CN211743194U - OLED device packaging clamp - Google Patents
OLED device packaging clamp Download PDFInfo
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- CN211743194U CN211743194U CN202020695616.6U CN202020695616U CN211743194U CN 211743194 U CN211743194 U CN 211743194U CN 202020695616 U CN202020695616 U CN 202020695616U CN 211743194 U CN211743194 U CN 211743194U
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Abstract
The utility model relates to a show technical field, disclose an OLED device encapsulation anchor clamps. The OLED device packaging clamp is configured to position the cover plate and the substrate with the OLED device in a relative position so as to package the OLED device between the substrate and the cover plate by using UV glue; the OLED device encapsulation clamp comprises: the pressing piece is arranged on one side of the base; one surface of the base, which is used for placing the cover plate or the base plate, is provided with a first ultraviolet reflection heat insulation coating; and/or one surface of the pressing part far away from the base is provided with a second ultraviolet reflection heat insulation coating; the first ultraviolet reflecting thermal insulation coating or the second ultraviolet reflecting thermal insulation coating can shield ultraviolet rays irradiated in the light emitting area of the OLED device. The utility model discloses a OLED device encapsulates anchor clamps, when the large-size OLED device of encapsulation, can prevent that the OLED device from heaing up too high to avoid influencing the normal performance of OLED device.
Description
Technical Field
The utility model relates to a show technical field, especially relate to a OLED device encapsulates anchor clamps.
Background
In the field of Display technology, flat panel Display technologies such as Liquid Crystal Display (LCD), Organic Light-Emitting Diode (OLED), and the like have gradually replaced Cathode Ray Tube (CRT) displays.
Among them, the OLED has many advantages of self-luminescence, low driving voltage, high luminous efficiency, short response time, high definition and contrast, a viewing angle of nearly 180 °, a wide temperature range, and capability of realizing flexible display and large-area full-color display, and is widely used in structures such as lighting lamps, mobile phone screens, computer monitors, and full-color televisions.
The OLED device comprises an anode, an organic light emitting layer and a cathode which are sequentially arranged on a substrate, and organic materials of the electrode and the light emitting layer which form the OLED device are sensitive to pollutants, water vapor and oxygen in the atmosphere and are easy to generate electrochemical corrosion, so that the service life of the OLED device is influenced, and therefore the OLED device needs to be packaged.
Generally, the OLED device is disposed on a substrate, a groove is disposed on a cover plate, a UV glue is coated on a sidewall of the groove, and the OLED device is disposed in the groove after the substrate is covered on the cover plate. And then, the UV glue is cured by ultraviolet irradiation, so that the substrate and the cover plate are bonded together, and the OLED device is packaged between the cover plate and the substrate, so that the OLED device achieves the sealing effect.
The anchor clamps of present encapsulation OLED device are mostly positioning jig for when solving the encapsulation OLED device, the problem of the accurate counterpoint of OLED device on apron and the base plate.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an OLED device encapsulates anchor clamps, when encapsulating the large-size OLED device, can prevent that the OLED device from heaping up too high to avoid influencing the normal performance of OLED device.
To achieve the purpose, the utility model adopts the following technical proposal:
providing an OLED device packaging clamp which is configured to position the relative positions of a cover plate and a substrate with an OLED device so as to package the OLED device between the substrate and the cover plate by using UV glue;
the OLED device encapsulation clamp comprises:
the pressing piece is arranged on one side of the base;
one surface of the base, which is used for placing the cover plate or the base plate, is provided with a first ultraviolet reflection heat insulation coating; and/or one surface of the pressing part far away from the base is provided with a second ultraviolet reflection heat insulation coating;
the first ultraviolet reflecting thermal insulation coating or the second ultraviolet reflecting thermal insulation coating can shield ultraviolet rays irradiated in the light emitting area of the OLED device.
Preferably, the method further comprises the following steps:
the first magnetic suction piece is embedded in the base and can be attracted with the pressing piece to compress the base plate and the cover plate.
Preferably, the base plate further comprises a positioning member disposed on the base, and the positioning member is configured to position the cover plate, the base plate and the pressing member.
Preferably, the height of the positioning element is not less than the sum of the thicknesses of the cover plate, the base plate and the pressing element.
