JP2007171440A - Organic el panel and method for manufacturing same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL panel that can bond a sealing member with a base substrate together without lowering air-tightness even when a metal material having low resistivity is used for a wiring part which electrically connecting both electrodes to an external power source, and to provide a method of manufacturing the same. <P>SOLUTION: The organic EL panel 1 is constituted by forming a metal layer 10b of a metal material having lower resistivity than a transparent conductive material on a base part 10a made of the transparent conductive material, and has the wiring part 10 which electrically connects the electrodes 4 and 8 to the external power source. At least one or more first openings 10c are formed in a region facing an adhesive 9c of the metal layer 10b, a second opening 10d is formed opposite the first openings 10c of the base part 10a, and the adhesive 9c is bonded to the base substrate 2 through the first and the second openings 10c and 10d. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an organic EL (electroluminescence) panel, and more particularly, to an organic EL panel using a metal material having a low resistivity for a wiring portion that electrically connects an electrode and an external power source, and a method for manufacturing the same.

  An organic EL panel is an organic EL element in which an organic layer having at least a light emitting layer is formed between an anode made of a light-transmitting material such as ITO (Indium Tin Oxide) and a cathode made of aluminum (Al) or the like. Is provided on a translucent support substrate. Further, in such an organic EL panel, in order to prevent deterioration of the organic layer formed on the support substrate, for example, a sealing member made of a glass material is attached to the substrate through an adhesive made of, for example, an ultraviolet curable resin. It is common to arrange it airtight on top.

  Conventionally, with respect to such an organic EL panel, the translucent light used for the anode as the wiring portion in order to suppress the occurrence of a voltage drop phenomenon in the wiring portion that electrically connects an external power source and the electrodes. A method using a metal material having a lower resistivity than a conductive material is known. For example, in Patent Literature 1, an auxiliary electrode (metal layer) made of a metal material having a resistivity lower than that of the light transmissive material is formed on a wiring electrode (base portion) made of the light transmissive material having a high resistance. Is disclosed.

  In such a configuration, when the ultraviolet ray is irradiated to cure the adhesive, the metal layer blocks the ultraviolet ray in a region facing the sealing member and the wiring portion, and the adhesive is not sufficiently cured. There is a problem that the airtightness between the sealing member and the substrate is lowered.

In order to solve the above-mentioned problems, for example, a method of forming an introduction portion including at least one opening in a region facing the adhesive of the metal layer and guiding ultraviolet rays toward the adhesive is, for example, It is disclosed in Patent Document 2.
Japanese Patent Application Laid-Open No. 2000-21565 JP 2002-359085 A

  However, when the opening is formed in the metal layer, the adhesive is bonded to the metal layer and the base exposed by the opening in a region facing the sealing member and the wiring portion. However, there is a problem in that the adhesiveness between the adhesive and the base portion is low particularly in the vicinity of the interface between the base portion and the metal layer, and the hermeticity of sealing is lowered.

  The present invention has been made in view of the above-described problems, and reduces airtightness even when a metal material having a low resistivity is used as a wiring portion that electrically connects both electrodes and an external power source. It aims at providing the organic electroluminescent panel which can adhere | attach a sealing member and a support substrate, and its manufacturing method, without this.

  In order to solve the above problems, an organic EL panel according to the present invention includes an organic EL element in which an organic layer having at least a light emitting layer is sandwiched between a pair of electrodes on a translucent support substrate. An organic EL panel in which a sealing member is disposed on the support substrate via a photoreactive adhesive so as to airtightly cover the conductive material on a base portion made of a translucent conductive material A metal layer made of a metal material having a lower resistivity, and having a wiring portion for electrically connecting the electrodes and an external power source, and at least one in a region facing the adhesive of the metal layer. Forming at least one first opening, forming a second opening at a position of the base portion facing the first opening, and applying the adhesive to the first and second openings; It is characterized by being bonded to the support substrate through.

  Further, the width of the second opening is at least equal to or larger than the width of the first opening.

