JP2002008855A - Organic el panel - Google Patents

Organic el panel

Info

Publication number
JP2002008855A
JP2002008855A JP2000189710A JP2000189710A JP2002008855A JP 2002008855 A JP2002008855 A JP 2002008855A JP 2000189710 A JP2000189710 A JP 2000189710A JP 2000189710 A JP2000189710 A JP 2000189710A JP 2002008855 A JP2002008855 A JP 2002008855A
Authority
JP
Japan
Prior art keywords
adhesive
organic
electrode
panel
glass substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000189710A
Other languages
Japanese (ja)
Other versions
JP4433577B2 (en
Inventor
Toyoyasu Tadokoro
豊康 田所
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Seiki Co Ltd
Original Assignee
Nippon Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Seiki Co Ltd filed Critical Nippon Seiki Co Ltd
Priority to JP2000189710A priority Critical patent/JP4433577B2/en
Publication of JP2002008855A publication Critical patent/JP2002008855A/en
Application granted granted Critical
Publication of JP4433577B2 publication Critical patent/JP4433577B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL panel not making adhesive adhere on a lamination body even when apply quantity of adhesive disperses. SOLUTION: A lamination body 8 has an organic layer 5 having at least a luminous layer interposed between a transparent electrode (first electrode) and a back surface electrode (cathode) 6. The lamination body 8 is provided on a glass substrate (translucent substrate). A sealing cap (sealing member) 7 is provided on the glass substrate 2 through adhesive 9 and covers the lamination body 8. A cut-off part (receiving part)7c is provided on the sealing cap on the surface 7f contacting the glass substrate 2 to receive the adhesive 9.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、陽極となる第1電
極と陰極となる第2電極とに挟持され所定の発光をなす
有機層を備える有機エレクトロルミネッセンスパネル
(以下、有機ELパネルという)に関し、特に、前記有
機層を配設する透光性基板と、前記透光性基板上に接着
剤を介し配設する封止部材との接合構造に関するもので
ある。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic electroluminescent panel (hereinafter, referred to as an organic EL panel) having an organic layer which emits a predetermined light and is sandwiched between a first electrode serving as an anode and a second electrode serving as a cathode. In particular, the present invention relates to a bonding structure between a light-transmitting substrate on which the organic layer is provided and a sealing member provided on the light-transmitting substrate via an adhesive.

【0002】[0002]

【従来の技術】有機ELパネルは、ガラス基板(透光性
基板)上にITO(indium tin oxide)等によって陽極
となる透明電極(第1電極)を形成し、この透明電極上
に正孔注入層,正孔輸送層,発光層及び電子輸送層を順
次積層してなる有機層を形成し、この有機層上にアルミ
(Al)等の非透光性の陰極となる背面電極(第2電極)
を形成し、前記有機層を前記透明電極と前記背面電極と
によって挟持してなる積層体を覆うようにガラス材料か
らなる凹部形状の封止キャップ(封止部材)を前記ガラ
ス基板上に紫外線(UV)硬化型接着剤を介し気密的に
配設することで構成されるものである。
2. Description of the Related Art In an organic EL panel, a transparent electrode (first electrode) serving as an anode is formed on a glass substrate (transparent substrate) by ITO (indium tin oxide) or the like, and holes are injected on the transparent electrode. Layer, a hole transport layer, a light emitting layer, and an electron transport layer are sequentially laminated to form an organic layer. On this organic layer, a back electrode (second electrode) serving as a non-transparent cathode such as aluminum (Al) )
Is formed, and a concave-shaped sealing cap (sealing member) made of a glass material is placed on the glass substrate so as to cover a laminate formed by sandwiching the organic layer between the transparent electrode and the back electrode. (UV) It is configured by being airtightly arranged via a curable adhesive.

【0003】このような有機ELパネルは、前記ガラス
基板と前記封止キャップとを前記接着剤を介して接合す
ることで気密容器を構成し、この気密容器内に前記積層
体を収納する収納空間を備えることで、前記積層体を外
気から遮断する構造を得ている。
Such an organic EL panel forms an airtight container by joining the glass substrate and the sealing cap via the adhesive, and a storage space for storing the laminate in the airtight container. Is provided to obtain a structure for shielding the laminate from the outside air.

