JP2000311782A - Organic el display, and manufacture thereof - Google Patents
Organic el display, and manufacture thereofInfo
- Publication number
- JP2000311782A JP2000311782A JP11119030A JP11903099A JP2000311782A JP 2000311782 A JP2000311782 A JP 2000311782A JP 11119030 A JP11119030 A JP 11119030A JP 11903099 A JP11903099 A JP 11903099A JP 2000311782 A JP2000311782 A JP 2000311782A
- Authority
- JP
- Japan
- Prior art keywords
- organic
- display
- sealing plate
- adhesive
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000000853 adhesive Substances 0.000 claims abstract description 35
- 230000001070 adhesive effect Effects 0.000 claims abstract description 35
- 239000003822 epoxy resin Substances 0.000 claims abstract description 30
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 30
- 238000007789 sealing Methods 0.000 claims description 69
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 239000003795 chemical substances by application Substances 0.000 claims description 17
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 14
- 239000010409 thin film Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000006096 absorbing agent Substances 0.000 claims description 9
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 9
- 230000002265 prevention Effects 0.000 claims description 8
- 230000005525 hole transport Effects 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 23
- 230000007774 longterm Effects 0.000 abstract description 6
- 239000012298 atmosphere Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 15
- 239000010408 film Substances 0.000 description 12
- 239000012790 adhesive layer Substances 0.000 description 4
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000001723 curing Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- -1 tris (8-quinolinol) aluminum Chemical compound 0.000 description 2
- WXAIEIRYBSKHDP-UHFFFAOYSA-N 4-phenyl-n-(4-phenylphenyl)-n-[4-[4-(4-phenyl-n-(4-phenylphenyl)anilino)phenyl]phenyl]aniline Chemical compound C1=CC=CC=C1C1=CC=C(N(C=2C=CC(=CC=2)C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC(=CC=2)N(C=2C=CC(=CC=2)C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC=CC=2)C=C1 WXAIEIRYBSKHDP-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 125000000040 m-tolyl group Chemical group [H]C1=C([H])C(*)=C([H])C(=C1[H])C([H])([H])[H] 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、有機エレクトロ
ルミネッセンス（ｅｌｅｃｔｒｏ−ｌｕｍｉｎｅｓｃｅ
ｎｃｅ：ＥＬ）ディスプレイおよびその製造方法に関
し、特に、有機蛍光体薄膜からなる発光素子の長寿命化
を目的とする有機ＥＬディスプレイおよびその製造方法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic electroluminescence (electro-luminescence) device.
More particularly, the present invention relates to an organic EL display aiming at extending the life of a light emitting element formed of an organic phosphor thin film and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来、有機エレクトロルミネッセンス表
示装置（有機ＥＬディスプレイ）においては、発光素子
である有機蛍光体薄膜に水分が触れると、ダークスポッ
トと呼ばれる不発光部が発生すると共に成長し発光素子
の寿命を縮めるため、この発光素子領域を外気に含まれ
る水分と遮断して、発光素子の長寿命化を図ることが重
要な要素の一つとなっている。2. Description of the Related Art Conventionally, in an organic electroluminescent display device (organic EL display), when moisture comes in contact with an organic phosphor thin film which is a light emitting element, a non-light emitting portion called a dark spot is generated and grows. In order to shorten the life, it is one of the important factors to block the light emitting element region from moisture contained in the outside air and to extend the life of the light emitting element.
【０００３】この目的のため、通常、発光素子領域を囲
むように、封着板を発光素子が形成された基板と接着剤
により接着する方法が一般的に採用されている。[0003] For this purpose, generally, a method of bonding a sealing plate to a substrate on which a light emitting element is formed with an adhesive so as to surround the light emitting element region is generally adopted.
【０００４】図７は、従来の有機ＥＬディスプレイを示
し、（ａ）は平面図、（ｂ）は（ａ）のＡ−Ａ線に沿う
断面図である。FIGS. 7A and 7B show a conventional organic EL display, in which FIG. 7A is a plan view, and FIG. 7B is a sectional view taken along line AA of FIG.
【０００５】図７に示すように、従来の有機ＥＬ素子を
封着する製造工程においては、先ず、透明なガラス基板
１上に透明な陽極２を配置し、その上に、有機正孔輸送
層や有機蛍光体薄膜３、更に、陰極金属４が積層され
る。次に、水分の耐浸透性能の高いエポキシ樹脂５を封
着板６の縁に盛り付け、封着板６と基板１に圧力をかけ
ながら紫外線を照射し、エポキシ樹脂５を介して基板１
上に封着板６を接着する。As shown in FIG. 7, in a conventional manufacturing process for sealing an organic EL element, first, a transparent anode 2 is arranged on a transparent glass substrate 1, and an organic hole transport layer is placed thereon. And the organic phosphor thin film 3 and the cathode metal 4 are further laminated. Next, an epoxy resin 5 having a high moisture permeation resistance is put on the edge of the sealing plate 6, and ultraviolet rays are irradiated while applying pressure to the sealing plate 6 and the substrate 1.
The sealing plate 6 is bonded thereon.
【０００６】ところで、このような従来の手法では、発
光素子寿命が１０００時間以上に及ぶ場合、封着部分の
エポキシ樹脂５層から微量の水分が発光素子領域へ浸透
して発光素子寿命を縮めてしまうことから、長期信頼性
が確保できなかった。By the way, in such a conventional method, when the life of the light emitting element is over 1000 hours, a small amount of moisture permeates into the light emitting element region from the five layers of the epoxy resin in the sealing portion to shorten the life of the light emitting element. Therefore, long-term reliability could not be secured.
