JP2002359085A - Organic el panel and method for manufacturing it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL panel capable of airtightly dispose a sealing member and a supporting base by sufficiently hardening an adhesive, even if a metallic material having low resistivity is used for wiring parts to electrically connect first and second electrodes to an external power source to apply a voltage, and a method for manufacturing it. SOLUTION: This organic EL panel 1 is equipped with the wiring parts (a first wiring part, a second wiring part) 8a, 8b of a metallic material having low resistivity for electrically connecting first and second electrodes (a transparent electrode, a back plate) 3, 6 to the external power source, respectively. It is also equipped with lead-in parts 8c, 8d formed in a region facing the adhesive 9 in the wiring parts (the first wiring part, the second wiring part) 8a, 8b to lead light irradiated on the adhesive 9 to the adhesive 9.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic EL (electroluminescence) panel, and more particularly to an organic EL panel using a metal material having a low resistivity in a wiring portion for electrically connecting an electrode and an external power supply, and an organic EL panel using the same. It relates to a manufacturing method.

[0002]

2. Description of the Related Art As an organic EL panel using an organic EL element, an ITO (Indium Tin Oxide) serving as an anode is provided on a translucent supporting substrate made of a glass material.
And a non-transparent back electrode made of aluminum (Al) or the like, which serves as a cathode, and a transparent electrode made of an organic material such as a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer. It is known to be configured by sequentially forming a laminate, between the transparent electrode and the back electrode, by electrically connecting a DC power supply of several tens of volts to supply a current between the two electrodes. The organic layer emits light, and the emitted light is radiated to the outside through the support substrate. The light emitting portion is generally determined by the pattern of the transparent electrode.

In such an organic EL panel, a conductive material having a high transmittance such as ITO is used for the transparent electrode. However, since such a material has a relatively high resistivity, an external power source and the first power source are required. , The second electrode and the second electrode are used in a wiring portion for electrically connecting each other, a voltage drop phenomenon occurs in the middle of the wiring, and there is a problem that a driving voltage is increased to compensate for this.

[0004]

As a means for solving such a problem, for example, one disclosed in Japanese Patent Application Laid-Open No. 13-15268 is known. It has a display portion and a terminal portion for voltage application, and a metal layer (auxiliary conductive layer) made of a metal material having a low resistivity is formed between the two portions.

However, in the organic EL panel having such a structure, in order to prevent the organic layer formed on the supporting substrate from being deteriorated, a sealing member made of, for example, a glass material is replaced with an adhesive made of, for example, an ultraviolet curable resin. When irradiating the adhesive with ultraviolet light for airtightly disposing the support substrate via the, the metal layer blocks the ultraviolet light, and the adhesive in a region opposed to the metal layer is sufficient. And the hermeticity between the sealing member and the support substrate is reduced.

In view of such a problem, the present invention is directed to a case where a metal material having a low resistivity is used as a wiring portion for electrically connecting an external power supply and first and second electrodes for applying a voltage. Another object of the present invention is to provide an organic EL panel capable of sufficiently curing an adhesive and allowing an airtight arrangement of a sealing member and a support substrate, and a method of manufacturing the same.

[0007]

According to the present invention, in order to solve the above-mentioned problems, at least an organic layer having a light emitting layer is firstly formed.
A laminate sandwiched between the electrode and the second electrode is disposed on a light-transmitting support substrate, and a sealing member is attached to the support substrate via a photoreactive adhesive so as to airtightly cover the laminate. An organic EL panel disposed, comprising: a wiring portion made of a metal material having a low resistivity and electrically connecting the first and second electrodes to an external power source; and the adhesive of the wiring portion. And an introduction part formed in the facing region and guiding light irradiated to the adhesive to the adhesive.