Preferably, the positioning member is at least one of a cylinder or a right-angled cross section of the positioning member.
Preferably, a cooling channel is arranged on the base, and a flowing cooling liquid can be introduced into the cooling channel and can cool the OLED device packaging clamp.
Preferably, a cooling liquid containing space is arranged on the base, a cooling liquid is contained in the cooling liquid containing space, and the cooling liquid can cool the OLED device packaging clamp.
Preferably, the press fitting includes:
a press-fitting body made of a transparent resin;
the second magnetic attraction piece is embedded in the pressing piece body and can attract the first magnetic attraction piece.
Preferably, the first ultraviolet reflecting thermal insulation coating and the second ultraviolet reflecting thermal insulation coating are both formed by an evaporation or sputtering film coating process.
Preferably, the first ultraviolet reflecting heat insulation coating is made of aluminum or silver; the second ultraviolet reflection heat insulation coating is made of aluminum or silver.
The utility model has the advantages that: the utility model discloses in, when utilizing above-mentioned OLED device encapsulation anchor clamps encapsulation OLED device, general UV light source setting is under OLED device encapsulation anchor clamps or directly over to shine the UV glue on apron and the base plate, so that the solidification is glued to the UV.
When the ultraviolet rays irradiate the UV glue, one of the first ultraviolet ray reflection heat insulation coating and the second ultraviolet ray reflection heat insulation coating can shield the ultraviolet rays irradiated in the light emitting area of the OLED device according to the position of a light source generating the ultraviolet rays so as to protect the light emitting area of the OLED device from being irradiated by the ultraviolet rays and not decompose small molecular materials in the OLED device.
The other of the first ultraviolet reflection heat insulation coating and the second ultraviolet reflection heat insulation coating can reflect ultraviolet rays and insulate heat of the OLED device, so that the phenomenon that the temperature of the OLED device is too high and physical property changes such as crystallization of organic materials in the OLED device occur is prevented, and the performance of a light emitting area of the OLED device is guaranteed to be unchanged.
The areas and the shapes of the first ultraviolet reflection heat insulation coating and the second ultraviolet reflection heat insulation coating can be determined according to actual needs, and OLED devices with different areas can be packaged.
Drawings
FIG. 1 is a schematic structural diagram of an OLED device packaging fixture in a first embodiment;
FIG. 2 is a cross-sectional view of a cover plate according to one embodiment, wherein UV glue is coated on the side walls of a first groove;
FIG. 3 is a top view of a cover plate according to the first embodiment, wherein the side walls of the first grooves are coated with UV glue;
fig. 4-6 are schematic structural views illustrating positioning members of different forms disposed on a base in a first embodiment;
fig. 7 is a schematic structural diagram of an OLED device packaging fixture in which a cooling liquid containing space is disposed on a base and a first groove is disposed on a cover plate according to the first embodiment;
fig. 8 is a schematic structural view of an OLED device packaging fixture in which a cooling liquid containing space is disposed on a base and an upper surface of a cover plate is a plane in the first embodiment;
fig. 9 is a schematic structural diagram of an OLED device packaging fixture in which a cooling liquid containing space is provided on a base and a sealing material is provided between a cover plate and a substrate according to a first embodiment of the present invention;
fig. 10 is a schematic structural diagram of an OLED device packaging fixture with a cooling channel on a base according to a first embodiment of the present invention;
fig. 11 is a top view of a pressing member according to a first embodiment of the present invention;
fig. 12 is a schematic structural diagram of an OLED device packaging fixture with a second ultraviolet reflective thermal barrier coating on a laminated board according to a second embodiment of the present invention;
fig. 13 is a schematic structural diagram of an OLED device packaging fixture with a first ultraviolet reflective thermal barrier coating disposed on a base according to a third embodiment of the present invention.
In the figure: 1. a cover plate; 10. UV glue; 11. sealing materials; 12. a cooling channel; 2. a substrate; 21. an OLED device; 3. a base; 30. a first ultraviolet reflective thermal barrier coating; 31. a coolant accommodating space; 4. a pressing part; 40. a second ultraviolet reflective thermal barrier coating; 41. a pressing piece body; 42. a second magnetic attraction member; 5. a positioning member; 6. the first magnetic attraction piece.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description of the present invention and simplification of description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; either mechanically or electrically. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
Example one
The anchor clamps of present encapsulation OLED device are mostly positioning jig for when solving the encapsulation OLED device, the problem of the accurate counterpoint of OLED device on apron and the base plate. When the OLED device is packaged, the packaging clamp provided with the OLED device is placed under the irradiation of high-intensity ultraviolet light to cure the UV glue, so that the OLED device is packaged.