【0004】[0004]

【発明が解決しようとする課題】前述した有機ELパネ
ルは、前記封止キャップと前記ガラス基板との接合を図
る場合に、前記封止キャップの前記ガラス基板との当接
面に前記接着剤をディスペンサーによって所定量塗布
し、前記封止キャップを前記ガラス基板上に配設し、所
定の圧力を付与した状態で紫外線を照射し前記接着剤を
硬化させるものであるが、前記ディスペンサーによる前
記接着剤の供給は、供給量にばらつきが生じ、規定量を
上回る接着剤が前記封止キャップの前記当接面に塗布さ
れると、封止時の加圧によって前記接着剤が前記収納空
間内にはみ出し、このはみ出した前記接着剤が前記積層
体に付着することになり、前記接着剤中に含まれる有機
溶剤によって前記積層体にダメージを与えたり、また前
記接着剤が硬化する場合に発生する応力によって前記積
層体を破損させてしまう等の不具合が生じ、有機ELパ
ネルの製造工程において歩留まりを低下させてしまうと
いった問題点を有していた。
In the above-described organic EL panel, when the sealing cap and the glass substrate are joined, the adhesive is applied to the contact surface of the sealing cap with the glass substrate. A predetermined amount is applied by a dispenser, the sealing cap is disposed on the glass substrate, and the adhesive is cured by irradiating ultraviolet rays while applying a predetermined pressure. When the supply amount varies, and the adhesive amount exceeding a specified amount is applied to the contact surface of the sealing cap, the adhesive protrudes into the storage space due to pressure during sealing. The protruding adhesive adheres to the laminate, and the laminate is damaged by an organic solvent contained in the adhesive, or the adhesive is cured. The stress generated in the coupling occurs problems such would not damage the laminate had a problem that results in lowering the yield in the manufacturing process of the organic EL panel.

【0005】そこで、本発明は、前述した問題点に着目
し、接着剤の塗布量にばらつきが生じた場合であっても
前記積層体に前記接着剤を付着させない有機ELパネル
を提供するものである。
Accordingly, the present invention focuses on the above-mentioned problems and provides an organic EL panel which does not allow the adhesive to adhere to the laminate even when the amount of adhesive applied varies. is there.

【0006】[0006]

【課題を解決するための手段】本発明は、前記課題を解
決するため、少なくとも発光層を有する有機層を第1電
極と第2電極とで挟持した積層体と、前記積層体を配設
する透光性基板と、前記透光性基板上に接着剤を介し配
設され、前記積層体を覆う封止部材と、前記封止部材と
前記透光性基板とが当接する各当接面の少なくとも一方
の当接面の内側に設けられ、前記接着剤を受け入れ可能
とする受け入れ部と、を有するものである。
In order to solve the above-mentioned problems, the present invention provides a laminate in which at least an organic layer having a light emitting layer is sandwiched between a first electrode and a second electrode, and the laminate is provided. A light-transmitting substrate, a sealing member provided on the light-transmitting substrate via an adhesive, and covering the laminate, and a contact surface of each of the contact surfaces where the sealing member and the light-transmitting substrate are in contact with each other. A receiving portion provided inside at least one contact surface and capable of receiving the adhesive.

【0007】また、前記封止部材における前記透光性基
板との当接面の内側に切り欠き部を形成することで前記
受け入れ部を構成してなるものである。
Further, the receiving portion is formed by forming a cutout portion inside the contact surface of the sealing member with the translucent substrate.

【0008】また、前記透光性基板における前記封止部
材との当接面の内側に溝部を形成することで前記受け入
れ部を構成してなるものである。
Further, the receiving portion is formed by forming a groove inside the contact surface of the translucent substrate with the sealing member.

【0009】[0009]

【発明の実施の形態】以下、本発明の実施の形態を添付
図面に基づき説明する。
Embodiments of the present invention will be described below with reference to the accompanying drawings.

【0010】図1及び図2において、有機ELパネル1
は、ガラス基板(透光性基板)2と、透明電極(第1電
極)3と、絶縁層4と、有機層5と、背面電極(第2電
極)6と、封止キャップ(封止部材)7とから構成され
ている。
In FIGS. 1 and 2, an organic EL panel 1 is shown.
Are a glass substrate (translucent substrate) 2, a transparent electrode (first electrode) 3, an insulating layer 4, an organic layer 5, a back electrode (second electrode) 6, a sealing cap (sealing member). 7).