In addition, a laminate in which an organic layer having at least a light-emitting layer is sandwiched between a first electrode and a second electrode is disposed on a light-transmitting support substrate, and light is applied so as to hermetically cover the laminate. An organic EL panel in which a sealing member is provided on the support substrate via a reactive adhesive, wherein a metal layer made of a metal material having a low resistivity is formed on a base made of a light-transmitting conductive material. Forming a wiring portion for electrically connecting the first and second electrodes to an external power source; and forming a wiring formed in a region of the wiring portion facing the adhesive and irradiating the adhesive. And an introduction portion for leading to the adhesive.

Further, the introduction section is characterized by comprising a slit section having at least one opening.

A step of forming first and second wiring portions made of a metal material having a low resistivity on a light-transmitting support substrate; and forming the first and second wiring portions on the first and second wiring portions from the direction of the support substrate. Forming an introduction portion for introducing the irradiated light; and forming a first electrically connected to the first wiring portion on the support substrate.
An electrode and an organic layer having at least a light emitting layer;
A step of sequentially forming a second electrode electrically connected to the wiring portion, and disposing a sealing member for sealing the organic layer on the support substrate and the introduction portion via a photoreactive adhesive. And a step of irradiating light to cure the adhesive and airtightly dispose the sealing member.

A step of forming a first electrode and a first and a second base made of a light-transmitting conductive material on a light-transmitting support substrate; and forming the first electrode and the second base on the first and second bases. Forming first and second metal layers made of a metal material having a low resistivity to form first and second wiring portions; and irradiating the first and second metal layers from the support substrate direction. Forming an introduction portion for introducing light to be emitted, and sequentially forming an organic layer having at least a light emitting layer on the first electrode and a second electrode electrically connected to the second wiring portion. And a step of disposing a sealing member for sealing the organic layer on the support substrate and the introduction portion via a photoreactive adhesive, and curing the adhesive by irradiating light. And a step of hermetically disposing the sealing member.

Further, as a step of forming the introduction portion,
A step of providing a slit having at least one or more openings.

[0013]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

In FIG. 1, an organic EL panel 1 includes a glass substrate (supporting substrate) 2, a transparent electrode (first electrode) 3,
An insulating layer 4, an organic layer 5, a back electrode (second electrode) 6,
Sealing member 7, first wiring portion 8a, and second wiring portion 8b
It is composed of

The glass substrate 2 is a light-transmitting support substrate having a rectangular shape.

The transparent electrode 3 is formed by forming a light-transmitting conductive material such as ITO on the glass substrate 2 into a layer having a thickness of 50 to 200 nm by a method such as a vapor deposition method or a sputtering method, and by a photolithography method or the like. It is formed by patterning according to the display design. The transparent electrode 3 has a portion that overlaps with a first wiring portion 8a described later in detail, and is electrically connected to the first wiring portion 8a.

The insulating layer 4 is made of, for example, a polyimide-based insulating material and is formed by a means such as a photolithography method. The insulating layer 4 is formed so as to slightly overlap the periphery of the display portion of the transparent electrode 3 in order to clearly display the outline of the light emitting region, and is transparent in order to ensure insulation between the transparent electrode 3 and the back electrode 6. It is arranged so as to fill the space between the electrode 3 and the second wiring portion 8b.

The organic layer 5 may have at least a light emitting layer. In the embodiment of the present invention, the hole injection layer, the hole transport layer, the light emitting layer, and the electron transport layer are formed by vapor deposition or sputtering. Layered sequentially by means such as the method,
It is a layer having a thickness of 100 to 300 nm. Further, the organic layer 5 is provided with a predetermined size so as to correspond to a position where the display portion of the transparent electrode 3 is formed.

The back electrode 6 is made of aluminum (Al), aluminum lithium (Al: Li), magnesium silver (Mg:
Ag) or another metal conductive material is formed into a layer having a thickness of 50 to 200 nm by a method such as a vapor deposition method.
Electrically connected to the wiring portion 8b.

As described above, a laminated body is obtained by sequentially laminating the transparent electrode 3, the insulating layer 4, the organic layer 5, and the back electrode 6 on the glass substrate 2.

