CN1599517A - Package structure of organic LED and its method - Google Patents
Package structure of organic LED and its method Download PDFInfo
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- CN1599517A CN1599517A CN 03146915 CN03146915A CN1599517A CN 1599517 A CN1599517 A CN 1599517A CN 03146915 CN03146915 CN 03146915 CN 03146915 A CN03146915 A CN 03146915A CN 1599517 A CN1599517 A CN 1599517A
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- emitting diode
- light emitting
- organic light
- transparent conductive
- conductive substrate
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Abstract
This invention relates to an organic LED packaging structure including a light emitting component and a outer frame, among which, the light emitting component comprises a transparent conduction base plate, an organic light emitting material layer and a cathode metal layer, the outer frame includes a glue sealing layer coated at outside of the base board and a cover connected with the base board via the glue sealing layer to form a close space full of inert liquid.
Description
[technical field]
The present invention relates to a kind of luminous element packing structure and method for packing thereof, especially about a kind of encapsulating structure and method for packing thereof of Organic Light Emitting Diode.
[background technology]
Display of organic electroluminescence (Organic ElectroluminescenceDisplay, OELD), claim Organic Light Emitting Diode (Organic LightEmitting Diode again, OLED), because have advantages such as high luminous efficiency, high brightness, wide visual angle and screen reaction are fast, obtain gradually in recent years paying attention to.The principle of luminosity of Organic Light Emitting Diode is that specific luminous organic material is applied electric field, and with the combination on organic luminous layer of electronics, hole, electronics falls back ground state by excitation state, excess energy is disengaged with form of light waves, thereby reach luminous function.But, because metal electrode and organic luminous layer in the Organic Light Emitting Diode are very responsive to steam and oxygen, the infiltration of steam and oxygen can make metal electrode and organic luminous layer peel off in the environment, material cracking and anodizing, and then the generation dim spot, will reduce the luminous intensity of Organic Light Emitting Diode and luminous uniformity etc. significantly.
Therefore, after finishing the evaporation process of metal electrode and organic luminorphor on the glass substrate of Organic Light Emitting Diode, can be with the Organic Light Emitting Diode of top cover packaged glass substrate surface.
Seeing also Fig. 1, is a kind of encapsulating structure schematic diagram of prior art Organic Light Emitting Diode.This Organic Light Emitting Diode comprises a housing 10 and a luminescence component 20.This luminescence component 20 comprises a conducting glass substrate 201, an anode conductive layer 202, a luminous organic material layer 204 and a cathodic metal layer 206.This anode conductive layer 202, this luminous organic material layer 204 and this cathodic metal layer 206 are superimposed upon this conducting glass substrate 201 successively, and this housing 10 comprises an adhesive layer 104 and a top cover 106.This adhesive layer 104 is to be coated in around the upper surface of this conducting glass substrate 201.This top cover 106 engages with this conducting glass substrate 201 by adhesive layer 104, forms a confined space 108.For stopping steam, top cover 106 is drier 1611 with respect to the paster 1064 common drying chambers 161 that form at outstanding position 1062 and this outstanding position of covering of luminescence component 20 in this drying chamber 161.For further stopping steam and oxygen, charge into nitrogen in this confined space 108.
Above-mentioned encapsulating structure utilizes the desiccant layers 1611 in the drying chamber 161 can absorb the function of steam, can realize the effect of block water vapour in a period of time.But when the thickness of desiccant layer 1611 during greater than a critical value, its water vapor absorption amount can not increase, and steam still can infiltrate in the luminescence component 20, so only by desiccant layer 1611 and can't guarantee the luminescent quality that Organic Light Emitting Diode is higher for a long time.And because the setting of drier 1611, increase the volume of Organic Light Emitting Diode, can't satisfy the demand of component size miniaturization.
[summary of the invention]
Organic Light Emitting Diode can't stop steam and oxygen long-term effectively in the prior art, encapsulation volume is big and the lower defective of luminous efficiency in order to overcome, and the invention provides a kind of encapsulating structure that can stop steam and oxygen long-term effectively and reduce the encapsulation volume of Organic Light Emitting Diode.
