CN1302530C - Method for packaging electronic component - Google Patents
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- CN1302530C CN1302530C CNB031407501A CN03140750A CN1302530C CN 1302530 C CN1302530 C CN 1302530C CN B031407501 A CNB031407501 A CN B031407501A CN 03140750 A CN03140750 A CN 03140750A CN 1302530 C CN1302530 C CN 1302530C
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Abstract
The present invention discloses a method for packaging electronic components. Nanometer inorganic materials are mixed with macromolecular materials to form an unhardened packaging layer, and the packaging layer is evenly coated on an electronic component to be packaged; after the packaging layer is solidified, a barrier layer for packaging the electronic component is obtained through a compact structure generated between the nanometer inorganic materials and the macromolecular materials so as to improve the effect of resisting humidity and air of the electronic component.
Description
Technical field
The present invention relates to a kind of method for packing of electronic component, this method reaches the wet choke effect of resistance by a kind of encapsulated layer that can directly coat on the electronic component, meets the design characteristics of present electronic product deflection simultaneously.
Background technology
In the epoch that are the theme with safety now, people make more and more darker to the dependence of information products based on the problem of reason easily in life or living environment.But often have such situation, for example use video device, or carry electronic product and but run into and rain or wet weather in the bathroom.
General modern product all is made up of electronic component basically, in a single day these electronic components meet aqueous vapor, and the moment of connection will make the starting resistor of electronic component change rapidly, and this phenomenon the lighter damages electronic product, weight person can cause fire, causes the damage of user or people around or article.And aqueous vapor also can cause oxidation of electronic product circuit even short circuit, very easily electronic component is caused physical damage.If be the electronic component that does not have water-proof function, entire loss can't be retrieved so.It should be noted that because the disguise of aqueous vapor is strong, be difficult for being found, in case when connecting computer, be short-circuited, even may burn computer motherboard! This shows that " waterproof " problem of electronic component is the major issue that can't avoid really, as long as there is this leak to exist, is safe for this electronic product with regard to not talkative its so.
With regard to present electronic product, seem particularly important to carry out damp proof gas-tight in the encapsulation of photoelectric cell again, because water-tight device has direct relation to the quality and life-span of product.For instance, Organic Light Emitting Diode (Organic light emitting diode; OLED) possess self-luminous, thin thickness, reaction speed is fast, the visual angle is wide, good resolution, brightness high and can be used for multiple advantages such as flexibility panel, the film-type LCD that is considered to continue (Thin film transistor liquid crystal display; TFT-LCD) the flat-panel screens technology of a new generation afterwards, but it also is to use at present to go up anti-aqueous vapor and require the strictest vague generalization product.
But owing to a little less than low molecular luminous organic material is highly brittle to moisture, contact the easily defective of generation stain (Dark Spot) of back with atmosphere, therefore, if encapsulate badly, stain will appear in element.This is because moisture can enter element from metal film or its edge, because negative electrode is a metal material in the organic electroluminescent element, makes anodizing, causes loose contact, and stain becomes greatly gradually, and effective viewing area of organic electroluminescent element dwindles thereupon.The current density that this can increase effective viewing area conversely again causes driving voltage to increase.So,, just can control the growth of this stain if encapsulate well.But if element is exposed in the air for a long time, this stain will occur sooner or later.Therefore, in order to reduce the formation of stain, make this photoelectric cell isolate moisture, the device of avoiding the aqueous vapor erosion seems extremely important.
Present traditional method for packing in the full-automatic volume production process system of organic electric-excitation luminescent plated film/involution has following described several:
" organic light-emitting diode element package " is a kind of organic light-emitting diode element, comprising: one has the substrate of element region; One in order to pack the cap of this element, and this cap produces a cavity on this element region; And in this element region in order to support the sept particulate of this cap.
" manufacturing process of organic illuminating element watertight composition " is a kind of manufacture method of organic electroluminescent element, and wherein this organic electric-excitation luminescent displaying panel comprises a plurality of light-emitting zones, comprising: a substrate is provided earlier; Then on this substrate, form first electrode corresponding to light-emitting zone in regular turn; Form a strip photoresist layer on the substrate that contains first electrode, this photoresist layer protrudes in the substrate that contains first electrode; On first electrode of the exposed region between the strip photoresist layer, deposit organic light emitting medium, on first electrode, to form a plurality of the first region territories that comprise organic light emitting medium; On the organic light emitting medium layer, form second electrode; Form the stresses counteract layer on second electrode, wherein this stresses counteract layer is silica nitrogen film or polymeric membrane; And on the stresses counteract layer, form watertight composition, wherein this watertight composition is amorphous silicon, inorganic nitride or inorganic oxide.