【０００７】そこで、発光素子領域である封着室内の水
分を除去する方法が提案されている。例えば、特開平９
−１４８０６６号公報に開示された有機ＥＬ素子は、
気密性容器内に有機積層体から隔離して水分を吸収する
化合物を配置しており、特開平１０−２７５６７９号公
報に開示された有機ＥＬ素子は、密封するための封止
ガラス板の内面に吸湿性多孔質層を設けて水分を除去し
ている。[0007] Therefore, a method has been proposed in which moisture in a sealing chamber, which is a light emitting element region, is removed. For example, JP-A-9
The organic EL element disclosed in 148066 is
A compound that absorbs moisture while being isolated from the organic laminate is disposed in an airtight container. The organic EL element disclosed in Japanese Patent Application Laid-Open No. 10-275679 is provided on an inner surface of a sealing glass plate for sealing. A moisture-absorbing porous layer is provided to remove moisture.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、上記
有機ＥＬ素子或いは有機ＥＬ素子に示すように、機密
性容器内若しくは封止した内部に、水分を吸収し除去す
る物質を設けることは、既に浸透した水分を除去するの
みであって、浸透した水分と有機蛍光体薄膜が接触しな
いようにすることはできない。However, as shown in the above-mentioned organic EL device or organic EL device, providing a substance that absorbs and removes moisture in a confidential container or a sealed interior has already penetrated. It only removes water and cannot prevent the permeated water from contacting the organic phosphor thin film.
【０００９】つまり、内部に浸透してしまった水分を、
有機蛍光体薄膜と接触することがないように完全に除去
することは困難であり、内部の水分除去による短命化防
止効果は十分でなかった。That is, the water that has permeated into the interior is
It is difficult to completely remove the organic phosphor thin film so as not to come into contact with the organic phosphor thin film, and the effect of preventing life shortening by removing moisture inside is not sufficient.
【００１０】従って、発光素子の寿命を伸ばして長期信
頼性を確保するためには、封止接着剤層を通り発光素子
領域内へ浸透する水分を、有機蛍光体薄膜に触れること
なく即時に除去することが重要となる。Therefore, in order to extend the life of the light emitting device and to ensure long-term reliability, moisture that penetrates into the light emitting device region through the sealing adhesive layer is immediately removed without touching the organic phosphor thin film. It is important to:
【００１１】この発明の目的は、エレクトロルミネッセ
ンスの発光素子の短命化を防止し長期信頼性を確保する
ことができる有機ＥＬディスプレイおよびその製造方法
を提供することである。An object of the present invention is to provide an organic EL display capable of preventing a short life of an electroluminescent light emitting element and securing long-term reliability, and a method of manufacturing the same.
【００１２】[0012]
【課題を解決するための手段】上記目的を達成するた
め、この発明に係る有機ＥＬディスプレイは、基板上の
有機ＥＬ素子を外気と遮断するように、前記有機ＥＬ素
子を覆って前記基板上に封着板を装着した有機ＥＬディ
スプレイにおいて、前記封着板の装着部分から前記外気
に含まれる水分が侵入するのを防止する防止手段を有す
ることを特徴としている。To achieve the above object, an organic EL display according to the present invention covers the organic EL element on the substrate so as to shield the organic EL element on the substrate from outside air. The organic EL display having the sealing plate is characterized in that the organic EL display has a prevention means for preventing moisture contained in the outside air from entering from a mounting portion of the sealing plate.
【００１３】上記構成を有することにより、基板上の有
機ＥＬ素子を外気と遮断するように、有機ＥＬ素子を覆
って基板上に封着板を装着した有機ＥＬディスプレイ
は、防止手段によって、封着板の装着部分から外気に含
まれる水分が侵入するのを防止する。これにより、エレ
クトロルミネッセンスの発光素子の短命化を防止し長期
信頼性を確保することができる。With the above configuration, the organic EL display having the sealing plate mounted on the substrate so as to cover the organic EL element so that the organic EL element on the substrate is shielded from the outside air can be sealed by the prevention means. Prevents moisture contained in outside air from entering from the mounting portion of the board. Thus, the life of the electroluminescent light emitting element can be prevented from being shortened, and long-term reliability can be secured.
【００１４】また、この発明に係る有機ＥＬディスプレ
イの製造方法により、上記有機ＥＬディスプレイを製造
することができる。Further, the organic EL display can be manufactured by the method for manufacturing an organic EL display according to the present invention.
【００１５】[0015]
【発明の実施の形態】以下、この発明の実施の形態につ
いて図面を参照して説明する。 （第１の実施の形態）図１は、この発明の第１の実施の
形態に係る有機ＥＬディスプレイを示し、（ａ）は平面
図、（ｂ）は（ａ）のＡ−Ａ線に沿う断面図である。Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIGS. 1A and 1B show an organic EL display according to a first embodiment of the present invention, wherein FIG. 1A is a plan view, and FIG. 1B is a view along the line AA in FIG. It is sectional drawing.
【００１６】図１に示すように、有機ＥＬディスプレイ
１０は、ガラス基板１１、ガラス基板１１上に順番に積
層された、ＩＴＯ（ｉｎｄｉｕｍ ｔｉｎ ｏｘｉｄ
ｅ）電極１２、有機蛍光体薄膜からなる発光層１３、及
び陰極金属１４を有している。また、ガラス基板１１上
には、ガラス基板１１上のＩＴＯ電極１２、発光層１３
及び陰極金属１４を覆うように、封着板１５が設けられ
ている。As shown in FIG. 1, an organic EL display 10 has a glass substrate 11 and an indium tin oxide (ITO) laminated on the glass substrate 11 in this order.
e) An electrode 12, a light emitting layer 13 made of an organic phosphor thin film, and a cathode metal 14. Further, on the glass substrate 11, the ITO electrode 12 and the light emitting layer 13 on the glass substrate 11 are provided.