The sealing member 7 is formed by forming a concave portion on a flat plate member made of, for example, a glass material by an appropriate method such as sandblasting, cutting and etching. Sealing member 7
The sealing member 7 is provided by hermetically arranging a supporting portion formed so as to surround the concave portion on the glass substrate 2 via an adhesive made of, for example, an ultraviolet curable epoxy resin.
And the glass substrate 2 seal the laminate 8. Sealing member 7
Are the first wiring portion 8a and the second wiring portion 8 of the transparent electrode 3.
It is configured to be slightly smaller than the glass substrate 2 so that b is exposed to the outside.

The first wiring portion 8a is formed by forming a metal material having a low resistivity, such as chromium (Cr), into a layer having a thickness of 200 to 300 nm by a method such as an evaporation method or a sputtering method.
It is formed by performing predetermined patterning by means such as a photolithography method, and is electrically connected to the transparent electrode 3 and electrically connected to an external power supply (not shown) for applying a voltage to the laminate. You. The first wiring portion 8a includes a slit portion having at least one opening in a region facing the adhesive 9, and an introduction portion 8c for guiding light emitted from the direction of the glass substrate 2 to the adhesive 9.
(FIG. 2A). The introduction portion 8c is formed by a means such as a photolithography method. In order to guide the irradiated light to the entire adhesive 9, a plurality of the openings of the introduction portion 8c are desirably formed.

The second wiring portion 8b is formed by forming a metal material having a low resistivity, such as chromium (Cr), into a layer having a thickness of 200 to 300 nm by a method such as an evaporation method or a sputtering method.
It is formed by performing predetermined patterning by means such as a photolithography method, and is electrically connected to the back electrode 6 and electrically connected to the external power supply to apply a voltage to the laminate. The second wiring portion 8b includes a slit portion having at least one opening in a region facing the adhesive 9, and an introduction portion 8d for guiding light emitted from the direction of the glass substrate 2 to the adhesive 9. (FIG. 2B). The introduction portion 8d is formed by means such as a photolithography method. In order to guide the irradiated light to the entire adhesive 9, it is desirable that a plurality of the openings of the introduction portion 8d be formed.

Next, a method of manufacturing the organic EL panel 1 will be described with reference to FIG.

First, a layered metal layer 8 is formed on the glass substrate 2 by means such as a vapor deposition method or a sputtering method (FIG. 3A).

Next, the metal layer 8 is patterned into a predetermined shape by photolithography or the like.
The wiring portion 8a and the second wiring portion 8b are formed (see FIG. 3).
(B)). At this time, introduction parts 8c and 8d are formed in the first wiring part 8a and the second wiring part 8b, respectively.

Next, the layered transparent electrode 3 is formed on the glass substrate 2 and the first wiring portion 8a and the second wiring portion 8b by means such as a vapor deposition method or a sputtering method (FIG. 3C). .

Next, the transparent electrode 3 is patterned according to a predetermined display design by photolithography or the like (FIG. 3D). At this time, the transparent electrode 3 has a portion overlapping with the first wiring portion 8a and the second wiring portion 8a.
The pattern is formed so as to have a gap between it and b.

Next, the insulating layer 4 is formed on the glass substrate 2, the transparent electrode 3, the first wiring portion 8 by photolithography or the like.
a and the second wiring portion 8b. Further, the organic layer 5 and the back electrode 6 are sequentially laminated to form a laminate having a predetermined light emitting shape (FIG. 3E). At this time, the insulating layer 4
Insulation between transparent electrode 3 and second wiring portion 8b and back electrode 6
And the first wiring portion 8a are formed so as to ensure insulation. The back electrode 6 is formed so as to be electrically connected to the second wiring portion 8b.

Next, the sealing member 7 is placed on the glass substrate 2, the first wiring portion 8a, and the second wiring portion 8b with an adhesive 9 made of a photo-reactive adhesive so as to surround the laminate. The glass substrate 2, the first wiring portion 8a and the second wiring portion 8b, and the sealing member 7 are hermetically bonded to each other by irradiating light to cure the adhesive 9, and An EL panel 1 is obtained (FIG. 3F). At this time, the sealing member 7 and the adhesive 9 are disposed so as to face the introduction part 8c of the first wiring part 8a and the introduction part 8d of the second wiring part 8b.