" method for packing of organic light emitting apparatus ", it is a kind of method for packing of Organic Light-Emitting Device, in order to the luminescent layer in the organic electroluminescent element is encapsulated, this method comprises: on this organic electroluminescent element, form an encapsulated layer with cryogenic vacuum plated film growing method, this luminescent layer is encapsulated.
" organic light emitting display and method for packing thereof " is a kind of method for packing of organic electro-luminescent display, comprises the following steps:
(1) provides an encapsulation base material and an organic electroluminescent element to be packaged;
(2) then on whole of above-mentioned encapsulation base material, evenly be coated with one deck encapsulating material;
(3) above-mentioned encapsulation base material is formed with the one side of encapsulating material directly towards electromechanics is arranged
The exciting light element is formed with the one side alignment of luminescent layer, and pressurization and heating then makes the encapsulation of finishing this element after the encapsulation material solidifies.
" method and the structure thereof of protection organic electro-luminescent display " is a kind of method of manufacturing one organic electro-luminescent display, and this method comprises the following steps:
On a substrate, form one first electrode layer;
Above this first electrode layer, form an organic layer;
Form a second electrode lay above this organic layer, this second electrode lay and this first electrode layer form a staggered picture element matrix array, and wherein this substrate, this first electrode layer, this organic layer and this second electrode lay form an organic electroluminescent element;
Above this second electrode lay of some, cover a protective layer, a component that wherein has minimum electromotive force in the component of this protective layer, the one electromotive force is an electromotive force that has a component of maximum electromotive force in the component less than this second electrode lay, suffers the intrusion of aqueous vapor and oxygen in order to protect this organic electroluminescent element to avoid; And encapsulate this organic electroluminescent element with an airtight shell, so as to isolated this organic electroluminescent element and extraneous air and aqueous vapor.
" method for packing of electroluminescence element " is a kind of method for packing of electroluminescence element, wherein comprises the following steps: at least
In a water, oxygen control environment, a glass substrate and a glass cover-plate are provided, this glass cover-plate is corresponding with this glass substrate, and this glass substrate has a plurality of electroluminescence element;
In this water, oxygen controled environment, a plurality of bezel locations were coated with a frame glue respectively on this glass cover-plate, and these bezel locations are corresponding one by one with these electroluminescence element, and each frame glue has an opening respectively;
In this water, oxygen control environment, make these frame glue between this glass cover-plate and this glass substrate, with this glass cover-plate and this glass substrate pressing, and make these electroluminescence element between this glass cover-plate and this glass substrate;
In this water, oxygen control environment, make these frame adhesive curings;
In this water, oxygen control environment,, this glass cover-plate and this glass substrate are cut according to the distribution of these electroluminescence element;
In this water, oxygen control environment, cutting mode according to this glass cover-plate and this glass substrate, with each electroluminescence element separately, form independently a plurality of separately packaging parts, and each packaging part comprise an element glass substrate, these electroluminescence element one of them, these frame glue one of them and an element glass cover-plate, and by this element glass cover-plate, this element glass substrate and these frame glue one of them constitutes a cavity;
One vacuum chamber is provided, disposes a glue groove in the bottom of this vacuum chamber, fill an encapsulating material in this glue groove, and these packaging parts are inserted in this vacuum chamber, this opening that makes each packaging part is towards this glue groove, and these packaging parts do not contact with this encapsulating material;
This vacuum chamber is carried out vacuum suction, make these packaging parts and this encapsulating material vacuum degassing;
When this vacuum chamber reaches one when setting vacuum degree, these packaging parts are immersed in this glue groove, this opening of each packaging part is contacted with this encapsulating material carry out encapsulating;
Make this vacuum chamber pressure rise to a setting pressure, this encapsulating material is injected by this opening of each packaging part respectively and be full of this cavity, form an element encapsulating material and cover this electroluminescence element fully; And make each component package material cured.