A sealing plate 15 is provided so as to cover the cathode metal 14.
【００１７】封着板１５は、基板１１上或いは封着板１
５の何れかの接着領域に塗布したエポキシ樹脂１６によ
り、基板１１上に接着される。このエポキシ樹脂１６の
内側、即ち、封着板１５に覆われた内部空間側に接し
て、化学的に水分を吸着する捕水剤を含有するエポキシ
樹脂１７からなる接着剤が塗布されている。The sealing plate 15 is placed on the substrate 11 or the sealing plate 1.
5 is bonded to the substrate 11 by the epoxy resin 16 applied to any of the bonding areas. An adhesive made of an epoxy resin 17 containing a water-absorbing agent that chemically adsorbs moisture is applied to the inside of the epoxy resin 16, that is, the inner space side covered with the sealing plate 15.
【００１８】従って、両エポキシ樹脂１６，１７からな
る接着剤により、ガラス基板１１上の発光層（有機ＥＬ
素子）１３を外気と遮断するように、発光層１３を覆っ
てガラス基板１１上に封着板１５が装着されている。Therefore, the light emitting layer (organic EL) on the glass substrate 11 is bonded by the adhesive composed of the epoxy resins 16 and 17.
A sealing plate 15 is mounted on the glass substrate 11 so as to cover the light emitting layer 13 so as to shield the element 13 from the outside air.
【００１９】図２は、図１の有機ＥＬディスプレイの製
造工程の一部を模式的に示し、（ａ）は封着以前の平面
図、（ｂ）は（ａ）のＡ−Ａ線に沿う断面図、（ｃ）は
封着後の（ｂ）と同様の断面図である。FIG. 2 schematically shows a part of the manufacturing process of the organic EL display shown in FIG. 1, wherein (a) is a plan view before sealing, and (b) is along the line AA in (a). FIG. 4C is a cross-sectional view similar to FIG. 4B after sealing.
【００２０】有機ＥＬディスプレイ１０を製造する場
合、図２に示すように、先ず、ガラス基板１１上に、透
明導電膜であるＩＴＯ膜１２を１２０ｎｍ程度の膜厚で
形成し所望のパターンとする。その後、真空蒸着によ
り、メタルマスクを介して所望のパターン位置に、正孔
輸送材料として、Ｎ，Ｎ’−ジフェニル−Ｎ，Ｎ’−ジ
（３−メチルフェニル）−１，１’−ビフェニル−４，
４’−ジアミンを、５０ｎｍ程度の膜厚で成膜し、正孔
輸送層を一様に形成する。When manufacturing the organic EL display 10, as shown in FIG. 2, first, an ITO film 12 as a transparent conductive film is formed on a glass substrate 11 with a thickness of about 120 nm to obtain a desired pattern. Thereafter, N, N′-diphenyl-N, N′-di (3-methylphenyl) -1,1′-biphenyl- is used as a hole transporting material at a desired pattern position via a metal mask by vacuum deposition. 4,
4′-diamine is formed into a film with a thickness of about 50 nm, and a hole transport layer is formed uniformly.
【００２１】その後、緑色の有機発光材料として、ホス
トにトリス（８−キノリノール）アルミニウム（アルミ
ニウム錯体）、ドーパントとしてキナクリドン（ドーピ
ング濃度５ｗｔ％）を、２５ｎｍ程度の厚みで共蒸着す
る。続いて、電子輸送層として、トリス（８−キノリノ
ール）アルミニウムを３０ｎｍ程度の厚みで蒸着し、有
機蛍光体薄膜からなる発光層１３を得る。Thereafter, tris (8-quinolinol) aluminum (aluminum complex) as a host and quinacridone (doping concentration: 5 wt%) as a dopant as a green organic light emitting material are co-deposited with a thickness of about 25 nm. Subsequently, tris (8-quinolinol) aluminum is deposited as an electron transporting layer to a thickness of about 30 nm to obtain a light emitting layer 13 made of an organic phosphor thin film.
【００２２】そして、蒸発源を変え、陰極として、ＩＴ
Ｏ膜１２のパターン上に直交するように所望の位置に、
メタルマスクを介してアルミニウム（Ａｌ）：リチウム
（Ｌｉ）を共蒸着により３０ｎｍ程度の厚みで成膜す
る。その後、アルミニウムのみを１００ｎｍ程度の厚み
で蒸着し陰極金属１４を形成する（（ａ）参照）。Then, the evaporation source was changed, and as the cathode, IT
At a desired position so as to be orthogonal to the pattern of the O film 12,
A film of aluminum (Al): lithium (Li) is formed to a thickness of about 30 nm by codeposition through a metal mask. Thereafter, only aluminum is deposited to a thickness of about 100 nm to form the cathode metal 14 (see (a)).
【００２３】次に、不活性ガスの窒素ガス雰囲気下で、
ガラス基板１１上に設定した封着領域に、ディスペンサ
ー（図示しない）を用いてエポキシ樹脂１６を約５００
μｍの厚みで形成し、更に、その捕水効率を高めるため
に、捕水剤としての酸化バリウムを７０％含有させたエ
ポキシ樹脂１７を、約５００μｍの厚みで形成する
（（ｂ）参照）。Next, under a nitrogen gas atmosphere of an inert gas,
The epoxy resin 16 is applied to the sealing area set on the glass substrate 11 for about 500 times using a dispenser (not shown).