The temperature rise of the OLED device caused by the direct irradiation of ultraviolet light on the OLED device or the decomposition of organic small molecular materials in the OLED device caused by the irradiation of ultraviolet light can affect the normal use performance of the OLED device.
In order to solve the above problem, the present embodiment provides an OLED device packaging fixture, which is mainly used for light emitting structures such as lamps and lanterns and displays, and can also be used for structures such as mobile phone screens and full-color televisions. As shown in fig. 1, the OLED device 21 is deposited on the substrate 2, and the thickness of the film deposited on the substrate 2, that is, the thickness of the OLED device 21, is about 100 μm.
Fig. 1 is a schematic structural diagram of an OLED device packaging fixture, which is configured to position a cover plate 1 and a substrate 2 with an OLED device 21 relative to each other, so as to package the OLED device 21 between the substrate 2 and the cover plate 1 by using a UV glue 10, as shown in fig. 1.
The OLED device packaging clamp comprises a base 3 and a pressing piece 4, wherein the pressing piece 4 is arranged on one side of the base 3; one surface of the base 3, which is used for placing the cover plate 1 or the base plate 2, is provided with a first ultraviolet reflection heat insulation coating 30; and/or the side of the press-fit member 4 remote from the base 3 is provided with a second ultraviolet reflecting thermal barrier coating 40. The first ultraviolet reflecting thermal barrier coating 30 and the second ultraviolet reflecting thermal barrier coating 40 can block ultraviolet rays irradiated in the light emitting area of the OLED device 21.
In this embodiment, as shown in fig. 1, when encapsulating the OLED device, the cover plate 1 is placed on the base 3, the substrate 2 with the OLED device 21 is located above the cover plate 1, and the OLED device 21 is encapsulated between the cover plate 1 and the substrate 2 by using the UV glue 10.
When the OLED device 21 is packaged by using the OLED device packaging jig, a UV light source is generally disposed right above or right below the OLED device packaging jig, so as to irradiate the UV glue 10 on the cover plate 11 and the substrate 22, and cure the UV glue 10. Specifically, when the cover plate 1 is placed on the base 3, the UV light source is located right above the OLED device packaging fixture, and the UV light source irradiates the UV glue through the substrate 2. When the UV light source is positioned right below the OLED device packaging clamp, UV light penetrates through the base 3 and the cover plate 1 to irradiate the UV glue.
Similarly, when the substrate 2 is placed on the base 3, the UV light source irradiates UV glue through the cover plate 1 when the UV light source is located right above the OLED device packaging fixture. When the UV light source is positioned right below the OLED device packaging clamp, UV light penetrates through the base 3 and the substrate 2 to irradiate the UV glue.
When the UV light source is located right under the OLED device encapsulation jig, the area of the first ultraviolet reflecting thermal barrier coating 30 disposed on the base 3 needs to be adaptively adjusted so that the UV light irradiates the UV glue through the base 3.
When the UV glue 10 is irradiated by ultraviolet rays, one of the first ultraviolet reflecting thermal insulating coating 30 and the second ultraviolet reflecting thermal insulating coating 40 can block the ultraviolet rays irradiated in the light emitting area of the OLED device 21 according to the position of a light source generating the ultraviolet rays, so as to protect the light emitting area of the OLED device 21 from being irradiated by the ultraviolet rays and not decompose small molecular materials in the OLED device 21.
The other of the first ultraviolet-reflecting thermal insulation coating 30 and the second ultraviolet-reflecting thermal insulation coating 40 can reflect ultraviolet rays and insulate the OLED device 21, so that the temperature of the OLED device 21 is prevented from being too high, physical changes such as crystallization of organic materials in the OLED device 21 are prevented, and the performance of a light-emitting area of the OLED device 21 is guaranteed to be unchanged.