" method for packing of organic EL " is the method for packing of a kind of organic electro-luminescent display (Organic Electroluminescent Device) element, comprising:
One forms the organic EL step, provides a transparency carrier, and forms a plurality of organic ELs on this transparency carrier; One forms Plastic Package thin plate and bonding coat step, provides a Plastic Package thin plate, and forms a plurality of bonding coats on this Plastic Package thin plate;
One forms the encapsulation jar step that includes cave-shaped zone, is to form a plurality of cave-shaped zones on this Plastic Package thin plate, and is used as an encapsulation jar with the Plastic Package thin plate in this cave-shaped zone of tool; An and packaging body engagement step, be to encapsulate a jar side, it is a side engagement that has the machine EL element on a side of tool bonding coat on the sheet plastic and this transparency carrier, and with this bonding coat of the dry sclerosis of the mode of heat energy or ultraviolet curing (UV-Curing) to form a packaging body, make that the organic EL of package interior and the external world are isolated fully.
Comprehensive the above, traditional method for packing all is at indium tin oxide (ITO; Indium Tin Oxide) utilize the technology of vacuum evaporation film forming with organic light emission layer film and metal electrode (negative electrode on the glass substrate; Cathode) distribution film, after film forming and process are checked in a continuous manner, involution jar (cap) is coated with packaging plastic and inner hygroscopic material on every side, then, this packaging plastic of the dry sclerosis of mode by heat energy or ultraviolet curing (UV-Curing), with in conjunction with cap and substrate, by encapsulating organic electroluminescent element in aforementioned cap and substrate, can enter cap inside to intercept outside aqueous vapor and oxygen by packaging plastic, and by hygroscopic material to absorb aqueous vapor and the oxygen in cap and the substrate, to reach the effect of the wet choke of resistance.
Though the above-mentioned method for packing that utilizes cap, packaging plastic and hygroscopic material, can make this photoelectric cell isolate the erosion of moisture, but because the diversification of product design and lightening trend, the method for packing of the cap that has with present tradition, after the flexural design of Chang Yinwei product, this photoelectric cell influences this component life because of concentrating of stress, so the encapsulation of present photoelectric cell still remains to be improved.
Summary of the invention
So main purpose of the present invention is to solve the defective of above-mentioned conventional art, avoid defective to exist.The present invention is by the encapsulated layer material that macromolecular material constituted of sneaking into nano inorganic material, directly coat on the electronical elements surface to be packaged, so as to replacing cap and the inner hygroscopic material in the conventional package mode, simultaneously, also save the packaging plastic cost and the processing procedure problem that are used for around the cap, also having solved the conventional package lid can be because after the deflection, and it is concentrated that this electronic component produces stress, cause peeling off and breaking of cap, and influence the defective in its life-span.
For realizing above-mentioned purpose, the organic electroluminescent element method for packing of nano inorganic polymeric gel material of the present invention, be to utilize nano inorganic material to mix to form a unhardened encapsulated layer with macromolecular material, rotary coating is on electronic component to be packaged equably, after layer to be packaged solidifies, produce the barrier layer of a tool compactness structure between inorganic material and the macromolecular material, can strengthen the wet choke effect of resistance of photoelectric cell.
A kind of method for packing of electronic component is characterized in that this method for packing may further comprise the steps:
A) preparation provides a nano inorganic material and a macromolecular material, and this nano inorganic material is made of following any material: iron, aluminium, titanium, platinum, magnesium, silver, chromium;
B) above-mentioned two material mixing are formed unhardened nano inorganic polymer, be mixed into an encapsulated layer material, and the viscosity of controlling this encapsulated layer material is between 5000cps to 50000cps;
C) provide an electronic component to be packaged;
D) above-mentioned unhardened encapsulated layer material is evenly coated the part that above-mentioned electronic component to be packaged need encapsulate;
E) treat that above-mentioned encapsulated layer material after solidifying, finishes the encapsulation of this electronic component.
Preferably, the granular size of this nano inorganic material is between 1nm to 100nm.
Preferably, this macromolecular material is to be selected from following any material: poly-epoxy resin, poly-acryl resin, polyurethane resin, poly-epoxy resin/acryl resin mixing macromolecule, poly-acryl resin/polyurethane resin mixing macromolecule, polysilane resin, polysiloxanes resin, organic/inorganic co-polymer.
Preferably, the encapsulated layer material of this step b is after the aqueous vapor through characteristic test of carrying out naked base material, chooses the optimum mixture ratio example of this material.