An epoxy resin 17 containing 70% of barium oxide as a water-trapping agent is formed to a thickness of about 500 μm to further increase the water-trapping efficiency (see (b)).
【００２４】その後、両エポキシ樹脂１６，１７からな
る接着剤に、周縁がフランジ状に突出する封着板１５の
封着領域である突出端面を合わせて（（ｃ）参照）、約
１ｋｇ／ｃｍ2 の圧力で加圧し接着する。Thereafter, the protruding end surface, which is the sealing area of the sealing plate 15 whose peripheral edge protrudes in a flange shape, is joined to the adhesive composed of the epoxy resins 16 and 17 (see (c)), and is about 1 kg / cm. Press and bond with pressure of 2 .
【００２５】この封着板１５の接着は、接着剤を、ガラ
ス基板１１上ではなく、封着板１５の封着領域である突
出端面に塗布して行っても良い。The bonding of the sealing plate 15 may be performed by applying an adhesive not on the glass substrate 11 but on the protruding end surface of the sealing plate 15 which is a sealing area.
【００２６】図３は、図１の有機ＥＬディスプレイの他
の製造工程の一部を模式的に示し、（ａ）は封着前の封
着板の図２（ｂ）と同様の断面図、（ｂ）は封着後の図
２（ｃ）と同様の断面図である。FIG. 3 schematically shows a part of another manufacturing process of the organic EL display of FIG. 1, (a) is a sectional view of a sealing plate before sealing, similar to FIG. 2 (b), 2B is a cross-sectional view similar to FIG. 2C after sealing.
【００２７】図３に示すように、接着剤は、封着板１５
の封着領域である突出端面に塗布される（（ａ）参
照）。このときのエポキシ樹脂１６及び捕水剤を含有し
たエポキシ樹脂１７の厚みは約１０μｍ、幅は双方合わ
せて約２ｍｍとなる。As shown in FIG. 3, the adhesive is applied to the sealing plate 15
(See (a)). At this time, the thickness of the epoxy resin 16 and the epoxy resin 17 containing the water trapping agent is about 10 μm, and the total width is about 2 mm.
【００２８】その後、両エポキシ樹脂１６，１７からな
る接着剤に、ガラス基板１１上の封着領域を合わせて加
圧接着する（（ｂ）参照）。Thereafter, the sealing region on the glass substrate 11 is aligned and pressure-bonded to the adhesive composed of both epoxy resins 16 and 17 (see (b)).
【００２９】次に、波長が約３５０ｎｍ〜４６０ｎｍの
紫外線を、封着領域に約５０００ｍｊ／ｃｍ2 照射して
接着剤を硬化させると、有機ＥＬディスプレイ１０の封
着工程が完了する。Next, ultraviolet rays having a wavelength of about 350 nm to 460 nm are irradiated to the sealing area at about 5000 mj / cm 2 to cure the adhesive, whereby the sealing step of the organic EL display 10 is completed.
【００３０】これにより、両エポキシ樹脂１６，１７か
らなる接着剤によって、外気に含まれる水分が、接着剤
層、若しくは接着剤とガラス基板１１の界面、及び接着
剤と封着板１５の界面を浸透し、封着板１５に覆われた
内部空間に侵入するのを、防止することができる。即
ち、両エポキシ樹脂１６，１７からなる接着剤は、封着
板１５の装着部分から外気に含まれる水分が侵入するの
を防止する防止手段として機能する。Thus, the moisture contained in the outside air causes the interface between the adhesive layer or the interface between the adhesive and the glass substrate 11 and the interface between the adhesive and the sealing plate 15 by the adhesive composed of the epoxy resins 16 and 17. It can be prevented from penetrating and entering the internal space covered by the sealing plate 15. That is, the adhesive composed of both epoxy resins 16 and 17 functions as a prevention unit for preventing moisture contained in the outside air from entering from the mounting portion of the sealing plate 15.
【００３１】上記実施の形態では、捕水剤として酸化バ
リウムを用いたが、これに限らず化学的に水分を吸着す
る物質であれば良く、例えば、酸化カルシウム等のアル
カリ土類金属酸化物を用いても、同様の効果を得ること
ができる。 （第２の実施の形態）図４は、この発明の第２の実施の
形態に係る有機ＥＬディスプレイの製造工程の一部を模
式的に示す、図２（ｃ）と同様の断面図である。In the above embodiment, barium oxide was used as the water catching agent. However, the material is not limited to this, and any substance that chemically adsorbs moisture may be used. For example, alkaline earth metal oxides such as calcium oxide may be used. Even if it is used, the same effect can be obtained. (Second Embodiment) FIG. 4 is a cross-sectional view similar to FIG. 2C, schematically showing a part of a manufacturing process of an organic EL display according to a second embodiment of the present invention. .
【００３２】図４に示すように、有機ＥＬディスプレイ
２０は、ガラス基板１１上に、透明導電膜のＩＴＯ膜１
２が埋め込まれている。その他の構成及び作用は、上述
した有機ＥＬディスプレイ及びその製造方法と同様であ
る。As shown in FIG. 4, an organic EL display 20 has a glass substrate 11 on which a transparent conductive ITO film 1 is formed.
2 is embedded. Other configurations and operations are the same as those of the above-described organic EL display and its manufacturing method.