  Further, the total width of the second opening is not less than one third of the width of the wiring part.

  In addition, in order to solve the above-described problem, the organic EL panel manufacturing method of the present invention includes forming a first electrode made of a light-transmitting conductive material and first and second base portions on a light-transmitting support substrate. And forming first and second wiring portions by forming first and second metal layers made of a metal material having a lower resistivity than the conductive material on the first and second base portions. A step of forming at least one first opening in the first and second metal layers, and a portion of the first and second base portions facing the first opening. Forming a second opening on the first electrode, an organic layer having at least a light-emitting layer on the first electrode, and a second electrode electrically connected to the second wiring portion are sequentially stacked to form an organic EL element And sealing the organic EL element on the support substrate and the first and second wiring portions By disposing the stop member via a photoreactive adhesive, bringing the adhesive into contact with the support substrate through the first and second openings, and irradiating light from the support substrate side And curing the adhesive to dispose the sealing member in an airtight manner.

  Further, the second opening is formed so that the width of the second opening is at least equal to or larger than the width of the first opening.

  Further, the second opening is formed so that the total width of the second opening is not less than one third of the width of the wiring part.

  The present invention relates to an organic EL panel, and more particularly to an organic EL panel using a metal material having a low resistivity for a wiring portion that electrically connects an electrode and an external power source, and a method for manufacturing the same, without reducing hermeticity. It becomes possible to adhere | attach a sealing member and a board | substrate.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  1 and 2 are diagrams showing a dot matrix type organic EL panel 1. The organic EL panel 1 has an organic EL element 3 formed on a support substrate 2. As shown in FIGS. 1 and 2, the organic EL element 3 includes a plurality of anodes (first electrodes) 4 formed in a line, an insulating layer 5, a partition wall 6, an organic layer 7, and a line. A plurality of cathodes (second electrodes) 8 are mainly formed. A sealing member 9 that covers the organic EL element 3 in an airtight manner is disposed on the support substrate 2. Further, on the support substrate 2, a first wiring part 10 for electrically connecting the anode 4 to an external power source (not shown), and a second wiring part 11 for connecting the cathode 8 to the external power source, , Is formed. In addition, FIG. 1 is the figure which looked at the organic electroluminescent panel 1 from the sealing member 9 side, and has omitted the flat plate part 9a of the sealing member 9 which makes concave shape.

The support substrate 2 is made of a rectangular transparent glass material and is an electrically insulating substrate. A silicon dioxide (SiO ₂ ) layer (not shown) is formed on the surface of the support substrate 2 where the organic EL element 3 is formed.

  The organic EL element 3 includes a plurality of light emitting pixels in which the organic layer 7 is sandwiched between the anode 4 and the cathode 8 at a location where each anode 4 and each cathode 8 intersect.

  The anode 4 is made of a light-transmitting conductive material such as ITO. After the conductive material is formed in layers on the support substrate 2 by means such as a sputtering method, the anode 4 is lined so as to be substantially parallel to each other by a photolithography method or the like. A plurality are formed. The anode 4 is electrically connected to the external power source via the first wiring part 10.

  The insulating layer 5 is made of, for example, a polyimide-based electrically insulating material, is formed on the anode 4 so as to be positioned between the anode 4 and the cathode 8, and has an opening for exposing the anode 4. The insulating layer 5 prevents a short circuit between the electrodes 4 and 8 and makes the outline of the organic EL element 3 clear.

  The partition wall 6 is made of, for example, a phenol-based electrically insulating material and is formed on the insulating layer 5. The partition wall portion 6 is formed by means such as photolithography so that the cross section thereof has an overhang shape such as a reverse taper shape with respect to the insulating layer 5. In addition, a plurality of partition walls 6 are formed at equal intervals so as to be orthogonal to the anode 4 at a position facing the anode 4 and to have an arc shape in a region where the anode 4 is not formed. The partition wall 6 has a structure in which the organic layer 7 and the metal film are disconnected due to an overhang shape when a metal film to be the organic layer 7 and the cathode 8 is formed from above by a vapor deposition method, a sputtering method, or the like. It is.