Preferably, between this nano inorganic material and macromolecular material be the bond chain that forms a chemical bond.
Preferably, between this nano inorganic material and macromolecular material be the bond chain that forms a Van der Waals key.
Description of drawings
Fig. 1 is a method for packing schematic flow sheet of the present invention.
Fig. 2-1,2-2 are Organic Light Emitting Diode encapsulation embodiment schematic diagrames of the present invention.
Fig. 3 is the LCD encapsulation schematic diagram of another embodiment of the present invention.
Fig. 4 is the hull cell encapsulation schematic diagram of another embodiment of the present invention.
Embodiment
Relevant detailed content of the present invention and technical descriptioon, existing conjunction with figs. is described as follows.
Referring to Fig. 1, be method for packing schematic flow sheet of the present invention.As shown in the figure: the organic electroluminescent element method for packing of nano inorganic polymeric gel material of the present invention comprises the following steps:
A) provide a nano inorganic material and a macromolecular material, then with above-mentioned two material preparations, according to reactivation and be mixed and made into the nano inorganic polymer of different components ratio;
B) above-mentioned encapsulated substance is mixed the unhardened nano inorganic polymer mixed of formation and become an encapsulated layer material, after carrying out the aqueous vapor through characteristic test of naked base material (Bare material) simultaneously, so as to choosing optimum mixture ratio example and make comparisons with other material, and the viscosity of controlling this encapsulated layer material is at 5000cps (cps=centipoise; Centipoise) between the 50000cps;
C) provide an electronic component to be packaged;
D) above-mentioned unhardened encapsulated layer material is coated the part that above-mentioned electronic component to be packaged need encapsulate equably;
E) the encapsulated layer material for the treatment of above-mentioned coating is finished the encapsulation of this electronic component after solidifying.
Wherein, this nano inorganic material is made of following any material: iron (Fe), aluminium (Al), titanium (Ti), platinum (Pt), magnesium (Mg), silver (Ag), chromium (Cr), silicon dioxide (SiO
2), titanium dioxide (TiO
2), zinc oxide (ZnO
2); Again, the granular size of this nano inorganic material is between 1nm to 100nm.
Wherein, this macromolecular material is to be selected from following any material: poly-epoxy resin (Epoxy), poly-acryl resin (Arcrylic), polyurethane resin (Urethane), poly-epoxy resin/acryl resin (Epoxy/Arcrylic) mix macromolecule, poly-acryl resin/polyurethane resin (Arcrylic/Urethane) mixes macromolecule, polysilane resin (Silicone), polysiloxanes resin (Silioxane), organic/inorganic co-polymer (Organic/Inorganic).
Between this nano inorganic material and macromolecular material be the bond chain that forms the bond chain of a chemical bond or form a Van der Waals key again.
Referring to Fig. 2-1,2-2, be Organic Light Emitting Diode encapsulation embodiment schematic diagram of the present invention simultaneously.As shown in the figure: organic electroluminescent element 10 method for packing of the present invention are made of the encapsulated layer material 20 that a nano inorganic material and a macromolecular material form.
This organic electroluminescent element 10 includes a substrate 11, on substrate 11, dispose the anode conductive layer 12 and a negative electrode barrier layer 13 of patterning, one organic luminous layer 14,14 ' is set again, on organic luminous layer 14,14 ', be formed with a cathode conductive layer 15,15 ' again, be folded with machine luminescent layer 14 between the anode conductive layer 12 on the cathode conductive layer 15 of formation and the substrate 11;
Then, by sneaking into the encapsulated layer material 20 that nano inorganic material and macromolecular material constitute, and the viscosity of controlling this encapsulated layer material 20 is between 5000cps to 50000cps, directly coat on the organic electroluminescent element 10, after layer material 20 to be packaged solidifies, the barrier layer of a compactness structure that produces between this nano inorganic material and the macromolecular material, just can strengthen the wet choke effect of resistance of organic electroluminescent element 10, so, the present invention can replace traditional cap and inner hygroscopic material effectively, also save the packaging plastic problem used around the cap or because element produces stress and concentrates after the deflection of conventional package lid, cause peeling off and breaking and influence the defective in its life-span of cap.