【００３３】この有機ＥＬディスプレイ２０を製造する
場合、先ず、ガラス基板１１上に、深さ約１２０ｎｍの
ＩＴＯ膜埋め込みパターンを形成し、その後、透明導電
膜のＩＴＯ膜１２をガラス基板１１に埋め込む。これに
より、ガラス基板１１上に、ＩＴＯ膜１２の表面が露出
した平滑な表面を得る。When manufacturing the organic EL display 20, first, an ITO film embedding pattern having a depth of about 120 nm is formed on the glass substrate 11, and then the ITO film 12 of a transparent conductive film is embedded in the glass substrate 11. Thus, a smooth surface on which the surface of the ITO film 12 is exposed is obtained on the glass substrate 11.
【００３４】次に、有機蛍光体薄膜からなる発光層１３
の形成及び陰極金属１４の形成を行い、更に、接着剤に
よる封着及び接着剤硬化を行う。これにより、封着面が
平滑でＩＴＯ膜１２の段差による気密性低下を改善した
有機ＥＬディスプレイ２０が得られる（図４参照）。 （第３の実施の形態）図５は、この発明の第３の実施の
形態に係る有機ＥＬディスプレイの製造工程の一部を模
式的に示す、図２（ｃ）と同様の断面図である。Next, the light emitting layer 13 made of an organic phosphor thin film
Is formed, and the cathode metal 14 is formed. Further, sealing with an adhesive and curing of the adhesive are performed. Thus, an organic EL display 20 having a smooth sealing surface and improved airtightness due to a step of the ITO film 12 is obtained (see FIG. 4). (Third Embodiment) FIG. 5 is a cross-sectional view similar to FIG. 2C, schematically showing a part of a manufacturing process of an organic EL display according to a third embodiment of the present invention. .
【００３５】図５に示すように、有機ＥＬディスプレイ
２５は、平板封着板２６を用いることによって、封着板
の肉厚をより薄くしている。その他の構成及び作用は、
上述した有機ＥＬディスプレイ及びその製造方法と同様
である。As shown in FIG. 5, in the organic EL display 25, the thickness of the sealing plate is further reduced by using a flat sealing plate 26. Other configurations and operations are
This is the same as the above-described organic EL display and its manufacturing method.
【００３６】この有機ＥＬディスプレイ２５を製造する
場合、先ず、ガラス基板１１上に、ＩＴＯ膜１２、有機
蛍光体薄膜からなる発光層１３、及び陰極金属１４を形
成する。次に、平板封着板２６を用いて、両エポキシ樹
脂１６，１７からなる接着剤による封着及び接着剤硬化
を行う。これにより、封着板の断面方向厚みがより薄い
有機ＥＬディスプレイ２５が得られる（図５参照）。 （第４の実施の形態）図６は、この発明の第４の実施の
形態に係る有機ＥＬディスプレイの封着工程における接
着剤塗布方法を模式的に示し、（ａ）は個別のディスペ
ンサーを用いた場合の断面図、（ｂ）は捕水剤を用いた
場合の断面図である。When manufacturing the organic EL display 25, first, an ITO film 12, a light emitting layer 13 made of an organic phosphor thin film, and a cathode metal 14 are formed on a glass substrate 11. Next, using the flat sealing plate 26, sealing with an adhesive composed of both epoxy resins 16 and 17 and curing of the adhesive are performed. Thereby, the organic EL display 25 having a smaller thickness in the cross-sectional direction of the sealing plate is obtained (see FIG. 5). (Fourth Embodiment) FIG. 6 schematically shows a method of applying an adhesive in a sealing step of an organic EL display according to a fourth embodiment of the present invention, wherein (a) shows the use of an individual dispenser. (B) is a cross-sectional view when a water catching agent is used.
【００３７】図６（ａ）に示すように、有機ＥＬディス
プレイの封着工程において、両エポキシ樹脂１６，１７
からなる接着剤を塗布する場合、エポキシ樹脂１６が充
填されたディスペンサー３０、及び捕水剤を含有したエ
ポキシ樹脂１７が充填されたディスペンサー３１を用い
ることで、封着領域に接着剤を同時に塗布することが可
能となる。As shown in FIG. 6A, in the sealing step of the organic EL display, both epoxy resins 16 and 17 are used.
When applying an adhesive consisting of, the dispenser 30 filled with the epoxy resin 16 and the dispenser 31 filled with the epoxy resin 17 containing the water trapping agent are used to simultaneously apply the adhesive to the sealing region. It becomes possible.
【００３８】また、ディスペンサー３０及びディスペン
サー３１の各吐出径を変えることにより、各エポキシ樹
脂１６，１７毎の接着幅を変えることができるので、封
着領域の微細化が可能となる。Further, by changing the discharge diameter of each of the dispensers 30 and 31, the bonding width of each of the epoxy resins 16 and 17 can be changed, so that the sealing area can be miniaturized.
【００３９】更に、図６（ｂ）に示すように、エポキシ
樹脂１６とエポキシ樹脂１７の２種類の接着剤の間に、
捕水効果を強化する目的で捕水剤３２を設けてもよい。Further, as shown in FIG. 6B, between the two kinds of adhesives of the epoxy resin 16 and the epoxy resin 17,
A water catching agent 32 may be provided for the purpose of enhancing the water catching effect.
