CN2689462Y - Packing structure for organic LED - Google Patents
Packing structure for organic LED Download PDFInfo
- Publication number
- CN2689462Y CN2689462Y CNU032378904U CN03237890U CN2689462Y CN 2689462 Y CN2689462 Y CN 2689462Y CN U032378904 U CNU032378904 U CN U032378904U CN 03237890 U CN03237890 U CN 03237890U CN 2689462 Y CN2689462 Y CN 2689462Y
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- CN
- China
- Prior art keywords
- emitting diode
- organic light
- light emitting
- cover plate
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a packing structure for an organic luminous diode which comprises a luminous assembly and an outer frame, wherein, the luminous assembly comprises a transparent electric conducting base plate, an organic luminous material layer and a cathode metal layer; the outer frame comprises a seal adhesive layer and a cover plate; the seal adhesive layer is coated around the transparent electric conducting base plate; the cover plate is engaged with the transparent electric conducting base plate through the seal adhesive layer so as to form a sealed space in which inert liquid is filled.
Description
[technical field]
The utility model relates to a kind of luminous element packing structure, especially about a kind of encapsulating structure of Organic Light Emitting Diode.
[background technology]
Display of organic electroluminescence (Organic ElectroluminescenceDisplay, OELD), claim Organic Light Emitting Diode (Organic LightEmitting Diode again, OLED), because have advantages such as high-luminous-efficiency, high brightness, wide visual angle and screen reaction are fast, obtain gradually in recent years paying attention to.The principle of luminosity of Organic Light Emitting Diode is that specific luminous organic material is applied electric field, and with the combination on organic luminous layer of electronics, hole, electronics falls back ground state by excitation state, excess energy is disengaged with form of light waves, thereby reach luminous function.But, because metal electrode and organic luminous layer in the Organic Light Emitting Diode are very responsive to steam and oxygen, the infiltration of steam and oxygen can make metal electrode and organic luminous layer peel off in the environment, material cracking and anodizing, and then the generation dim spot, will reduce the luminous intensity of Organic Light Emitting Diode and luminous uniformity etc. significantly.
Therefore, after finishing the evaporation process of metal electrode and organic luminorphor on the glass substrate of Organic Light Emitting Diode, can be with the top cover encapsulating organic light emitting diodes.
Seeing also Fig. 1, is a kind of encapsulating structure schematic diagram of prior art Organic Light Emitting Diode.This Organic Light Emitting Diode comprises a housing 10 and a luminescence component 20.This luminescence component 20 comprises a conducting glass substrate 201, an anode conductive layer 202, a luminous organic material layer 204 and a cathodic metal layer 206.This anode conductive layer 202, this luminous organic material layer 204 and this cathodic metal layer 206 are superimposed upon this conducting glass substrate 201 successively, and this housing 10 comprises an adhesive layer 104 and a top cover 106.This adhesive layer 104 is coated in around the upper surface of this conducting glass substrate 201.This top cover 106 engages with this conducting glass substrate 201 by adhesive layer 104, forms a confined space 108.For stopping steam, top cover 106 is drier 1611 with respect to the paster 1064 common drying chambers 161 that form at outstanding position 1062 and this outstanding position of covering of luminescence component 20 in this drying chamber 161.For further stopping steam and oxygen, charge into nitrogen in this confined space 108.
Above-mentioned encapsulating structure utilizes the desiccant layers 1611 in the drying chamber 161 can absorb the function of steam, can realize the effect of block water vapour in a period of time.But when the thickness of desiccant layer 1611 during greater than a critical value, its water vapor absorption amount can not increase, and steam still can infiltrate in the luminescence component 20, so only by desiccant layer 1611 and can't guarantee the luminescent quality that Organic Light Emitting Diode is higher for a long time.And because the setting of desiccant layer 1611, increase the volume of Organic Light Emitting Diode, can't satisfy the demand of component size miniaturization.
[utility model content]
Organic Light Emitting Diode can't stop the defective that steam and oxygen and encapsulation volume are big long-term effectively in the prior art in order to overcome, and the utility model provides a kind of encapsulating structure that can stop steam and oxygen long-term effectively and reduce the encapsulation volume of Organic Light Emitting Diode.
The technical scheme that the utility model technical solution problem is adopted is: a luminescence component and a housing are provided, this luminescence component comprises a transparent conductive substrate, a luminous organic material layer and a cathodic metal layer, this housing comprises an adhesive layer and a cover plate, this adhesive layer is coated in around this transparent conductive substrate, this cover plate engages with this transparent conductive substrate by this adhesive layer, and form a confined space, be full of inert fluid in this confined space.
Compared with prior art, the inert fluid in the utility model organic light-emitting diode packaging structure can stop the infiltration of steam and oxygen for a long time, keeps the luminescent quality of light-emitting diode for a long time, and does not need to be provided with drying chamber, reduces encapsulation volume.
[description of drawings]
Fig. 1 is a kind of prior art organic light-emitting diode packaging structure schematic diagram.
Fig. 2 is the utility model organic light-emitting diode packaging structure first execution mode schematic diagram.