  The organic layer 7 is formed on the anode 4 and may have at least a light emitting layer. In the embodiment of the present invention, the hole injection transport layer, the light emitting layer, the electron transport layer, and the electron injection are used. The layers are sequentially laminated by means such as vapor deposition, and emit white light, for example.

  The cathode 8 is formed of a metal conductive material having a higher conductivity than the anode 4 such as aluminum (Al) or magnesium silver (Mg: Ag) in a layer shape by means of vapor deposition or the like to form a metal film. 6, the metal film is stepped and formed into a plurality of lines. The cathode 8 intersects (intersects) with the anode 4 substantially at a position facing the anode 4 and is formed in an arc shape so as to be connected to the second wiring portion 11 at a position where the anode 4 is not formed. The

  The sealing member 9 is formed by forming a flat plate member made of, for example, a glass material into a concave shape by an appropriate method such as sandblasting, cutting, and etching, and the flat plate portion 9a and the flat plate portion 9a facing the organic EL element 3 are formed. And a support portion 9b extending so as to surround. The sealing member 9 is hermetically disposed on the support substrate 2 by bonding the support portion 9b to the support substrate 2 via an adhesive 9c made of, for example, an ultraviolet curable epoxy resin. The organic EL element 3 is sealed with the substrate 2. Further, the sealing member 9 is configured to be slightly smaller than the support substrate 2 so that the front end portions (terminal portions) of the first and second wiring portions 10 and 11 are exposed to the outside. A part (the lower side in FIG. 1) is arranged so as to overlap the first and second wiring parts 11, 12.

  The first wiring part 10 is drawn out from the anode 4 and is more resistant than the conductive material forming the first base part 10a such as chromium (Cr) on the first base part 10a made of the same material as the anode 4. It is formed by laminating the first metal layer 10b made of a metal material having a low rate. The first wiring unit 10 electrically connects the anode 4 and the external power source. Further, the region of the first metal layer 10b facing the support portion 9b and the adhesive 9c of the sealing member 9 has a plurality of second electrodes for guiding light (ultraviolet rays) irradiated from the direction of the support substrate 2 to the adhesive 9c. One opening 10c is formed. Further, in the region of the first base portion 10a facing the first opening portion 10c, as shown in FIG. 3A, the second opening has a width equal to or greater than that of the first opening portion 10c. The opening 10d is formed. Furthermore, the total width of the second opening 10 d is preferably at least one third of the width of the first wiring portion 10. By forming the second opening 10d in the first base portion 10a, as shown in FIG. 4 (a), the first wiring portion 10 and the supporting portion 9b of the sealing member 9 have a one-off portion. The portion (where the first and second openings 10c and 10d are formed) of the support substrate 2 is exposed, and the adhesive 9c can be directly bonded to the support substrate 2.

  The second wiring portion 11 includes a second metal layer 11b made of a metal material having a low resistivity such as chromium (Cr) on the second base portion 11a formed of the same material at the same time as the first base portion 10a. The cathode 8 and the external power source are electrically connected. Further, in the second metal layer 11b, the region facing the support portion 9b and the adhesive 9c of the sealing member 9 is irradiated with ultraviolet rays irradiated from the direction of the support substrate 2 as shown in FIG. 3B. A plurality of third openings (first openings) 11c are formed to guide the light. Further, in the region facing the third opening 11c in the second base portion 11a, a fourth opening (second opening) is formed so as to have a width equal to or larger than that of the third opening 11c. ) 11d is formed. Furthermore, the total width of the fourth opening 11 d is preferably at least one third of the width of the second wiring portion 11. By forming the fourth opening portion 11d in the second base portion 11a, as shown in FIG. 4 (b), the second wiring portion 11 and the supporting portion 9b of the sealing member 9 have a one-off portion. The part (where the third and fourth openings 11c and 11d are formed) is exposed, and the adhesive 9c can be directly adhered to the support substrate 2.