When the OLED device is packaged by the OLED device packaging clamp in the embodiment, the temperature rise of the OLED device caused by direct irradiation of ultraviolet rays on the OLED device is avoided. Meanwhile, the temperature rise of a certain structural component of the OLED device packaging clamp caused by UV irradiation is avoided, and the temperature rise of the cover plate 11 or the substrate 22 caused by a heat conduction mode is avoided, so that physical property changes such as crystallization and the like of organic materials in the OLED device cannot occur due to the temperature rise, and the performance of the OLED device is prevented from being influenced.
Meanwhile, for the large-size OLED device, in the packaging process, the areas and the shapes of the first ultraviolet reflecting thermal insulation coating 30 and the second ultraviolet reflecting thermal insulation coating 40 can be determined according to actual needs, so that the problem that organic small molecular materials in the OLED device are easily decomposed due to the fact that a light emitting region of the OLED device is directly irradiated by high-intensity ultraviolet rays is avoided, and the influence on the normal use performance of the OLED device after being packaged is guaranteed. Meanwhile, the OLED device packaging clamp can package OLED devices 21 with different areas.
Preferably, the first ultraviolet reflecting thermal barrier coating 30 and the second ultraviolet reflecting thermal barrier coating 40 are formed by evaporation or sputtering. The first ultraviolet reflecting heat-insulating coating 30 and the second ultraviolet reflecting heat-insulating coating 40 formed by the vapor deposition or sputtering film plating process are thin, uniform in film plating, low in material consumption and low in cost, and the heat insulation and reflection performance of the reflecting heat-insulating coating formed by the film plating is good.
Further preferably, the material of the first ultraviolet reflecting thermal barrier coating 30 is aluminum or silver. The second ultraviolet-reflecting thermal barrier coating 40 is made of aluminum or silver. Aluminum and silver can effectively reflect short waves, namely, both aluminum and silver can effectively reflect ultraviolet rays, and the reflection effect is good. The materials of the first ultraviolet reflecting thermal barrier coating 30 and the second ultraviolet reflecting thermal barrier coating 40 are selected according to actual needs, and may be the same or different.
In this embodiment, the OLED device 21 is encapsulated between the cover plate 1 and the substrate 2, as follows,
fig. 2 is a cross-sectional view of the cover plate 1 with the UV paste 10 coated on the sidewalls of the first recess, and fig. 3 is a plan view of the cover plate 1 with the UV paste 10 coated on the sidewalls of the first recess; as shown in fig. 1 to 3, a first groove is formed in the cover plate 1, the OLED device 21 is located below the substrate 2, the UV glue 10 is coated on an inner side wall of the first groove of the cover plate 1, and the UV glue 10 is irradiated with ultraviolet rays to cure the UV glue 10, so that the substrate 2 and the cover plate 1 are bonded to encapsulate the OLED device 21 in the first groove of the cover plate 1.
Preferably, the OLED device packaging fixture further includes a first magnetic attraction member 6 embedded in the base 3, and the first magnetic attraction member 6 can attract the pressing member 4 to compress the substrate 2 and the cover plate 1. After apron 1 and base plate 2 location, utilize first magnetism to inhale 6 absorption pressfitting parts 4 of piece, compress tightly and lie in first magnetism to inhale apron 1 and base plate 2 that 6 absorption pressfitting parts 4 between, guarantee to encapsulate the in-process, the relative position between apron 1 and the base plate 2 can not appear changing to guarantee to encapsulate the precision.
Preferably, as shown in fig. 1, the OLED device packaging fixture further includes a positioning member 5 disposed on the base 3, and the positioning member 5 is configured to position the cover plate 1, the substrate 2 and the pressing member 4. Set up setting element 5 on base 3, conveniently fix a position apron 1, base plate 2 and pressfitting piece 4, guarantee the encapsulation precision.
Preferably, the height of the positioning member 5 is not less than the sum of the thicknesses of the cover plate 1, the base plate 2, and the pressing member 4. The cover plate 1, the base plate 2 and the pressing piece 4 are positioned by the same positioning piece 5, and the three are positioned by the same reference, so that the accuracy of the relative positions of the three after positioning is ensured.