In the organic EL panel 1, introduction portions 8 c and 8 d for guiding irradiated light to the adhesive 9 are formed in regions of the first wiring portion 8 a and the second wiring portion 8 b facing the adhesive 9. By forming each, even when a metal material having a low resistivity is used for the wiring portion, light for curing the adhesive can be applied to the adhesive 9, and by sufficiently curing the adhesive 9, It is possible to arrange the sealing member 7 and the glass substrate 2 in an airtight manner.

In particular, when the introduction portions 8c and 8d are slit portions having at least one or more openings, the strength of the wiring portion can be maintained and light can be more efficiently irradiated to the entire adhesive 9. By curing the adhesive 9 more efficiently, the airtightness between the sealing member 7 and the glass substrate 2 can be further improved.

Next, another embodiment of the present invention will be described with reference to FIG. 4. The same or corresponding portions as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. .

In FIG. 4, an organic EL panel 10 includes a glass substrate (support substrate) 2 and a transparent electrode (first electrode) 11.
a, insulating layer 4, organic layer 5, back electrode (second electrode)
6, a sealing member 7, a first wiring portion 12a, and a second wiring portion 12b.

The transparent electrode 11a is provided on the glass substrate 2 by IT.
A light-transmitting conductive material such as O is formed into a layer with a thickness of 50 to 200 nm by a method such as an evaporation method or a sputtering method,
It is formed by patterning according to a predetermined display design by a photolithography method or the like, and a region outside the display portion is a first wiring portion 12a which will be described later in detail.
It is a base part of.

The first wiring portion 12a has a 200-300 nm-thick first metal layer 13a made of a low-resistivity metal material such as chromium (Cr) on a region outside the display portion of the transparent electrode 11a. The first wiring portion 1
2a is electrically connected to the transparent electrode 11a, and is also electrically connected to an external power supply (not shown) for applying a voltage to the laminate including the transparent electrode 11a, the organic layer 5, and the back electrode 6. The first wiring portion 12a is formed of the first metal layer 1
3a, a slit portion having at least one or more openings in a region opposed to the adhesive 9 and an introduction portion 1 for guiding light emitted from the direction of the glass substrate 2 to the adhesive 9;
3c (FIG. 5A). The introduction portion 13c is formed by means such as a photolithography method. In order to guide the irradiated light to the entire adhesive 9, the introduction portion 13c
It is preferable that a plurality of the openings are formed.

The second wiring portion 12b is made of a light-transmitting conductive material and has a thickness of 50 to 200 nm.
A second metal layer 13b having a thickness of 200 to 300 nm and made of a metal material having a low resistivity such as chromium (Cr) is laminated on the second metal layer 13b. It is electrically connected to the external power supply to apply a voltage to the laminate. The second wiring portion 12b is formed of a slit portion having at least one or more openings in a region of the second metal layer 13b facing the adhesive 9, and emits light irradiated from the direction of the glass substrate 2 to the adhesive. 9 (see FIG. 5B). The introduction portion 13d is formed by a means such as a photolithography method. In order to guide the irradiated light to the entire adhesive 9, it is preferable that a plurality of the openings of the introduction portion 13d are formed.

Next, a method of manufacturing the organic EL panel 10 will be described with reference to FIG.

First, a layered transparent electrode layer 1 is formed on a glass substrate 2 by means such as a vapor deposition method or a sputtering method.
1 is formed (FIG. 6A).

Next, a layered metal layer 13 is formed on the transparent electrode layer 11 by means such as a vapor deposition method or a sputtering method.
Is formed (FIG. 6B).

Next, the first metal layer 13a and the second metal layer 13b are formed by patterning the metal layer 13 into a predetermined shape by photolithography or the like (FIG. 6C). At this time, the first metal layer 13a and the second
And the metal layers 13b are respectively provided with introduction portions 13c and 13d.
Is formed.

