpass the thermal conductivity of copper fin 10 scripts in the mode of high-temperature heat treatment.

Accompanying drawing 7 is embodiment two of the present utility model, and it is that upper and lower surface at fin 10 is sphere or the oblate spheroid metal powder of 0.03～0.3mm in conjunction with one deck diameter, and the material of metal powder can be the copper identical with fin, also can be the aluminium of unlike material.Form depression 20 between the metal powder particle, metal powder and fin 10 surfaces are because of partly fusion of sintering, and all the other structures are identical with embodiment one.

Its forming method is: the tin that at first at electroplating surface one layer thickness of fin 10 is 4～6 microns, spill the metal powder of several layers of dense accumulation then on fin 10 surfaces, afterwards again with 260 ℃ of Reflow Solderings with fin 10 with press close to most its surperficial layer of metal powder and weld, the metal powder of other layer is not because of contacting with zinc-plated, so can't in conjunction with and be removed easily, the metal powder metal powder that only stays surperficial one deck partly fuses because of sintering with fin 10 surfaces.

Another kind of forming method is that two thin tinfoil paper are attached to fin 10 surfaces, spill the metal powder of several layers of dense accumulation then on the surface of fin 10, afterwards again with 260 ℃ of Reflow Solderings with fin 10 with press close to most its surperficial layer of metal powder and weld, the metal powder of other layer only stays the metal powder of surperficial one deck because of not being removed with zinc-plated the contact easily.

Carry out sintering with 600～900 ℃ of high temperature at last, metal powder and fin 10 combined fully, in conjunction with after the interface hole descend, the outer surface of metal bisque then forms fine and closely woven depression 20.

Above-mentioned forming method has following advantage: 1, gain in strength; 2, make the combination interface of metal powder and fin 10 have more the capacity of heat transmission; 3, make fin 10 crystallization again, promote the thermal conductivity of fin 10.

Accompanying drawing 8 is three of embodiment of the present utility model, in this embodiment, it be at first on fin 10 surfaces in conjunction with layer of metal layer 30 (material of metal level 30 is the aluminium different with fin 10).Fin 10 has galvanoplastic (hot-dip method), vacuum splashing and plating method, aluminium foil and copper sheet pressing method etc. with the combination of metal level 30, these methods are all the process of present industrial circle maturation, and the fine and closely woven depression of the just enough follow-up moulding of the thickness of metal level 30 gets final product.Next carry out high-temperature heat treatment to add strong interface and to promote the thermal conductivity of copper fin 10, black with galvanic corrosion or anode treatment or oxidation at last, go out fine and closely woven one deck depression 20 at metal level 30 surface formings,, thereby promote rate of heat transfer and radiating effect with the increase area of dissipation.

Claims

1. the fin structure-improved of a radiator, it is characterized in that: the surface of described fin (10) all has the fine and closely woven depression of one deck (20).

2. the fin structure-improved of radiator according to claim 1, it is characterized in that: described depression (20) is directly molded on the surface of fin (10).

3. the fin structure-improved of radiator according to claim 1, it is characterized in that: described fin (10) surface attachment has the layer of metal powder, forms depression (20) between the metal powder particle, and metal powder and fin (10) surface is because of partly fusion of sintering.

3. the fin structure-improved of radiator according to claim 1 is characterized in that: have metal level (30) between described fin (10) surface and the depression (20), depression (20) is positioned on the metal level (30).

4. according to the fin structure-improved of each described radiator in the claim 1 to 3, it is characterized in that: the degree of depth of described depression (20) is between 0.02～0.1mm.