Fig. 4-6 are schematic structural diagrams of positioning members 5 arranged on the base 3 in different forms, and as shown in fig. 4-6, in order to further ensure that the positioning members 5 can more accurately position the cover plate 1, the base plate 2 and the pressing member 4, and can more easily position the cover plate 1, the base plate 2 and the pressing member 4, preferably, the positioning members 5 are uniformly distributed along the periphery of the cover plate 1.
Preferably, as shown in fig. 4 and 5, the positioning members 5 are disposed at four corners of the cover plate 1, and the positioning members 5 are disposed at four corners of the cover plate 11, so that the cover plate 1, the base plate 2 and the pressing member 4 are more easily limited, and after the four corners of the three are limited, the positions of the three cannot be changed, the positioning is accurate, and the positions of the three are stable, so that the change is not easily caused.
In other embodiments, as shown in fig. 6, the positioning member 5 is disposed at a middle position of each side surface of the cover plate 1.
In other embodiments, the positioning members 5 can be disposed at the four corners of the cover plate 1, and the positioning members 5 can be disposed at the middle position of each side surface of the cover plate 1.
Preferably, the positioning member 5 is at least one of a cylinder or a right-angled cross section of the positioning member 5. Further preferably, the cross section of the positioning member 5 is rectangular, and each rectangular positioning member 5 positions two side surfaces of the cover plate 1, the base plate 2 and the pressing member 4, so that the positioning of the three is more accurate.
Preferably, fig. 7 is a schematic structural diagram of an OLED device packaging fixture in which a cooling liquid containing space 31 is provided on a base 3 and a first groove is provided on a cover plate 1. Fig. 8 is a schematic structural diagram of an OLED device packaging fixture in which a cooling liquid containing space 31 is provided on a base 3 and the upper surface of a cover plate 1 is a plane. Fig. 9 is a schematic structural diagram of an OLED device packaging fixture with a cooling liquid containing space 31 on the base 3 and a sealing material 11 between the cover plate 1 and the substrate 2.
As shown in fig. 7-9, a cooling liquid containing space 31 is provided on the base 3, and a cooling liquid is contained in the cooling liquid containing space 31, and the cooling liquid can cool the OLED device packaging fixture. Specifically, in this embodiment, when the OLED device encapsulation fixture is irradiated by ultraviolet rays to cause temperature rise of the first magnetic attraction member 6 and/or the cover plate 1 and/or the base 3, the first magnetic attraction member 6 and/or the cover plate 1 and/or the base 3 and/or the OLED device are directly or indirectly cooled by using the cooling liquid stored in the cooling liquid accommodating space 31, and the purpose of cooling the whole OLED device encapsulation fixture is achieved in a heat conduction manner, so that heat conduction to the OLED device 21 is reduced, temperature rise of the OLED device is prevented, and physical property changes such as crystallization and the like of organic materials in the OLED device due to temperature rise are avoided, thereby affecting the performance of the OLED device.
In other embodiments, as shown in fig. 10, a cooling channel 12 is disposed on the base 3, and a flowing cooling liquid can be introduced into the cooling channel 12, and the cooling liquid can cool the OLED device packaging fixture. When the OLED device packaging clamp is irradiated by ultraviolet rays to cause temperature rise of the first magnetic attraction piece 6 and/or the cover plate 1 and/or the base 3, the first magnetic attraction piece 6 and/or the cover plate 1 and/or the base 3 and/or the OLED device are directly or indirectly cooled by cooling liquid flowing in the cooling channel 12, and the whole OLED device packaging clamp is cooled in a heat conduction mode, so that heat conducted to the OLED device 21 is reduced, the temperature rise of the OLED device is prevented, physical property changes such as crystallization and the like of organic materials in the OLED device due to temperature rise are avoided, and the performance of the OLED device is influenced.
In the above embodiments, the area of the magnetic member 6 can be the same as or different from that of the OLED device, and the magnetic member 6 only represents a schematic diagram in each figure and does not represent the actual size of the magnetic member 6. The magnetic elements 6 are sized, numbered and positioned according to the actual working requirements.
Specifically, fig. 11 is a plan view of the pressing member 4, and as shown in fig. 10 and 11, the pressing member 4 includes a pressing member body 41, and the pressing member body 41 is made of transparent resin. The second magnetic attraction piece 42 is embedded in the pressing piece body 41, and the second magnetic attraction piece 42 can attract the first magnetic attraction piece 6.