The present invention also provides a kind of method for packing that can realize the encapsulating structure of above-mentioned Organic Light Emitting Diode.
For overcome that Organic Light Emitting Diode can't be permanently effective in the prior art stop steam and oxygen, encapsulation volume is big and the lower defective of luminous efficiency, the invention provides the encapsulating structure that another kind can stop steam and oxygen long-term effectively and reduce the encapsulation volume of Organic Light Emitting Diode.
The present invention also provides a kind of method for packing that can realize the encapsulating structure of above-mentioned Organic Light Emitting Diode.
The technical scheme that technical solution problem of the present invention is adopted is: a luminescence component and a housing are provided.This luminescence component comprises a transparent conductive substrate, a luminous organic material layer and a cathodic metal layer from bottom to top.This housing comprises an adhesive layer and a cover plate, and this adhesive layer is coated in around this transparent conductive substrate, and this cover plate engages with this transparent conductive substrate by this adhesive layer, and forms a confined space, is full of inert fluid in this confined space.
The technical scheme that technical solution problem of the present invention is adopted is: a transparent conductive substrate is provided, and the upper surface of this transparent conductive substrate comprises a luminous organic material layer and a cathodic metal layer; Around this transparent conductive substrate upper surface, apply an adhesive layer; Inert fluid instils on this transparent conductive substrate; One cover plate is provided, this cover plate is passed through this adhesive layer and this transparent conductive substrate pressing; Toast this adhesive layer, finish the encapsulation of Organic Light Emitting Diode.
Another technical scheme that technical solution problem of the present invention is adopted is: a luminescence component and a housing are provided, and this luminescence component comprises a transparent conductive substrate, a luminous organic material layer and a cathodic metal layer from bottom to top; This housing comprises an adhesive layer, and this adhesive layer is coated in around this transparent conductive substrate, and forms a space, is full of acrylic resin in this space.
Another technical scheme that technical solution problem of the present invention is adopted is: a transparent conductive substrate is provided, and the upper surface of this transparent conductive substrate comprises a luminous organic material layer and a cathodic metal layer; Around this transparent conductive substrate upper surface, apply an adhesive layer; Acrylic resin instils on this transparent conductive substrate; With UV cured this acrylic resin; Toast this adhesive layer, finish the encapsulation of Organic Light Emitting Diode.
Compared with prior art, the infiltration that inert fluid in the encapsulating structure of Organic Light Emitting Diode of the present invention or acrylic resin can stop steam and oxygen for a long time, stop steam and oxygen long-term effectively, and do not need to be provided with drying chamber, reduce encapsulation volume.
[description of drawings]
Fig. 1 is a kind of prior art organic light-emitting diode packaging structure schematic diagram.
Fig. 2 is the organic light-emitting diode packaging structure first execution mode schematic diagram of the present invention.
Fig. 3 is that the adhesive layer of Organic Light Emitting Diode method for packing of the present invention applies schematic diagram.
Fig. 4 is the transparency liquid instillation schematic diagram of Organic Light Emitting Diode method for packing of the present invention.
Fig. 5 is the transparent cover plate pressing schematic diagram of Organic Light Emitting Diode method for packing of the present invention.
[embodiment]
Seeing also Fig. 2, is the schematic diagram of organic light-emitting diode packaging structure first execution mode of the present invention.This organic light-emitting diode packaging structure comprises a luminescence component 30 and a housing 40.This luminescence component 30 comprises a transparent conductive substrate 302, a luminous organic material layer 306 and a cathodic metal layer 308 from bottom to top.This housing 40 comprises an adhesive layer 402 and a cover plate 404, and this adhesive layer 402 is coated in around this transparent conductive substrate 302; This cover plate 404 engages with this transparent conductive substrate 302 by this adhesive layer 402, and forms a confined space 54, is full of transparency liquid 56 in this confined space.