【００４０】つまり、上述した有機ＥＬディスプレイの
製造方法は、ガラス基板１１上に形成した有機蛍光体薄
膜からなる有機ＥＬ素子（発光層１３）を外気と遮断す
るために、ガラス基板１１と封着板１５，２６との接着
を、接着剤と捕水剤若しくは捕水剤を含む接着剤を用い
て不活性ガス雰囲気下において実施し、外気に含まれる
水分が接着剤層を浸透し封着板１５，２６の内側へ浸入
する前に除去する。That is, in the above-described method for manufacturing an organic EL display, the organic EL element (light-emitting layer 13) formed of an organic phosphor thin film formed on the glass substrate 11 is sealed with the glass substrate 11 in order to shut it off from the outside air. Bonding to the plates 15 and 26 is performed under an inert gas atmosphere using an adhesive and a water catching agent or an adhesive containing a water catching agent. It is removed before entering the inside of 15, 26.
【００４１】また、有機ＥＬ素子が形成されたガラス基
板１１と封着板１５，２６を接着する接着剤は、光硬化
型或いは熱硬化型のエポキシ樹脂が用いられる。As an adhesive for bonding the glass substrate 11 on which the organic EL element is formed and the sealing plates 15 and 26, a photo-curing or thermosetting epoxy resin is used.
【００４２】更に、封着後の水分を除去する捕水剤は、
化学的に水分を吸着し固体変形を生じない物質であり、
捕水剤を含む接着剤は、エポキシ樹脂に捕水剤を、例え
ば、５％〜９５％含有した構成を有する。Further, a water catching agent for removing moisture after sealing is as follows:
A substance that chemically absorbs water and does not cause solid deformation,
The adhesive containing a water-trapping agent has a configuration in which a water-trapping agent is contained in an epoxy resin, for example, 5% to 95%.
【００４３】この捕水剤或いは捕水剤を含む接着剤は、
外気に直接触れないように接着剤層の内側、即ち、有機
ＥＬ素子側に配置され、透明若しくは不透明の封着板１
５，２６を装着することにより、接着剤層に浸透した水
分が、捕水剤或いは捕水剤を含む接着剤層で吸着される
ため、有機蛍光体薄膜に触れることなく除去できる。The water-absorbing agent or the adhesive containing the water-absorbing agent is as follows:
A transparent or opaque sealing plate 1 that is disposed inside the adhesive layer, that is, on the organic EL element side, so as not to directly touch the outside air.
By attaching 5, 26, the water that has permeated the adhesive layer is adsorbed by the water-absorbing agent or the adhesive layer containing the water-absorbing agent, and thus can be removed without touching the organic phosphor thin film.
【００４４】このように、この発明によれば、封着後に
封着部分から水分が浸透するのを、封着内部へ入る前に
防止することができることから、有機蛍光体薄膜からな
る発光素子への封着後の水分による影響が無く、且つ、
捕水剤の発光素子部への飛散が無いことから、簡便な封
着作業で長寿命化が可能な有機ＥＬディスプレイを提供
することができる。As described above, according to the present invention, it is possible to prevent the permeation of moisture from the sealed portion after the sealing before entering the inside of the sealed portion. Is not affected by moisture after sealing, and
Since the water-trapping agent does not scatter to the light-emitting element portion, an organic EL display capable of extending the life by a simple sealing operation can be provided.
【００４５】なお、この発明は上記各実施の形態に限定
されず、この発明の技術思想の範囲内において、上記各
実施の形態は適宜変更され得ることは明らかである。It should be noted that the present invention is not limited to the above embodiments, and it is clear that the above embodiments can be appropriately modified within the scope of the technical idea of the present invention.
【００４６】[0046]
【発明の効果】以上説明したように、この発明によれ
ば、基板上の有機ＥＬ素子を外気と遮断するように、有
機ＥＬ素子を覆って基板上に封着板を装着した有機ＥＬ
ディスプレイは、防止手段によって、封着板の装着部分
から外気に含まれる水分が侵入するのを防止するので、
エレクトロルミネッセンスの発光素子の短命化を防止し
長期信頼性を確保することができる。As described above, according to the present invention, the organic EL device having the sealing plate mounted on the substrate so as to cover the organic EL device so as to shield the organic EL device on the substrate from the outside air.
The display prevents the moisture contained in the outside air from entering from the mounting part of the sealing plate by the prevention means,
It is possible to prevent the life of the electroluminescent light emitting element from being shortened, and to ensure long-term reliability.
【００４７】また、この発明に係る有機ＥＬディスプレ
イの製造方法により、上記有機ＥＬディスプレイを製造
することができる。The organic EL display can be manufactured by the method for manufacturing an organic EL display according to the present invention.
【図１】この発明の第１の実施の形態に係る有機ＥＬデ
ィスプレイを示し、（ａ）は平面図、（ｂ）は（ａ）の
Ａ−Ａ線に沿う断面図である。FIGS. 1A and 1B show an organic EL display according to a first embodiment of the present invention, wherein FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along line AA of FIG.
【図２】図１の有機ＥＬディスプレイの製造工程の一部
を模式的に示し、（ａ）は封着以前の平面図、（ｂ）は
（ａ）のＡ−Ａ線に沿う断面図、（ｃ）は封着後の
（ｂ）と同様の断面図である。FIGS. 2A and 2B schematically show a part of the manufacturing process of the organic EL display of FIG. 1, wherein FIG. 2A is a plan view before sealing, FIG. 2B is a cross-sectional view taken along line AA in FIG. (C) is a sectional view similar to (b) after sealing.
【図３】図１の有機ＥＬディスプレイの他の製造工程の
一部を模式的に示し、（ａ）は封着前の封着板の図２
（ｂ）と同様の断面図、（ｂ）は封着後の図２（ｃ）と
同様の断面図である。3A and 3B schematically show a part of another manufacturing process of the organic EL display of FIG. 1, and FIG. 2A shows a sealing plate before sealing.