  The organic EL panel 1 is formed by the above portions. The organic EL panel 1 is provided with pixels in the form of a matrix where the anode 4 and the cathode 8 intersect, and each pixel is selectively applied with a constant current by the external power source. It selectively emits light and displays various characters and figures.

  Next, a method for manufacturing the organic EL panel 1 will be described.

  First, a light-transmitting conductive layer 12 made of ITO or the like is formed on the support substrate 2 by means such as sputtering, and further a layered metal layer 13 is formed on the conductive layer 12 by means such as sputtering (see FIG. 5 (a)).

  Next, the metal layer 13 is patterned into a predetermined shape by photolithography or the like to form the first metal layer 10b (FIG. 5B). At this time, first and third openings 10c and 11c are formed in the first and second metal layers 10b and 11b, respectively. Although not shown in FIG. 5B, the second metal layer 11b is formed similarly to the first metal layer 10b, and the third opening 11c is formed in the second metal layer 11b. The

  Next, the conductive layer 12 is patterned into a plurality of lines by a photolithography method or the like. The conductive layer 12 is divided and formed on the anode 4 and the first base portion 10a (FIG. 5C). At this time, a second opening 10d is formed in the first base portion 10a at a position facing the first opening 10c. Although not shown in FIG. 5C, a second base portion 11a is formed in the same manner as the first base portion 10a, and the second base portion 11a is connected to the second opening portion 11c. A fourth opening 11d is formed at the opposite location. Therefore, the first wiring part 10 formed by laminating the first base part 10a and the first metal layer 10b is obtained, and the second base part 11a and the second metal layer 11b are laminated. Thus, the second wiring portion 11 is obtained.

  Next, the insulating layer 5 and the partition 6 are formed between the anodes 4 and partially on the anode by a photolithography method or the like. Further, the organic layer 7 and the cathode 8 are sequentially laminated by a vapor deposition method or the like to obtain an organic EL element 3 having a predetermined light emission shape (FIG. 5D). At this time, the cathode 8 is stepped by the partition walls 6 and formed into a plurality of lines. The cathode 6 is connected to the second wiring part 11.

  Next, the concave sealing member 9 is disposed on the support substrate 2, the first wiring part 10, and the second wiring part 11 via the ultraviolet curable adhesive 9 c so as to surround the organic EL element 3. (FIG. 5E). At this time, a predetermined pressure is applied to the sealing member 9, and the support substrate that exposes the adhesive 9c at the location where the first opening 10c and the second opening 10d of the first wiring portion 10 are formed. Contact 2 directly. Although not shown in FIG. 5 (e), the adhesive 9c is exposed in the same manner also at the portion where the third opening portion 11c and the fourth opening portion 11d of the second wiring portion 11 are formed. The substrate is brought into direct contact with the support substrate 2. Further, the adhesive 9c is cured by irradiating ultraviolet rays from the support substrate 2 side, and the support substrate 2 and the sealing member 9 are hermetically bonded to obtain the organic EL panel 1. It should be noted that the ultraviolet rays pass through the first and second openings 10c and 10d and the third and fourth openings 11c and 11d at the locations where the adhesive 9c faces the first and second wiring parts 10 and 11. The entire adhesive 9c is irradiated and the adhesive 9c can be cured well.

  The organic EL panel 1 and the method for manufacturing the organic EL panel 1 are first and second metal parts made of a metal material having low resistivity as the first and second wiring portions 10 and 11 that electrically connect the electrodes 4 and 8 and the external power source. The second metal layers 10b and 11b are used, and the first and second metal layers 10b and 11b have at least one first and second first and second metal layers 10b and 11b for introducing ultraviolet rays into regions facing the adhesive 9c. Three openings 10c, 11c are formed, and second and fourth openings 10d, 10d, 11c are formed at locations facing the first and third openings 10c, 11c of the first and second bases 10a, 11a. 10d is formed, and the adhesive 9c is bonded to the support substrate 2 through the first and second openings 10c and 10d and the third and fourth openings 11c and 11d. Between the second base portions 10a and 11a and the adhesive 9c. Touch area can improve the adhesion by reducing, it is possible to adhere the sealing member 9 without lowering the airtightness and the supporting substrate 2.