【0011】ガラス基板2は、長方形形状からなる透光
性の支持基板である。
The glass substrate 2 is a light-transmitting support substrate having a rectangular shape.

【0012】透明電極3は、ガラス基板2上にITO等
の導電性材料を蒸着法やスパッタリング法等の手段によ
って形成されるもので、日の字型の表示セグメント部3
aと、個々のセグメントからそれぞれ引き出し形成され
たリード部3bと、リード部3bの終端部に設けられる
電極部3cとを備えている。尚、電極部3cは、ガラス
基板2の一辺に集中的に配設されている。
The transparent electrode 3 is formed by depositing a conductive material such as ITO on the glass substrate 2 by means such as vapor deposition or sputtering.
a, a lead portion 3b drawn out from each segment, and an electrode portion 3c provided at the end of the lead portion 3b. Note that the electrode portions 3c are intensively arranged on one side of the glass substrate 2.

【0013】絶縁層4は、例えば、ポリイミド系等の絶
縁材料からなり、例えばフォトリソグラフィー法等の手
段によって形成される。絶縁層4は、表示セグメント部
3aに対応した窓部4aと、背面電極6の後述する電極
部に対応する切り欠き4bとを有し、発光領域の輪郭を
鮮明に表示するため、透明電極3の表示セグメント部3
aの周縁部と若干重なるように窓部4aが形成され、ま
た、透明電極3と背面電極6との絶縁を確保するために
リード部3b上を覆うように配設される。
The insulating layer 4 is made of, for example, a polyimide-based insulating material, and is formed by, for example, a photolithography method. The insulating layer 4 has a window portion 4a corresponding to the display segment portion 3a and a notch 4b corresponding to an electrode portion of the back electrode 6, which will be described later. Display segment part 3
A window 4a is formed so as to slightly overlap with the peripheral edge of a, and is disposed so as to cover the lead 3b in order to ensure insulation between the transparent electrode 3 and the back electrode 6.

【0014】有機層5は、少なくとも発光層を有するも
のであれば良いが、本発明の実施の形態においては正孔
注入層,正孔輸送層,発光層及び電子輸送層を蒸着法や
スパッタリング法等の手段によって順次積層形成してな
るものである。有機層5は、絶縁層4における窓部4a
の形成箇所に対応するように所定の大きさをもって形成
される。
The organic layer 5 only needs to have at least a light emitting layer. In the embodiment of the present invention, the hole injection layer, the hole transport layer, the light emitting layer and the electron transport layer are formed by vapor deposition or sputtering. And the like. The organic layer 5 is formed by a window 4 a in the insulating layer 4.
Is formed with a predetermined size so as to correspond to the formation location of the.

【0015】背面電極6は、アルミニウム(Al)やアル
ミニウムリチウム(Al-Li),マグネシウム銀(Mg-Ag)
等の金属性の導電性材料を蒸着法やスパッタリング法等
の手段によって形成されるものであり、有機層5上に配
設される。背面電極6は、透明電極3における各電極部
3cが形成されるガラス基板2の一辺に設けられるリー
ド部6aと電気的に接続される。尚、リード部6aの終
端部には、電極部(引き出し部)6bが設けられ、リー
ド部6a及び電極部6bは透明電極3と同材料により形
成される。
The back electrode 6 is made of aluminum (Al), aluminum lithium (Al-Li), magnesium silver (Mg-Ag)
Is formed by a method such as a vapor deposition method or a sputtering method using a metallic conductive material such as, for example, and is disposed on the organic layer 5. The back electrode 6 is electrically connected to a lead portion 6a provided on one side of the glass substrate 2 on which the respective electrode portions 3c of the transparent electrode 3 are formed. Note that an electrode portion (lead portion) 6b is provided at the end of the lead portion 6a, and the lead portion 6a and the electrode portion 6b are formed of the same material as the transparent electrode 3.

【0016】以上のように、ガラス基板2上に透明電極
3と絶縁層4と有機層5と背面電極6とを順次積層形成
して積層体8が得られる。
As described above, the transparent electrode 3, the insulating layer 4, the organic layer 5, and the back electrode 6 are sequentially formed on the glass substrate 2 to obtain a stacked body 8.