This transparent conductive substrate 302 comprises a transparency carrier 3022 and a conductive layer 3024, this conductive layer 3024 is positioned at the upper surface of this transparency carrier 3022, this transparency carrier 3022 can be a glass material, it also can be thin-film material, as PETG (Poly-Ethylene Terephthalate, PET), PEN (Poly-Ethylene Naphthalate, PEN), poly terephthalic acid dimethyl ester (Poly-TrimethyleneTerephthalate, PTT), polybutylene terepthatlate (Poly-Buthylene Terephthalate, PBT) and polyether sulfone (Poly-EtherSulfone, PES) etc.This conductive layer 3024 also is a transparent material, for tin indium oxide (Indium Tin Oxide, ITO).
This cover plate 404 is transparent cover plates, and its material can be a glass, also can be film, as PETG, PEN) and polyether sulfone etc.This cover plate 404 is corresponding with this transparent conductive substrate 302, and cover plate 404 is set according to the actual requirements with the concrete big I of transparent conductive substrate 302.
This adhesive layer 402 is UV cured glue, also can be thermohardening type glue, can also be the colloid that UV cured glue and thermohardening type glue have concurrently.This luminous organic material layer 306 and this cathodic metal layer 308 are positioned at this confined space 54.This transparency liquid 56 is an inert fluid, as polyvinyl alcohol resin (Poly-Vinyl Alcohol, PVA), the polyethylene glycol resin (Poly-Ethylene Glycol, PEG) and polyol polyester resin (Polyol) etc.This transparency liquid 56 does not react with this luminous organic material layer 306 and this cathodic metal layer 308, and can stop the infiltration of steam and oxygen.
Organic light-emitting diode packaging structure second execution mode of the present invention is the further improvement structure of first execution mode.Transparency liquid 56 in the confined space 54 of second embodiment of the invention is an acrylic resin.It is through the ultraviolet irradiation after-hardening, and sclerosis back acrylic resin is solid-state, can stop the infiltration of steam and oxygen, thereby reach the effect of protection.The present embodiment organic light-emitting diode packaging structure does not need to be provided with transparent cover plate.If but the further infiltration of steam and oxygen in the blocks air also can increase by a cover plate.
Please consult Fig. 3 to Fig. 5 together.Organic Light Emitting Diode method for packing first execution mode of the present invention comprises the steps:
Provide a upper surface to have the transparent conductive substrate 302 of a luminous organic material layer 306 and a cathodic metal layer 308.See also Fig. 3.Around the upper surface of this transparent conductive substrate 302, apply an adhesive layer 402.Wherein, the thickness of this adhesive layer 402 is greater than the thickness of this luminous organic material layer 306 with this cathodic metal layer 308.
Seeing also Fig. 4, is the schematic diagram of instillation transparency liquid layer.The liquid crystal drip device (figure do not show) that the present invention adopts liquid crystal injection systems with transparency liquid 56 be instilled into this adhesive layer 402 and these transparent conductive substrate 302 formed spaces 54 ', make this transparency liquid 56 cover this luminous organic material layer 306 and this cathodic metal layers 308.
Seeing also Fig. 5, is the schematic diagram of pressing cover plate.The present invention adopts the vacuum assembling apparatus pressing electrically-conductive backing plate 302 and the cover plate 404 of liquid crystal injection systems.The transparent conductive substrate 302 of the above-mentioned transparency liquid 56 that instiled is placed in the vacuum chamber (figure does not show), and a sucker (figure does not show) adsorbs this cover plate 404 and it is positioned at the top of this transparent conductive substrate 302.In the process of this cover plate 404 of descending with itself and this transparent conductive substrate 302 contrapositions.When this cover plate 404 contacts with this adhesive layer 402, the valve in the vacuum chamber (figure does not show) is opened, at this moment, because of being subjected to the effect of external atmosphere pressure, cover plate 404 fits tightly with transparent conductive substrate 302.
Toast the adhesive layer step.Adopt the ultraviolet curing device of liquid crystal injection systems that this adhesive layer 402 is carried out ultraviolet irradiation, then this is had dynamo-electric sharp assembly to put baking box baking 1 hour, temperature is 120 ℃, makes this adhesive layer 402 sclerosis, stops the infiltration of oxygen and steam.