  Further, by making the widths of the second and fourth openings 10d and 11d at least equal to the width of the first and third openings 10c and 11c, the second and fourth openings 10d and 11d are formed. In this case, the first and second base portions 10a and 11a are not partially exposed in parallel with the support substrate 2 to form a step, and the adhesiveness can be improved.

  Although the first to fourth openings 10c, 10d, 11c, and 11d have a rectangular shape, the shape of the opening of the present invention is arbitrary, and may be a shape such as a circle or an ellipse. It may be. Further, as shown in FIG. 6, the first to fourth openings 10c, 10d, 11c, and 11d may have a tapered cross section or a curved shape.

The external view which shows the organic electroluminescent panel which is embodiment of this invention. Sectional drawing which shows the organic electroluminescent panel of embodiment same as the above. The perspective view which shows the wiring part of embodiment same as the above. Sectional drawing which shows the principal part which shows the organic electroluminescent panel of embodiment same as the above. The figure which shows the manufacturing process of the organic electroluminescent panel of embodiment same as the above. The figure which shows another example of embodiment same as the above.

Explanation of symbols

1 Organic EL Panel 2 Support Substrate 3 Organic EL Element 4 Anode (First Electrode)
5 Insulating layer 6 Partition 7 Organic layer 8 Cathode (second electrode)
DESCRIPTION OF SYMBOLS 9 Sealing member 9a Flat plate part 9b Support part 9c Adhesive 10 1st wiring part 10a 1st base part 10b 1st metal layer 10c 1st opening part 10d 2nd opening part 11 2nd wiring part 11a Second base portion 11b Second metal layer 11c Third opening (first opening)
11d Fourth opening (second opening)
12 Conductive layer 13 Metal layer

Claims (6)

An organic EL element in which an organic layer having at least a light emitting layer is sandwiched between a pair of electrodes is disposed on a translucent support substrate, and a photoreactive adhesive is used to hermetically cover the organic EL element. An organic EL panel in which a sealing member is disposed on the support substrate,
A wiring portion for forming a metal layer made of a metal material having a resistivity lower than that of the conductive material on a base portion made of a light-transmitting conductive material and electrically connecting the electrodes and an external power source; ,
Forming at least one first opening in a region of the metal layer facing the adhesive, and forming a second opening in a portion of the base portion facing the first opening; The organic EL panel, wherein the adhesive is bonded to the support substrate through the first and second openings. 2. The organic EL panel according to claim 1, wherein the width of the second opening is at least equal to or larger than the width of the first opening. 2. The organic EL panel according to claim 1, wherein the total width of the second openings is one third or more of the width of the wiring portion. A step of forming a first electrode made of a light-transmitting conductive material and a first and second base portion on a light-transmitting supporting substrate; and the conductive material on the first and second base portions. Forming a first and a second wiring portion by forming first and second metal layers made of a metal material having a low resistivity, and at least one first or second metal layer on the first and second metal layers; A step of forming one opening, a step of forming a second opening at a location facing the first opening of the first and second base portions, and at least light emission on the first electrode A step of sequentially laminating an organic layer having a layer and a second electrode electrically connected to the second wiring part to form an organic EL element; and on the support substrate and the first and second wiring parts A sealing member for sealing the organic EL element is disposed via a photoreactive adhesive, and the adhesive is the first and second adhesives. A step of contacting the support substrate through the opening, and a step of hermetically arranging the sealing member by curing the adhesive by irradiating light from the support substrate side. A method for producing an organic EL panel. 5. The method of manufacturing an organic EL panel according to claim 4, wherein the second opening is formed so that the width of the second opening is at least equal to or larger than the width of the first opening. 5. The organic EL panel according to claim 4, wherein the second opening is formed so that the total width of the second opening is equal to or more than one third of the width of the wiring portion. Production method.

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