As shown in fig. 8, in other embodiments, the upper surface of the cover plate 1 is a plane, a second groove is disposed on the substrate 2, the OLED device 21 is located in the second groove of the substrate 2, when the OLED device 21 is encapsulated, the UV glue 10 is coated between the cover plate 1 and the plane of the substrate 2, and the UV glue 10 is irradiated by ultraviolet light to encapsulate the OLED device 21.
As shown in fig. 9, in other embodiments, the upper surface of the cap plate 1 is a plane, a sealing material 11 is disposed between the substrate 2 and the cap plate 1, and a UV glue 10 is coated on the outer sidewalls of the cap plate 1, the sealing material 11 and the substrate 2, and is cured by ultraviolet rays, so as to encapsulate the OLED device 21. Preferably, the sealing material 11 is a dry material.
The embodiment also provides an OLED device packaging method, and the OLED device packaging clamp comprises the following steps:
s1, coating UV glue on the cover plate 1 and/or the substrate 2 with the OLED device 21;
s2, positioning the cover plate 1 and the base plate 2 stacked on the base 3;
s3, the pressing piece 4 descends, and the pressing piece 4 is pressed on the cover plate 1 or the base plate 2;
s4, ultraviolet light sources located right above and/or right below the OLED device packaging clamp can be selectively opened to irradiate the OLED device packaging clamp, so that the UV glue is cured, and the OLED device 21 is packaged between the substrate 2 and the cover plate 1.
According to the OLED device packaging method provided in the embodiment, the cover plates with different structures and the substrate with the OLED device can be packaged by using the OLED device packaging clamp, and the problems that the OLED device is irradiated by ultraviolet rays and the normal use performance of the OLED device is influenced by the temperature rise of the OLED device can be solved by using the method for packaging the OLED device. The OLED device packaging method has the advantages of being simple and convenient to operate and easy to achieve, and the working efficiency can be improved.
The above steps S1 and S2 do not have a sequential process relationship, and it can be determined to coat the UV glue first or to coat the UV glue after positioning the cover plate 1 and the substrate 2 according to the specific structures of the cover plate 1 and the substrate 2 with the OLED device 21, the packaging form, and other factors.
Preferably, in step S3, the pressing member 4 is driven to descend by the driving member, so that the pressing member 4 is engaged with the base 3. Utilize the lift of driving piece automatic drive pressfitting piece 4, further improve work efficiency, reduce artifical intensity of labour and cost of labor to manufacturing cost has been reduced by a wide margin.
Preferably, the step S4 further includes S41, before the OLED device package fixture is irradiated by the ultraviolet light source, introducing a flowing cooling liquid into the cooling channel 12 provided on the base 3. Or the cooling liquid is introduced into the cooling accommodating space 31 of the base 3 in advance to fill the cooling accommodating space 31.
The cooling liquid flowing in the cooling channel 12 or the cooling liquid filled in the accommodating space 31 is used for cooling the whole OLED device packaging fixture irradiated by ultraviolet rays, so as to achieve the purpose of preventing the temperature of the OLED device from rising.
Example two
On the basis of the technical solution of the first embodiment, the difference from the first embodiment is that:
fig. 12 is a schematic structural diagram of an OLED device packaging fixture with a second uv-reflective thermal barrier coating 40 only on the laminated plate 4, as shown in fig. 12, in which the uv light source is disposed directly above the whole apparatus, and the second uv-reflective thermal barrier coating 40 is only disposed on the surface of the laminated plate 4 away from the base 3. The second ultraviolet reflecting thermal insulation coating 40 is used for shielding ultraviolet rays in the light emitting area of the OLED device 21, protecting the light emitting area of the OLED device 21 from being irradiated by the ultraviolet rays, and not decomposing small molecular materials in the OLED device 21.
To the first magnetism piece 6 of inhaling of ultraviolet irradiation, the temperature rise that first magnetism piece 6 produced adopts the technical scheme in the embodiment one, can set up the form of coolant liquid accommodation space 31 or cooling channel 12 on base 3 and cool off OLED device encapsulation anchor clamps.