Referring to Fig. 3, be the LCD encapsulation schematic diagram of another embodiment of the present invention.As shown in the figure: the LCD basic building block is two transparency carriers 31,31 ', and be sandwiched between two transparency carriers 31,31 ' a LCD alignment element 36 that comprises liquid crystal layer, be arranged at the Polarizer 32,33 in above-mentioned two transparency carriers 31, the 31 ' outside respectively, and in wherein on the Polarizer 33 light guide plate 34, one modules 35 backlight being set in regular turn again; Wherein be the LCD alignment element 36 between protection two transparency carriers 31,31 '; between two transparency carriers 31,31 '; the periphery of LCD alignment element 36 can utilize encapsulated layer material of the present invention 37 to connect and fix two transparency carriers 31,31 ' relative position, reaches the effect of anti-aqueous vapor simultaneously by the present invention.
Referring to Fig. 4, be the hull cell encapsulation schematic diagram of another embodiment of the present invention.As shown in the figure: hull cell can be considered the film version of lithium battery basically, and its basic building block is a substrate 40, be divided into two positions in order to the external minus plate 41 and positive plate 42 that is connected conduction; One is arranged at the cathode layer 43 on the above-mentioned minus plate 41; One is arranged at the solid-state electrolyte 44 on the above-mentioned cathode layer 43, and this electrolyte 44 is connected with positive plate 42 simultaneously; One anode layer 45 is arranged on the above-mentioned electrolyte 44, and it must cover positive plate 42 simultaneously; Utilize encapsulated layer material 46 of the present invention to be covered in the superiors at last, but minus plate 41 must expose out convenient connection use with positive plate 42.
The applicable field of the hull cell of these little capacitances comprises the power supply of memory element, the power supply of non-contact IC card, the power supply of microcomputer electric component.Because being characterized as of the said goods is compact, general hull cell is in order there to be good anti-aqueous vapor effect, and sacrificed light and handy design; Or sacrificed water proofing property for light and handy design; But use packaged type of the present invention, realized the light and handy encapsulation of anti-aqueous vapor again on the encapsulation procedure.
Comprehensive above-described embodiment, the present invention is one by the encapsulated layer material 20 of sneaking into nano inorganic material and macromolecular material, it is characterized in that to apply to the electronic component coating encapsulation of holohedral form, simultaneously on the organic electroluminescent element 10 that is directed to flexible musical form and non-deflection formula, can replace traditional cap and inner hygroscopic material, really can strengthen the wet choke effect of resistance of electronic component, and its utilization scope and technical benefits are quite extensive, it is as follows to underdraw respectively:
(1) the exercisable industry of the present invention make classification as:
(1) organic electro-luminescent display (OLED), macromolecule organic electro-luminescent display (PLED) and the deflection organic illuminating element (FOLED) of general glass substrate.
(2) integrated circuit (IC) encapsulation.
(3) encapsulation of other electron component.
(4) encapsulation of inorganic electroluminescence display led.
(5) encapsulation of thin film electroluminescence (TFEL) display.
(6) LCD (LCD) encapsulation.
(7) encapsulation and the high efficiency light transmission protective layer of batteries such as solar cell, solar cell power generation system, noncrystal membrane battery, monocrystalline and polycrystal film battery.
(8) corrosion protection of other various industries utilization.
(2) use advantage of the present invention:
(1) can promote the packaging effect of element to be packaged and increase its life-span.
(2) can be used in multiple different industry article package application, its range of application is wider.
When (3) being used in flexibility organic illuminating element (FOLED), the tow sides that can be applicable to element are to stop water, impervious.
When (4) being used in the encapsulation of hull cell, can prevent that the negative electrode or other lamination that easily expose from causing phenomenons such as corrosion or oxidation because of the contact external environment, the packaging effect of lift elements and increase component life.
(5) can reduce the volume and the thickness of element to be packaged.
(6) can reduce the cost and the time of processing procedure.
Claims (6)
1. the method for packing of an electronic component is characterized in that this method for packing may further comprise the steps:
A) preparation provides a nano inorganic material and a macromolecular material, and this nano inorganic material is made of following any material: iron, aluminium, titanium, platinum, magnesium, silver, chromium;
B) above-mentioned two material mixing are formed unhardened nano inorganic polymer, be mixed into an encapsulated layer material (20), and the viscosity of controlling this encapsulated layer material (20) is between 5000cps to 50000cps;
C) provide an electronic component to be packaged;
D) above-mentioned unhardened encapsulated layer material (20) is evenly coated the part that above-mentioned electronic component to be packaged need encapsulate;
E) treat that above-mentioned encapsulated layer material (20) after solidifying, finishes the encapsulation of this electronic component.