Next, the transparent electrode layer 11 is patterned according to a predetermined display design by a photolithography method or the like. The transparent electrode layer 11 includes a transparent electrode 11a formed integrally with the first base, and a second base 11
b (see FIG. 6D). At this time, the first wiring portion 12a is formed by the region outside the light emitting portion of the transparent electrode 11a and the first metal layer 13a, and the second wiring portion 12a is formed by the second base portion 11b and the second metal layer 13a. 1
2b is formed.

Next, the insulating layer 4 is formed on the glass substrate 2, the transparent electrode 11a, the first metal layer 13a and the second metal layer 13b by photolithography or the like. Further, the organic layer 5 and the back electrode 6 are sequentially laminated to form a laminate having a predetermined light emission shape (FIG. 6E). At this time, the insulating layer 4 is formed so as to ensure insulation between the transparent electrode 11a and the second wiring portion 12b and insulation between the back electrode 6 and the first wiring portion 12a. The back electrode 6 is formed so as to be electrically connected to the second wiring portion 12b.

Next, the sealing member 7 is placed on the glass substrate 2, the first metal layer 13a and the second metal layer 13b via the adhesive 9 made of a photoreactive adhesive so as to surround the laminate. The adhesive 9 is cured by irradiating light, and the glass substrate 2, the first wiring portion 12 a and the second wiring portion 12 b, and the sealing member 7 are air-tightly bonded to each other to form an organic material. An EL panel 10 is obtained (FIG. 6F). At this time, the sealing member 7 and the adhesive 9 are applied to the introduction portion 13 of the first metal layer 13a.
It is arranged so as to face the introduction portion 13d of the second metal layer 13b.

The organic EL panel 10 has a region opposed to the adhesive 9 of the first metal layer 13a forming the first wiring portion 12a and the second metal layer 13b forming the second wiring portion 12b. Introducing part 1 for guiding the irradiated light to the adhesive 9
Even when the wiring portion is formed by laminating a metal layer made of a metal material having a low resistivity on a base portion made of a light-transmitting conductive material by forming each of 3c and 13d, an adhesive is used. Can be applied to the adhesive 9, and the sealing member 7 and the glass substrate 2 can be disposed in an airtight manner by sufficiently curing the adhesive 9.

In particular, when the introduction portions 13c and 13d are formed as slits having at least one opening, the strength of the wiring portion can be maintained and the entire adhesive 9 can be efficiently irradiated with light. By curing the adhesive 9 more efficiently, the airtightness between the sealing member 7 and the glass substrate 2 can be further improved.

In the embodiment of the present invention, the openings of the slits forming the introduction portions 8c and 8d and the introduction portions 13c and 13d have a rectangular shape. The shape may be any shape as long as it irradiates the entire adhesive, and may be a configuration such as a circle or an ellipse.

In the embodiment of the present invention, at least one of the introduction parts 8c and 8b and the introduction parts 13c and 13d
Although the slit portion has at least one opening, in the present invention according to claim 1, claim 2, claim 4, or claim 5, the configuration of the introduction portion is the same as that of the present invention. However, the present invention is not limited to this.

In the embodiment of the present invention, the first
Wiring portions 8a and 13a, second wiring portions 8b and 13b
Is formed on different side surfaces on the glass substrate 2, but the first wiring portion and the second wiring portion may be formed intensively on one side surface.

Further, in the embodiment of the present invention, the transparent electrode 11a has a structure in which the transparent electrode and the first base portion forming the first wiring portion are integrally formed. In the third, fifth, and sixth aspects of the present invention, the transparent electrode and the first base may be separately formed.

[0051]

According to the present invention, a laminate in which at least an organic layer having a light emitting layer is sandwiched between a first electrode and a second electrode is disposed on a light-transmitting support substrate, and the laminate is hermetically sealed. An organic EL panel in which a sealing member is disposed on the support substrate via a photoreactive adhesive so as to cover the first and second electrodes, and an external power supply made of a metal material having a low resistivity. And an introduction portion formed in a region of the wiring portion facing the adhesive and guiding light irradiated to the adhesive to the adhesive. Even when a metal material having a low resistivity is used as a wiring portion for electrically connecting an external power supply and the first and second electrodes for applying a voltage, the adhesive can be sufficiently applied. After curing, the sealing member and the supporting substrate can be arranged in an airtight manner.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing an organic EL panel according to an embodiment of the present invention.