Organic Light Emitting Diode method for packing second execution mode of the present invention is compared to first execution mode, difference is after instillation transparency liquid clear acrylic is resin, adopt the ultraviolet curing device of liquid crystal injection systems that this resin is toasted, make its sclerosis, form transparent solid, omit pressing cover plate step.If will further stop the infiltration of steam and oxygen, also can not omit this step.
Because the infiltration that inert fluid that the encapsulating structure of Organic Light Emitting Diode of the present invention adopts or acrylic resin can stop steam and oxygen, and drying layer need be set below transparent cover plate, the substrate of Organic Light Emitting Diode and cover plate adopt transparent material, so, the encapsulating structure of Organic Light Emitting Diode of the present invention can prevent the infiltration of steam and oxygen long-term effectively, guarantee the luminescent quality of Organic Light Emitting Diode, and reduce the encapsulation volume of element, improve luminous efficiency.
Claims (17)
1. the encapsulating structure of an Organic Light Emitting Diode, it comprises a luminescence component and a housing, this luminescence component comprises a transparent conductive substrate, a luminous organic material layer and a cathodic metal layer, this housing comprises an adhesive layer and a cover plate, this adhesive layer is coated in around this transparent conductive substrate, this cover plate engages with this transparent conductive substrate by this adhesive layer, and forms a confined space, it is characterized in that: be full of inert fluid in this confined space.
2. the encapsulating structure of Organic Light Emitting Diode as claimed in claim 1 is characterized in that: this inert fluid covers this luminous organic material layer and this cathodic metal layer.
3. the encapsulating structure of Organic Light Emitting Diode as claimed in claim 2: it is characterized in that: this inert fluid is transparent inert fluid, and this cover plate is a transparent cover plate.
4. the encapsulating structure of Organic Light Emitting Diode as claimed in claim 3, it is characterized in that: this transparent inert fluid is polyvinyl alcohol resin or polyethylene glycol resin or polyol polyester resin.
5. Organic Light Emitting Diode method for packing, may further comprise the steps: a transparent conductive substrate is provided, and the upper surface of this transparent conductive substrate comprises a luminous organic material layer and a cathodic metal layer; Around this transparent conductive substrate upper surface, apply an adhesive layer; On this transparent conductive substrate, inject inert fluid; One cover plate is provided, this cover plate is passed through this adhesive layer and this transparent conductive substrate pressing; Toast this adhesive layer, finish the encapsulation of Organic Light Emitting Diode.
6. the method for packing of Organic Light Emitting Diode as claimed in claim 5 is characterized in that: this inert fluid is to adopt the liquid crystal drip device of liquid crystal injection systems to instil.
7. the method for packing of Organic Light Emitting Diode as claimed in claim 5 is characterized in that: this cover plate and this transparent conductive substrate are the vacuum assembling apparatus pressings of adopting liquid crystal injection systems.
8. the method for packing of Organic Light Emitting Diode as claimed in claim 5 is characterized in that: this adhesive layer is the ultraviolet curing device baking of adopting liquid crystal injection systems.
9. the encapsulating structure of a light-emitting diode, it comprises a luminescence component and a housing, this luminescence component comprises a transparent conductive substrate, a luminous organic material layer and a cathodic metal layer; This housing comprises an adhesive layer, and this adhesive layer is coated in around this transparent conductive substrate, and forms a space, it is characterized in that: be full of acrylic resin in this space.
10. the encapsulating structure of Organic Light Emitting Diode as claimed in claim 9 is characterized in that: this acrylic resin covers this luminous organic material layer and this cathodic metal layer.
11. the encapsulating structure of Organic Light Emitting Diode as claimed in claim 9 is characterized in that: this encapsulating structure further comprises a cover plate.
12. the encapsulating structure of Organic Light Emitting Diode as claimed in claim 11 is characterized in that: this cover plate is a transparent cover plate.
13. an Organic Light Emitting Diode method for packing may further comprise the steps: a transparent conductive substrate is provided, and the upper surface of this transparent conductive substrate comprises a luminous organic material layer and a cathodic metal layer; Around this transparent conductive substrate upper surface, apply an adhesive layer; Acrylic resin instils on this transparent conductive substrate; With UV cured this acrylic resin; Toast this adhesive layer, finish the encapsulation of Organic Light Emitting Diode.