【0017】封止キャップ7は、例えばガラス材料から
構成されるもので、積層体8を収納するための凹部7a
がエッチング処理やサンドブラスト,切削等の適宜方法
によって形成されおり、この封止キャップ7をUV硬化
型接着剤9を介してガラス基板2上に配設することで、
積層体8を収納する収納空間10を構成する。
The sealing cap 7 is made of, for example, a glass material, and has a recess 7a for accommodating the laminated body 8.
Is formed by an appropriate method such as etching, sand blasting, or cutting. By disposing the sealing cap 7 on the glass substrate 2 via the UV-curable adhesive 9,
The storage space 10 for storing the stacked body 8 is configured.

【0018】また封止キャップ7は、図3に示すよう
に、ガラス基板2との当接面7bの内側(積層体8側)
となる凹部7aの側壁7cに、後述する余剰接着剤を受
け入れ可能な受け入れ部となる複数の切り欠き部7dを
備えている。尚、切り欠き部7bは、切削やサンドブラ
スト,エッチング処理等によって容易に得ることができ
る。
As shown in FIG. 3, the sealing cap 7 is inside the contact surface 7b with the glass substrate 2 (on the side of the laminate 8).
A plurality of notches 7d serving as receiving portions capable of receiving the surplus adhesive described later are provided on the side wall 7c of the concave portion 7a. The notch 7b can be easily obtained by cutting, sandblasting, etching, or the like.

【0019】前述した各部によって有機ELパネル1が
構成されるものであるが、収納空間10内には、吸湿作
用を有する粉体11を含有する液体12が所定量封入さ
れる。
The organic EL panel 1 is constituted by the above-described components. A predetermined amount of a liquid 12 containing a powder 11 having a moisture absorbing action is sealed in a storage space 10.

【0020】かかる有機ELパネル1は、封止キャップ
7の当接面7bの内側となる側壁7cに切り欠き部7d
を備えることに特徴を有するものである。
In the organic EL panel 1, a notch 7d is formed in a side wall 7c inside the contact surface 7b of the sealing cap 7.
It is characterized by having the following.

【0021】即ち、封止キャップ7は、当接面7bにデ
ィスペンサーによって所定量の接着剤9が塗布された
後、ガラス基板2上に配設されて所定の圧力が付与され
ることになるが、当接部7bに塗布された接着剤9は、
封止時の加圧によって封止キャップ7とガラス基板2と
を接着するに不必要な余剰接着剤9aとなって、切り欠
き部7dに流れ込むことになる。
That is, the sealing cap 7 is disposed on the glass substrate 2 after a predetermined amount of the adhesive 9 is applied to the contact surface 7b by a dispenser, and a predetermined pressure is applied. The adhesive 9 applied to the contact portion 7b is
The surplus adhesive 9a unnecessary for bonding the sealing cap 7 and the glass substrate 2 due to the pressure at the time of sealing becomes an unnecessary adhesive 9a and flows into the notch 7d.

【0022】従って、有機ELパネル1は、封止キャッ
プ7に複数の切り欠き部7dを備えることによって、余
剰接着剤9aの大半が切り欠き部7dに流れ込むことに
なるため、余剰接着剤9aの積層体8側への流れ込みを
抑制することができ、余剰接着剤9aの積層体8への付
着を防止することが可能となるため、接着剤9によって
積層体8にダメージを与えたり、破損させることがなく
なり、有機ELパネル1の製造工程における歩留まりを
向上させることが可能となる。
Therefore, in the organic EL panel 1, since the sealing cap 7 is provided with the plurality of notches 7d, most of the surplus adhesive 9a flows into the notches 7d. Since the flow into the laminate 8 can be suppressed and the surplus adhesive 9a can be prevented from adhering to the laminate 8, the laminate 9 is damaged or broken by the adhesive 9. Therefore, the yield in the manufacturing process of the organic EL panel 1 can be improved.

【0023】また、接着剤9をディスペンサーによって
塗布する場合に、塗布量にばらつきが生じるが、このば
らつきによる余剰接着剤9aを切り欠き部7dで吸収で
きることから、接着剤9の塗布量管理も容易になり、生
産性を向上させることが可能となる。
When the adhesive 9 is applied by a dispenser, the applied amount varies. However, since the excess adhesive 9a due to the variation can be absorbed by the notch 7d, the application amount of the adhesive 9 can be easily controlled. And productivity can be improved.