2. the method for packing of electronic component according to claim 1 is characterized in that, the granular size of this nano inorganic material is between 1nm to 100nm.
3. the method for packing of electronic component according to claim 1, it is characterized in that this macromolecular material is to be selected from following any material: poly-epoxy resin, poly-acryl resin, polyurethane resin, poly-epoxy resin/acryl resin mixing macromolecule, poly-acryl resin/polyurethane resin mixing macromolecule, polysilane resin, polysiloxanes resin, organic/inorganic co-polymer.
4. the method for packing of electronic component according to claim 1 is characterized in that, the encapsulated layer material (20) of this step b is after the aqueous vapor through characteristic test of carrying out naked base material, chooses the optimum mixture ratio example of this material.
5. the method for packing of electronic component according to claim 1 is characterized in that, is the bond chain that forms a chemical bond between this nano inorganic material and macromolecular material.
6. the method for packing of electronic component according to claim 1 is characterized in that, is the bond chain that forms a Van der Waals key between this nano inorganic material and macromolecular material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031407501A CN1302530C (en) | 2003-06-11 | 2003-06-11 | Method for packaging electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031407501A CN1302530C (en) | 2003-06-11 | 2003-06-11 | Method for packaging electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1567554A CN1567554A (en) | 2005-01-19 |
| CN1302530C true CN1302530C (en) | 2007-02-28 |
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ID=34470805
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031407501A Expired - Fee Related CN1302530C (en) | 2003-06-11 | 2003-06-11 | Method for packaging electronic component |
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| Country | Link |
|---|---|
| CN (1) | CN1302530C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI489338B (en) * | 2012-12-19 | 2015-06-21 | Chih Chung Lin | Polarization structure with touch function |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9146207B2 (en) | 2012-01-10 | 2015-09-29 | Hzo, Inc. | Methods, apparatuses and systems for sensing exposure of electronic devices to moisture |
| WO2013106253A1 (en) | 2012-01-10 | 2013-07-18 | Hzo Inc. | Methods, apparatuses and systems for monitoring for exposure of electronic devices to moisture and reacting to exposure of electronic devices to moisture |
| CN103904234B (en) * | 2012-12-25 | 2016-04-27 | 海洋王照明科技股份有限公司 | A kind of organic electroluminescence device and preparation method thereof |
| TWI612505B (en) * | 2016-12-02 | 2018-01-21 | 友達光電股份有限公司 | Display Panel |
| CN106816549B (en) * | 2016-12-08 | 2019-03-12 | 瑞声科技（南京）有限公司 | Oled device and its manufacturing method |
| CN106876598B (en) * | 2017-01-11 | 2019-01-18 | 瑞声科技（南京）有限公司 | Oled device and preparation method thereof |
| CN108461642A (en) * | 2017-02-17 | 2018-08-28 | 上海和辉光电有限公司 | A kind of thin-film package component of organic light emitting diode device |
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| CN1254181A (en) * | 1998-07-14 | 2000-05-24 | 国家淀粉及化学投资控股公司 | Method for preparing electronic instrument component by simultaneously adopoting soldifying adhesive and sealant |
| CN1270979A (en) * | 2000-05-10 | 2000-10-25 | 吉林大学 | Organic silicon/epoxy resin packing material modified with nanometer-level silicon-base oxide |
| CN1341683A (en) * | 2001-09-25 | 2002-03-27 | 中国科学院广州化学研究所 | Polyacrylonitrile/inorganic composite material, its preparation method and application |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1254181A (en) * | 1998-07-14 | 2000-05-24 | 国家淀粉及化学投资控股公司 | Method for preparing electronic instrument component by simultaneously adopoting soldifying adhesive and sealant |
| CN1270979A (en) * | 2000-05-10 | 2000-10-25 | 吉林大学 | Organic silicon/epoxy resin packing material modified with nanometer-level silicon-base oxide |
| CN1341683A (en) * | 2001-09-25 | 2002-03-27 | 中国科学院广州化学研究所 | Polyacrylonitrile/inorganic composite material, its preparation method and application |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI489338B (en) * | 2012-12-19 | 2015-06-21 | Chih Chung Lin | Polarization structure with touch function |
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| CN1567554A (en) | 2005-01-19 |
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