EXAMPLE III
On the basis of the technical solution of the first embodiment, the difference from the first embodiment is that:
fig. 13 is a schematic structural view of an OLED device packaging fixture with a first uv-reflective thermal barrier coating 30 only on the base 3, as shown in fig. 13, where the uv light source is disposed directly under the entire apparatus, and no cooling liquid containing space 31 or cooling channel 12 is disposed on the base 3.
The base 3 is made of transparent resin, the first ultraviolet reflecting thermal insulation coating 30 is only arranged on one surface, used for placing the cover plate 1, of the base 3, ultraviolet rays in the light-emitting area of the OLED device 21 are shielded by the first ultraviolet reflecting thermal insulation coating 30, the light-emitting area of the OLED device 21 is protected from being irradiated by the ultraviolet rays, and small molecular materials in the OLED device 21 cannot be decomposed. At this moment, when setting up first ultraviolet reflection thermal barrier coating 30 on base 3, the area of first ultraviolet reflection thermal barrier coating 30 equals OLED device 21's luminous area at least, simultaneously, reserves certain area on base 3 to guarantee that the ultraviolet ray can wear to establish base 3 and shine UV glue, guarantee simultaneously that the ultraviolet ray can not shine in OLED device's the luminous area.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. An OLED device encapsulating fixture, characterized in that it is configured to position the relative position of a cover plate (1) and a substrate plate (2) with OLED devices (21) to encapsulate the OLED devices (21) between the substrate plate (2) and the cover plate (1) with UV glue (10);
the OLED device encapsulation clamp comprises:
the pressing piece (4) is arranged on one side of the base (3);
one surface of the base (3) for placing the cover plate (1) or the base plate (2) is provided with a first ultraviolet reflection heat insulation coating (30); and/or one side of the pressing piece (4) far away from the base (3) is provided with a second ultraviolet reflection heat insulation coating (40);
the first ultraviolet reflecting thermal barrier coating (30) or the second ultraviolet reflecting thermal barrier coating (40) is capable of blocking ultraviolet rays irradiated within a light emitting area of the OLED device (21).
2. The OLED device encapsulation fixture of claim 1, further comprising:
the first magnetic suction piece (6) is embedded in the base (3), and the first magnetic suction piece (6) can be attracted with the pressing piece (4) to compress the base plate (2) and the cover plate (1).
3. The OLED device encapsulation fixture according to claim 1 or 2, further comprising a positioning member (5) disposed on the base (3), the positioning member (5) being configured to position the cover plate (1), the substrate plate (2) and the pressing member (4).
4. The OLED device packaging fixture of claim 3, wherein the height of the positioning member (5) is not less than the sum of the thicknesses of the cover plate (1), the substrate plate (2) and the pressing member (4).
5. The OLED device packaging fixture of claim 3, wherein the positioning member (5) is at least one of cylindrical or right-angled in cross-section of the positioning member (5).
6. The OLED device packaging fixture of claim 2, wherein the base (3) is provided with a cooling channel (12), and a flowing cooling liquid can be introduced into the cooling channel (12), and the cooling liquid can cool the OLED device packaging fixture.
7. The OLED device packaging fixture according to claim 2, wherein a cooling liquid receiving space (31) is provided on the base (3), and a cooling liquid is received in the cooling liquid receiving space (31), and the cooling liquid can cool the OLED device packaging fixture.
8. The OLED device encapsulation fixture of claim 2, wherein the lamination (4) includes:
a press-fitting body (41), the press-fitting body (41) being made of a transparent resin;
the second magnetic part (42) is embedded in the pressing part body (41), and the second magnetic part (42) can attract the first magnetic part (6).
9. The OLED device encapsulation fixture of claim 1 or 2, wherein the first uv reflective thermal barrier coating (30) and the second uv reflective thermal barrier coating (40) are both formed via an evaporation or sputter coating process.
10. The OLED device encapsulation fixture of claim 1 or 2, wherein the first uv-reflective thermal barrier coating (30) is aluminum or silver; the second ultraviolet reflection heat insulation coating (40) is made of aluminum or silver.
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| CN114551253A (en) * | 2022-04-28 | 2022-05-27 | 至芯半导体(杭州)有限公司 | Packaging method and packaging device |
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