[embodiment]
Seeing also Fig. 2, is the schematic diagram of the utility model organic light-emitting diode packaging structure first execution mode.This organic light-emitting diode packaging structure comprises a luminescence component 30 and a housing 40.This luminescence component 30 comprises a transparent conductive substrate 302, a luminous organic material layer 306 and a cathodic metal layer 308 from bottom to top.This housing 40 comprises an adhesive layer 402 and a cover plate 404, and this adhesive layer 402 is coated in around this transparent conductive substrate 302; This cover plate 404 engages with this transparent conductive substrate 302 by this adhesive layer 402, and forms a confined space 54, is full of transparency liquid 56 in this confined space.
This transparent conductive substrate 302 comprises a transparency carrier 3022 and a conductive layer 3024, this conductive layer 3024 is positioned at the upper surface of this transparency carrier 3022, this transparency carrier 3022 can be a glass material, it also can be thin-film material, as PETG (Poly-Ethylene Terephthalate, PET), PEN (Poly-Ethylene Naphthalate, PEN), poly terephthalic acid dimethyl ester (Poly-TrimethyleneTerephthalate, PTT), polybutylene terepthatlate (Poly-Buthylene Terephthalate, PBT) and polyether sulfone (Poly-EtherSulfone, PES) etc.This conductive layer 3024 also is a transparent material, for tin indium oxide (Indium Tin Oxide, ITO).
This cover plate 404 is transparent cover plates, and its material can be a glass, also can be film, as PETG, PEN) and polyether sulfone etc.This cover plate 404 is corresponding with this transparent conductive substrate 302, and cover plate 404 is set according to the actual requirements with the concrete big I of transparent conductive substrate 302.
This adhesive layer 402 is UV cured glue, also can be thermohardening type glue, can also be the colloid that UV cured glue and thermohardening type glue have concurrently.This luminous organic material layer 306 and this cathodic metal layer 308 are positioned at this confined space 54.This transparency liquid 56 is an inert fluid, as polyvinyl alcohol resin (Poly-Vinyl Alcohol, PVA), the polyethylene glycol resin (Poly-Ethylene Glycol, PEG) and polyol polyester resin (Polyol) etc.This transparency liquid 56 does not react with this luminous organic material layer 306 and this cathodic metal layer 308, and can stop the infiltration of steam and oxygen.
The utility model organic light-emitting diode packaging structure second execution mode is the further improvement structure of first execution mode.The transparency liquid 56 that is full of in the utility model second execution mode is acrylic resin.It is through the ultraviolet irradiation after-hardening, and sclerosis back acrylic resin is solid-state, can stop the infiltration of steam and oxygen, thereby reach the effect of protection.The present embodiment organic light-emitting diode packaging structure does not need to be provided with transparent cover plate.If but the further infiltration of steam and oxygen in the blocks air also can increase by a cover plate.
Because the infiltration that inert fluid that the encapsulating structure of the utility model Organic Light Emitting Diode adopts or acrylic resin can stop steam and oxygen, and drying layer need be set below transparent cover plate, the substrate of Organic Light Emitting Diode and cover plate adopt transparent material, can lighting at two sides, so, the encapsulating structure of the utility model Organic Light Emitting Diode can prevent the infiltration of steam and oxygen long-term effectively, guarantee the luminescent quality of Organic Light Emitting Diode, and reduce the encapsulation volume of element, improve luminous efficiency.
Claims (4)
1. the encapsulating structure of an Organic Light Emitting Diode, it comprises a luminescence component and a housing, this luminescence component comprises a transparent conductive substrate, a luminous organic material layer and a cathodic metal layer, this housing comprises an adhesive layer and a cover plate, this adhesive layer is coated in around this transparent conductive substrate, this cover plate engages with this transparent conductive substrate by this adhesive layer, and forms a confined space, it is characterized in that: be full of inert fluid in this confined space.
2. the encapsulating structure of Organic Light Emitting Diode as claimed in claim 1 is characterized in that: this inert fluid covers this luminous organic material layer and this cathodic metal layer.
3. the encapsulating structure of Organic Light Emitting Diode as claimed in claim 2, it is characterized in that: this inert fluid is transparent inert fluid, and this cover plate is a transparent cover plate.
4. the encapsulating structure of Organic Light Emitting Diode as claimed in claim 3, it is characterized in that: this transparent inert fluid is polyvinyl alcohol resin or polyethylene glycol resin or polyol polyester resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032378904U CN2689462Y (en) | 2003-09-27 | 2003-09-27 | Packing structure for organic LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032378904U CN2689462Y (en) | 2003-09-27 | 2003-09-27 | Packing structure for organic LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2689462Y true CN2689462Y (en) | 2005-03-30 |
Family
ID=34661001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU032378904U Expired - Lifetime CN2689462Y (en) | 2003-09-27 | 2003-09-27 | Packing structure for organic LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2689462Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325934A (en) * | 2012-03-19 | 2013-09-25 | 鸿富锦精密工业（深圳）有限公司 | Light-emitting diode packaging structure and manufacture method thereof |
-
2003
- 2003-09-27 CN CNU032378904U patent/CN2689462Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325934A (en) * | 2012-03-19 | 2013-09-25 | 鸿富锦精密工业（深圳）有限公司 | Light-emitting diode packaging structure and manufacture method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20130927 Granted publication date: 20050330 |