【0024】また、切り欠き部7dを当接面7bの内側
となる凹部7aの壁部7cに形成することから、サンド
ブラスト法や切削,エッチング処理等によって容易に得
ることが可能である。
Further, since the notch 7d is formed in the wall 7c of the concave portion 7a inside the contact surface 7b, it can be easily obtained by sandblasting, cutting, etching or the like.

【0025】次に、図4を用いて本発明の他の実施の形
態を説明するが、前述した実施の形態と同様もしくは相
当箇所には同一符号を付してその詳細な説明は省く。
Next, another embodiment of the present invention will be described with reference to FIG. 4. However, the same or corresponding portions as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

【0026】前述した実施の形態と異なる点は、余剰接
着剤9aを受け入れ可能とする受け入れ部の構成にあ
る。
The difference from the above-described embodiment lies in the configuration of the receiving portion that can receive the surplus adhesive 9a.

【0027】有機ELパネル1は、透光性基板2の封止
キャップ7との当接面2aの内側で、封止キャップ7の
側壁7cに沿うように溝部2bを形成することで、余剰
接着剤9aの受け入れ部を構成している。
The organic EL panel 1 is formed with a groove 2b formed along the side wall 7c of the sealing cap 7 inside the contact surface 2a of the translucent substrate 2 with the sealing cap 7, so that the excess adhesion is achieved. This constitutes a receiving portion for the agent 9a.

【0028】かかる有機ELパネル1において、封止時
の加圧によって封止キャップ7とガラス基板2とを接着
するに不必要な余剰接着剤9aは、溝部2bに流れ込む
ことになるため、余剰接着剤9aの積層体8への付着を
防止することが可能となり、接着剤9によって積層体8
にダメージを与えたり、破損させることがなくなる。
In the organic EL panel 1, surplus adhesive 9a unnecessary for adhering the sealing cap 7 and the glass substrate 2 due to the pressure at the time of sealing flows into the groove 2b. It is possible to prevent the adhesive 9a from adhering to the laminate 8, and the adhesive 9
Damage or damage to

【0029】尚、前述した本発明の実施の形態におい
て、受け入れ部となる切り欠き部7cを封止キャップ7
の当接面7bの内側となる側壁7cに複数設けるように
したが、本発明にあっては、当接面7bの内側にテーパ
ー部からなる切り欠き部を設けるものであっても良く、
本発明における切り欠き部の形状は、前述した実施の形
態の形状に限定されるものではない。また、ガラス基板
2の封止キャップ7との当接面2aの内側に形成される
受け入れ部となる溝部2bの形状も任意に変更可能であ
る。
In the above-described embodiment of the present invention, the notch 7c serving as the receiving portion is
Are provided on the side wall 7c inside the contact surface 7b, but in the present invention, a cutout portion formed of a tapered portion may be provided inside the contact surface 7b,
The shape of the notch in the present invention is not limited to the shape of the above-described embodiment. Also, the shape of the groove 2b serving as a receiving portion formed inside the contact surface 2a of the glass substrate 2 with the sealing cap 7 can be arbitrarily changed.

【0030】前述した実施の形態では、受け入れ部を封
止キャップ7もしくはガラス基板2のどちらか一方に備
えるものであったが、封止キャップ7に切り欠き部7d
を、またガラス基板2に溝部2bをそれぞれ形成するこ
とによって、余剰接着剤9aの収納空間10内への侵入
を更に抑制することが可能となる。
In the above-described embodiment, the receiving portion is provided on either the sealing cap 7 or the glass substrate 2, but the sealing cap 7 has the cutout 7d.
By forming the grooves 2b in the glass substrate 2, it is possible to further suppress the surplus adhesive 9a from entering the storage space 10.

【0031】また、本発明の実施の形態では、封止キャ
ップ7をガラス材料から構成するようにしたが、本発明
にあっては金属製材料からなる凹部形状の封止キャップ
であって良い。この場合の接着剤9の受け入れ部として
は、当接面の内側から略垂直方向に延設される壁部に、
プレス加工によって得ることができる溝部もしくは凹部
を形成することによって容易に得ることができる。
In the embodiment of the present invention, the sealing cap 7 is made of a glass material. However, in the present invention, a sealing cap having a concave shape made of a metal material may be used. In this case, as a receiving portion of the adhesive 9, a wall portion extending in a substantially vertical direction from the inside of the contact surface,
It can be easily obtained by forming a groove or a recess which can be obtained by press working.