14. the method for packing of Organic Light Emitting Diode pipe as claimed in claim 13 is characterized in that: this acrylic resin is to adopt the liquid crystal drip device of liquid crystal injection systems to instil.
15. the method for packing of Organic Light Emitting Diode as claimed in claim 13 is characterized in that: this method for packing further comprises provides a cover plate, with the step of this cover plate by this adhesive layer and this transparent conductive substrate pressing.
16. the method for packing of Organic Light Emitting Diode as claimed in claim 15 is characterized in that: this cover plate and this transparent conductive substrate are the vacuum assembling apparatus pressings of adopting liquid crystal injection systems.
17. the method for packing of Organic Light Emitting Diode as claimed in claim 13 is characterized in that: this adhesive layer is the ultraviolet curing device baking of adopting liquid crystal injection systems.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03146915 CN1599517A (en) | 2003-09-19 | 2003-09-19 | Package structure of organic LED and its method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03146915 CN1599517A (en) | 2003-09-19 | 2003-09-19 | Package structure of organic LED and its method |
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| Publication Number | Publication Date |
|---|---|
| CN1599517A true CN1599517A (en) | 2005-03-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03146915 Pending CN1599517A (en) | 2003-09-19 | 2003-09-19 | Package structure of organic LED and its method |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101185374B (en) * | 2005-03-25 | 2010-05-19 | 乐金显示有限公司 | Light emitting device |
| US7906906B2 (en) | 2005-03-25 | 2011-03-15 | Lg Display Co., Ltd. | Light emitting device having spacer for protecting light emission unit from moisture absorbent |
| CN101521192B (en) * | 2008-02-27 | 2011-07-13 | 华兴电子工业股份有限公司 | Package structure of light emitting diode and the packaging method thereof |
| CN102263188A (en) * | 2010-05-28 | 2011-11-30 | 连营科技股份有限公司 | luminous element packaging structure |
| CN103456892A (en) * | 2013-09-17 | 2013-12-18 | 京东方科技集团股份有限公司 | Packaging structure of organic electroluminescence device |
| CN103779504A (en) * | 2012-10-25 | 2014-05-07 | 东莞万士达液晶显示器有限公司 | Organic light-emitting diode packaging structure |
| WO2014166038A1 (en) * | 2013-04-07 | 2014-10-16 | Liu Tajo | Organic semiconductor apparatus |
| CN108190832A (en) * | 2017-12-29 | 2018-06-22 | 深圳市华星光电半导体显示技术有限公司 | Oled panel and preparation method thereof |
-
2003
- 2003-09-19 CN CN 03146915 patent/CN1599517A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101185374B (en) * | 2005-03-25 | 2010-05-19 | 乐金显示有限公司 | Light emitting device |
| US7906906B2 (en) | 2005-03-25 | 2011-03-15 | Lg Display Co., Ltd. | Light emitting device having spacer for protecting light emission unit from moisture absorbent |
| CN101521192B (en) * | 2008-02-27 | 2011-07-13 | 华兴电子工业股份有限公司 | Package structure of light emitting diode and the packaging method thereof |
| CN102263188A (en) * | 2010-05-28 | 2011-11-30 | 连营科技股份有限公司 | luminous element packaging structure |
| CN103779504A (en) * | 2012-10-25 | 2014-05-07 | 东莞万士达液晶显示器有限公司 | Organic light-emitting diode packaging structure |
| WO2014166038A1 (en) * | 2013-04-07 | 2014-10-16 | Liu Tajo | Organic semiconductor apparatus |
| CN103456892A (en) * | 2013-09-17 | 2013-12-18 | 京东方科技集团股份有限公司 | Packaging structure of organic electroluminescence device |
| CN108190832A (en) * | 2017-12-29 | 2018-06-22 | 深圳市华星光电半导体显示技术有限公司 | Oled panel and preparation method thereof |
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