FIG. 2B is a sectional view similar to FIG. 2B, and FIG. 2B is a sectional view similar to FIG. 2C after sealing.
【図４】この発明の第２の実施の形態に係る有機ＥＬデ
ィスプレイの製造工程の一部を模式的に示す、図２
（ｃ）と同様の断面図である。FIG. 4 schematically shows a part of a manufacturing process of an organic EL display according to a second embodiment of the present invention.
It is sectional drawing similar to (c).
【図５】この発明の第３の実施の形態に係る有機ＥＬデ
ィスプレイの製造工程の一部を模式的に示す、図２
（ｃ）と同様の断面図である。FIG. 5 schematically shows a part of a manufacturing process of an organic EL display according to a third embodiment of the present invention.
It is sectional drawing similar to (c).
【図６】この発明の第４の実施の形態に係る有機ＥＬデ
ィスプレイの封着工程における接着剤塗布方法を模式的
に示し、（ａ）は個別のディスペンサーを用いた場合の
断面図、（ｂ）は捕水剤を用いた場合の断面図である。6A and 6B schematically show a method of applying an adhesive in a sealing step of an organic EL display according to a fourth embodiment of the present invention, in which FIG. 6A is a cross-sectional view when an individual dispenser is used, and FIG. () Is a cross-sectional view when a water catching agent is used.
【図７】従来の有機ＥＬディスプレイを示し、（ａ）は
平面図、（ｂ）は（ａ）のＡ−Ａ線に沿う断面図であ
る。7A and 7B show a conventional organic EL display, wherein FIG. 7A is a plan view and FIG. 7B is a cross-sectional view taken along line AA of FIG.
１０，２０，２５ 有機ＥＬディスプレイ １１ ガラス基板 １２ ＩＴＯ電極 １３ 発光層 １４ 陰極金属 １５ 封着板 １６ エポキシ樹脂 １７ エポキシ樹脂 ３０，３１ ディスペンサー ３２ 捕水剤 10, 20, 25 Organic EL display 11 Glass substrate 12 ITO electrode 13 Light emitting layer 14 Cathode metal 15 Sealing plate 16 Epoxy resin 17 Epoxy resin 30, 31 Dispenser 32 Water collecting agent
Claims (7)
うに、前記有機ＥＬ素子を覆って前記基板上に封着板を
装着した有機ＥＬディスプレイにおいて、 前記封着板の装着部分から前記外気に含まれる水分が侵
入するのを防止する防止手段を有することを特徴とする
有機ＥＬディスプレイ。1. An organic EL display having a sealing plate mounted on the substrate so as to cover the organic EL device so as to block the organic EL device on the substrate from the outside air. An organic EL display comprising a prevention means for preventing moisture contained in outside air from entering.
着する接着剤と、化学的に水分を吸着する捕水剤又は前
記捕水剤を含有する接着剤とからなることを特徴とする
請求項１に記載の有機ＥＬディスプレイ。2. The method according to claim 1, wherein the prevention means comprises an adhesive for mounting a sealing plate on the substrate, and a water-absorbing agent which chemically adsorbs moisture or an adhesive containing the water-absorbing agent. The organic EL display according to claim 1, wherein
樹脂であることを特徴とする請求項１または２に記載の
有機ＥＬディスプレイ。3. The organic EL display according to claim 1, wherein the adhesive is a photocurable or thermosetting resin.
剤は、前記封着板の内側に位置することを特徴とする請
求項２または３に記載の有機ＥＬディスプレイ。4. The organic EL display according to claim 2, wherein the water catching agent or the adhesive containing the water catching agent is located inside the sealing plate.
うに、前記有機ＥＬ素子を覆って前記基板上に封着板を
装着する有機ＥＬディスプレイの製造方法において、 前記封着板を、装着部分から前記外気に含まれる水分が
侵入するのを防止する防止手段を介して前記基板上に装
着する工程を有することを特徴とする有機ＥＬディスプ
レイの製造方法。5. A method of manufacturing an organic EL display, comprising: mounting a sealing plate on the substrate so as to cover the organic EL device so as to block the organic EL device on the substrate from the outside air; A method for manufacturing an organic EL display, comprising a step of mounting on the substrate via a prevention means for preventing moisture contained in the outside air from entering from a mounting portion.
着する接着剤と、化学的に水分を吸着する捕水剤又は前
記捕水剤を含有する接着剤とからなることを特徴とする
請求項５に記載の有機ＥＬディスプレイの製造方法。6. The prevention means comprises an adhesive for mounting a sealing plate on the substrate, and a water-absorbing agent that chemically adsorbs moisture or an adhesive containing the water-absorbing agent. The method for manufacturing an organic EL display according to claim 5.