【0032】また、本発明の実施の形態では、封止部材
である封止キャップ7を一枚のガラス板より構成するも
のであったが、本発明は、封止部材を平板状のガラス板
と前記ガラス板を支持するスペーサ(支持部)とから構
成するものであっても良く、この場合の受け入れ部は前
記スペーサの当接面の内側に形成される。
Further, in the embodiment of the present invention, the sealing cap 7 as the sealing member is constituted by a single glass plate. And a spacer (supporting portion) for supporting the glass plate. In this case, the receiving portion is formed inside the contact surface of the spacer.

【0033】[0033]

【発明の効果】本発明は、少なくとも発光層を有する有
機層を第1電極と第2電極とで挟持した積層体と、前記
積層体を配設する透光性基板と、前記透光性基板上に接
着剤を介し配設され、前記積層体を覆う封止部材と、前
記封止部材と前記透光性基板とが当接する各当接面の少
なくとも一方の当接面の内側に設けられ、前記接着剤を
受け入れ可能とする受け入れ部と、を有するものであ
り、前記接着剤の塗布量にばらつきが生じた場合であっ
ても前記積層体に前記接着剤を付着させないことから、
前記積層体にダメージを与えたり、破損させる恐れがな
く、有機ELパネルの製造工程における歩留まりを向上
させることができる。
According to the present invention, a laminate in which an organic layer having at least a light-emitting layer is sandwiched between a first electrode and a second electrode, a light-transmitting substrate on which the laminate is provided, and the light-transmitting substrate A sealing member provided on the top with an adhesive and covering the stacked body, and provided inside at least one contact surface of each contact surface where the sealing member and the translucent substrate are in contact with each other. A receiving portion capable of receiving the adhesive, since the adhesive does not adhere to the laminate even when the application amount of the adhesive varies.
There is no possibility of damaging or damaging the laminate, and the yield in the manufacturing process of the organic EL panel can be improved.

【0034】前記受け入れ部は、前記封止部材における
前記透光性基板との当接面の内側に切り欠き部を形成す
ることで得るもの、あるいは、前記透光性基板における
前記封止部材との当接面の内側に溝部を形成することで
得ることから、前記受け入れ部を容易に得ることができ
る。
The receiving portion may be obtained by forming a cut-out portion inside the contact surface of the sealing member with the light-transmitting substrate, or may be formed by forming the notch portion on the light-transmitting substrate. The receiving portion can be easily obtained since the groove is formed inside the abutting surface.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態の有機ELパネルを示す斜
視図。
FIG. 1 is a perspective view showing an organic EL panel according to an embodiment of the present invention.

【図2】同上実施の形態の有機ELパネルの要部断面
図。
FIG. 2 is a sectional view of a main part of the organic EL panel according to the embodiment.

【図3】同様実施の形態の有機ELパネルにおける封止
部材を示す平面図。
FIG. 3 is a plan view showing a sealing member in the organic EL panel of the same embodiment.

【図4】本発明の他の実施の形態の有機ELパネルを示
す要部断面図。
FIG. 4 is an essential part cross-sectional view showing an organic EL panel according to another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 有機ELパネル 2 ガラス基板(透光性基板) 2a 当接面 2b 溝部(受け入れ部) 3 透明電極(第1電極) 4 絶縁層 5 有機層 6 背面電極(第2電極) 7 封止キャップ(封止部材) 7a 凹部 7b 当接面 7c 切り欠き部(受け入れ部) 8 積層体 Reference Signs List 1 organic EL panel 2 glass substrate (translucent substrate) 2a contact surface 2b groove (receiving part) 3 transparent electrode (first electrode) 4 insulating layer 5 organic layer 6 back electrode (second electrode) 7 sealing cap ( Sealing member) 7a Recess 7b Contact surface 7c Notch (receiving part) 8 Laminate