FIG. 2 is a diagram showing a wiring portion of the organic EL panel according to the first embodiment.

FIG. 3 is a schematic cross-sectional view showing a method for manufacturing the organic EL panel according to the first embodiment.

FIG. 4 is a schematic sectional view showing an organic EL panel according to another embodiment of the present invention.

FIG. 5 is a diagram showing a wiring portion of the organic EL panel according to the embodiment.

FIG. 6 is a schematic sectional view showing a method for manufacturing the organic EL panel according to the embodiment.

[Explanation of symbols]

 1, 10 Organic EL panel 2 Glass substrate (supporting substrate) 3, 11a Transparent electrode (first electrode) 4 Insulating layer 5 Organic layer 6 Back electrode (second electrode) 7 Sealing member 8a, 12a First wiring section 8b , 12b Second wiring portion 8c, 8d, 13c, 13d Introduction portion 9 Adhesive 11b Second base portion 13a First metal layer 13b Second metal layer

Claims (6)

[Claims] An organic layer having at least a light emitting layer is a first layer.
A laminate sandwiched between the electrode and the second electrode is disposed on a light-transmitting support substrate, and a sealing member is attached to the support substrate via a photoreactive adhesive so as to airtightly cover the laminate. An organic EL panel disposed, comprising: a wiring portion made of a metal material having a low resistivity and electrically connecting the first and second electrodes to an external power source; and the adhesive of the wiring portion. And an introduction portion formed in an opposed region and guiding light irradiated to the adhesive to the adhesive.
L panel. 2. An organic layer having at least a light emitting layer is a first layer.
A laminate sandwiched between the electrode and the second electrode is disposed on a light-transmitting support substrate, and a sealing member is attached to the support substrate via a photoreactive adhesive so as to airtightly cover the laminate. An organic EL panel provided, wherein the first and second electrodes and an external power supply are formed by forming a metal layer made of a metal material having a low resistivity on a base part made of a translucent conductive material. And an introduction portion formed in a region of the wiring portion facing the adhesive and guiding light irradiated to the adhesive to the adhesive. Organic EL panel. 3. The organic EL panel according to claim 1, wherein the introduction section includes a slit having at least one opening. 4. A step of forming first and second wiring portions made of a metal material having a low resistivity on a light-transmitting support substrate, and forming the first and second wiring portions on the first and second wiring portions from the support substrate direction. Forming an introduction portion for introducing the irradiated light, an organic layer having at least a light emitting layer and a first electrode electrically connected to the first wiring portion on the support substrate, and the second wiring A step of sequentially forming a second electrode electrically connected to the portion, and disposing a sealing member for sealing the organic layer on the support substrate and the introduction portion via a photoreactive adhesive. A method of manufacturing an organic EL panel, comprising: a step of irradiating light to cure the adhesive to hermetically dispose the sealing member. 5. A step of forming a first electrode and first and second base portions made of a light-transmitting conductive material on a light-transmitting support substrate, and forming the first and second base portions on the first and second base portions. Forming first and second metal layers made of a metal material having a low resistivity to form first and second wiring portions; and irradiating the first and second metal layers from the support substrate direction. Forming an introduction portion for introducing light to be emitted, and sequentially forming an organic layer having at least a light emitting layer on the first electrode and a second electrode electrically connected to the second wiring portion. And a step of disposing a sealing member for sealing the organic layer on the support substrate and the introduction portion via a photoreactive adhesive, and curing the adhesive by irradiating light. And a step of hermetically disposing a sealing member. 6. The organic EL according to claim 4, wherein the step of forming the introduction section includes the step of providing a slit having at least one opening. Panel manufacturing method.