うに、前記有機ＥＬ素子を覆って前記基板上に封着板を
装着する有機ＥＬディスプレイの製造方法において、 基板上の所望のパターン位置に正孔輸送層を形成する工
程と、 有機蛍光体薄膜からなる発光層を形成する工程と、 陰極金属を形成する工程と、 封着領域に、エポキシ樹脂を塗布すると共に捕水剤を含
有させたエポキシ樹脂を塗布する工程と、 前記両エポキシ樹脂からなる接着剤により前記封着板を
装着する工程と、 前記接着剤を硬化させて前記封着板を接着固化する工程
とを有することを特徴とする有機ＥＬディスプレイの製
造方法。7. A method for manufacturing an organic EL display, comprising: mounting a sealing plate on the substrate so as to cover the organic EL element so as to shield the organic EL element on the substrate from outside air; A step of forming a hole transport layer at a position, a step of forming a light emitting layer composed of an organic phosphor thin film, a step of forming a cathode metal, and a step of applying an epoxy resin to a sealing region and containing a water trapping agent A step of applying the epoxy resin, and a step of attaching the sealing plate with an adhesive made of the two epoxy resins; and a step of curing the adhesive to bond and solidify the sealing plate. A method for manufacturing an organic EL display.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11119030A JP2000311782A (en) | 1999-04-27 | 1999-04-27 | Organic el display, and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11119030A JP2000311782A (en) | 1999-04-27 | 1999-04-27 | Organic el display, and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000311782A true JP2000311782A (en) | 2000-11-07 |
Family
ID=14751253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11119030A Pending JP2000311782A (en) | 1999-04-27 | 1999-04-27 | Organic el display, and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000311782A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002158088A (en) * | 2000-09-08 | 2002-05-31 | Semiconductor Energy Lab Co Ltd | El display device |
| JP2003203763A (en) * | 2001-12-28 | 2003-07-18 | Delta Optoelectronics Inc | Housing structure with multi-layer sealing layer |
| WO2003065470A1 (en) * | 2002-01-31 | 2003-08-07 | 3M Innovative Properties Company | Encapsulation of organic electronic devices using adsorbent loaded adhesives |
| KR100506149B1 (en) * | 2002-07-22 | 2005-08-08 | 이충훈 | Manufacturing method of organic light emitting diode |
| US7317281B2 (en) | 2002-02-12 | 2008-01-08 | Seiko Epson Corporation | Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances |
| JP2008016300A (en) * | 2006-07-05 | 2008-01-24 | Seiko Epson Corp | Organic light emitting device, manufacturing method thereof, and electronic equipment |
| KR100977702B1 (en) * | 2007-12-31 | 2010-08-24 | 주성엔지니어링(주) | Display device and method of manufacturing the same |
| JP2011146404A (en) * | 2000-09-08 | 2011-07-28 | Semiconductor Energy Lab Co Ltd | Light-emitting device and its manufacturing method, and electric appliance |
| DE102010043871A1 (en) | 2010-11-12 | 2012-05-16 | Tesa Se | Adhesive composition and method for encapsulating an electronic device |
| DE102010043866A1 (en) | 2010-11-12 | 2012-05-16 | Tesa Se | Adhesive composition and method for encapsulating an electronic device |
| CN102569674A (en) * | 2010-12-24 | 2012-07-11 | 三星移动显示器株式会社 | Encapsulation sheet, flat panel display device using the same, and method of manufacturing the flat panel display device |
| JP2013536569A (en) * | 2010-07-01 | 2013-09-19 | コーニンクレッカ フィリップス エヌ ヴェ | TL retrofit LED module in sealed glass tube |
| WO2016066437A1 (en) | 2014-10-29 | 2016-05-06 | Tesa Se | Adhesive compounds comprising multi-functional siloxane water scavengers |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002158088A (en) * | 2000-09-08 | 2002-05-31 | Semiconductor Energy Lab Co Ltd | El display device |
| JP2011146404A (en) * | 2000-09-08 | 2011-07-28 | Semiconductor Energy Lab Co Ltd | Light-emitting device and its manufacturing method, and electric appliance |
| JP2012079705A (en) * | 2000-09-08 | 2012-04-19 | Semiconductor Energy Lab Co Ltd | Manufacturing method for light-emitting device |
| JP2003203763A (en) * | 2001-12-28 | 2003-07-18 | Delta Optoelectronics Inc | Housing structure with multi-layer sealing layer |
| WO2003065470A1 (en) * | 2002-01-31 | 2003-08-07 | 3M Innovative Properties Company | Encapsulation of organic electronic devices using adsorbent loaded adhesives |
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| US7317281B2 (en) | 2002-02-12 | 2008-01-08 | Seiko Epson Corporation | Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances |
| KR100506149B1 (en) * | 2002-07-22 | 2005-08-08 | 이충훈 | Manufacturing method of organic light emitting diode |
| JP2008016300A (en) * | 2006-07-05 | 2008-01-24 | Seiko Epson Corp | Organic light emitting device, manufacturing method thereof, and electronic equipment |
| KR100977702B1 (en) * | 2007-12-31 | 2010-08-24 | 주성엔지니어링(주) | Display device and method of manufacturing the same |
| JP2013536569A (en) * | 2010-07-01 | 2013-09-19 | コーニンクレッカ フィリップス エヌ ヴェ | TL retrofit LED module in sealed glass tube |
| DE102010043866A1 (en) | 2010-11-12 | 2012-05-16 | Tesa Se | Adhesive composition and method for encapsulating an electronic device |
| WO2012062586A1 (en) | 2010-11-12 | 2012-05-18 | Tesa Se | Adhesive compound and method for encapsulating an electronic assembly |
| WO2012062587A1 (en) | 2010-11-12 | 2012-05-18 | Tesa Se | Adhesive compound and method for encapsulating an electronic assembly |
| DE102010043871A1 (en) | 2010-11-12 | 2012-05-16 | Tesa Se | Adhesive composition and method for encapsulating an electronic device |
| CN102569674A (en) * | 2010-12-24 | 2012-07-11 | 三星移动显示器株式会社 | Encapsulation sheet, flat panel display device using the same, and method of manufacturing the flat panel display device |
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| WO2017080813A1 (en) | 2015-11-09 | 2017-05-18 | Tesa Se | Barrier adhesive mass with polymer getter material |
| US10633563B2 (en) | 2015-11-09 | 2020-04-28 | Tesa Se | Barrier adhesive mass with polymer getter material |
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