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 少なくとも発光層を有する有機層を第1
電極と第2電極とで挟持した積層体と、前記積層体を配
設する透光性基板と、前記透光性基板上に接着剤を介し
配設され、前記積層体を覆う封止部材と、前記封止部材
と前記透光性基板とが当接する各当接面の少なくとも一
方の当接面の内側に設けられ、前記接着剤を受け入れ可
能とする受け入れ部と、を有することを特徴とする有機
ELパネル。
An organic layer having at least a light emitting layer is a first layer.
A laminate sandwiched between an electrode and a second electrode, a light-transmitting substrate on which the laminate is provided, and a sealing member provided on the light-transmitting substrate via an adhesive to cover the laminate. A receiving portion that is provided inside at least one contact surface of each of the contact surfaces with which the sealing member and the light-transmitting substrate are in contact, and that can receive the adhesive. Organic EL panel.
【請求項2】 前記封止部材における前記透光性基板と
の当接面の内側に切り欠き部を形成することで前記受け
入れ部を構成してなることを特徴とする請求項1に記載
の有機ELパネル。
2. The receiving portion according to claim 1, wherein a cutout portion is formed inside a contact surface of the sealing member with the translucent substrate to form the receiving portion. Organic EL panel.
【請求項3】 前記透光性基板における前記封止部材と
の当接面の内側に溝部を形成することで前記受け入れ部
を構成してなることを特徴とする請求項1に記載の有機
ELパネル。
3. The organic EL according to claim 1, wherein the receiving portion is formed by forming a groove inside the contact surface of the translucent substrate with the sealing member. panel.
JP2000189710A 2000-06-20 2000-06-20 Organic EL panel Expired - Fee Related JP4433577B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000189710A JP4433577B2 (en) 2000-06-20 2000-06-20 Organic EL panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000189710A JP4433577B2 (en) 2000-06-20 2000-06-20 Organic EL panel

Publications (2)

Publication Number Publication Date
JP2002008855A true JP2002008855A (en) 2002-01-11
JP4433577B2 JP4433577B2 (en) 2010-03-17

Family

ID=18689305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000189710A Expired - Fee Related JP4433577B2 (en) 2000-06-20 2000-06-20 Organic EL panel

Country Status (1)

Country Link
JP (1) JP4433577B2 (en)

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Publication number Priority date Publication date Assignee Title
WO2004014109A1 (en) * 2002-07-31 2004-02-12 Nippon Sheet Glass Co., Ltd. Sealing plate for electroluminecense element and mother glass substrate for taking a large number of sealing plates
JP2007052348A (en) * 2005-08-19 2007-03-01 Yazaki Corp Lcd assembly structure
JP2007250355A (en) * 2006-03-16 2007-09-27 Seiko Epson Corp Sealing structure for light emitting device, its manufacturing method, light emitting device, and electronic device
US7828617B2 (en) 2001-11-01 2010-11-09 Sony Corporation Display apparatus
US8063562B2 (en) 2007-11-19 2011-11-22 Seiko Epson Corporation Light-emitting device and electronic apparatus

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8519622B2 (en) 2001-11-01 2013-08-27 Sony Corporation Display apparatus
US9425427B2 (en) 2001-11-01 2016-08-23 Joled Inc. Display apparatus including organic electroluminescent devices
US11258036B2 (en) 2001-11-01 2022-02-22 Joled Inc. Display apparatus including organic electroluminescence devices
US7828617B2 (en) 2001-11-01 2010-11-09 Sony Corporation Display apparatus
US10249841B2 (en) 2001-11-01 2019-04-02 Joled Inc. Display apparatus
US8179038B2 (en) 2001-11-01 2012-05-15 Sony Corporation Display apparatus
US10008688B2 (en) 2001-11-01 2018-06-26 Joled Inc. Display apparatus including organic electroluminescence devices
US8896203B2 (en) 2001-11-01 2014-11-25 Sony Corporation Display apparatus including a plurality of organic electroluminescent devices
US9716246B2 (en) 2001-11-01 2017-07-25 Joled Inc. Display apparatus
US9653699B2 (en) 2001-11-01 2017-05-16 Joled Inc. Method of manufacturing a display apparatus
WO2004014109A1 (en) * 2002-07-31 2004-02-12 Nippon Sheet Glass Co., Ltd. Sealing plate for electroluminecense element and mother glass substrate for taking a large number of sealing plates
JP2007052348A (en) * 2005-08-19 2007-03-01 Yazaki Corp Lcd assembly structure
JP2007250355A (en) * 2006-03-16 2007-09-27 Seiko Epson Corp Sealing structure for light emitting device, its manufacturing method, light emitting device, and electronic device
US8063562B2 (en) 2007-11-19 2011-11-22 Seiko Epson Corporation Light-emitting device and electronic apparatus

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