JP2010170773A - Organic el panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL panel of a COG (chip on glass) form that can easily improve the reliability of a display device without increasing the number of components and variation of an external circuit. <P>SOLUTION: The organic EL panel is formed with a light emitting display part 2 having a plurality of first electrodes 5 formed in line shape on a support substrate 1, a functional layer 8 formed on the first electrodes 5 and having at least an organic light emitting layer, and a plurality of second electrodes 9 formed in line shape to intersect the first electrodes 5. The organic EL panel includes a driver IC 3 disposed on the support substrate 1 so as to be electrically connected to the first and second electrodes 5, 9; a connection wiring part 4 formed on the support substrate 1 so as to be connected to the driver IC 3 to connect the driver IC 3 to the external circuit; and resistive element equivalent parts 4a-4c formed at the connection wiring part 4 and higher in resistance value than the other part of the connection wiring part 4. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention provides a first electrode formed in a plurality of lines on a support substrate, a functional layer formed on the first electrode and having at least an organic light emitting layer, and in a line so as to intersect the first electrode. The present invention relates to an organic EL panel formed with a light emitting display section having a plurality of second electrodes formed.

  Conventionally, as an organic EL panel, for example, a functional layer having at least an organic light emitting layer includes an anode (first electrode) made of ITO (indium tin oxide) or the like, and a cathode (second electrode) made of aluminum (Al) or the like. It is known that a plurality of organic EL elements sandwiched between 2 and 2 are formed as light-emitting pixels on a translucent support substrate to constitute a light-emitting display portion (for example, see Patent Document 1). Such an organic EL element emits light by injecting holes from the anode and injecting electrons from the cathode and recombining the holes and electrons in the light emitting layer. The organic EL element has a so-called diode characteristic in which current does not easily flow from the cathode side to the anode side.

  Further, as a method of mounting a driver IC for driving the organic EL element, a COG (Chip on Glass) form in which the driver IC is directly mounted on a support substrate is known (for example, see Patent Document 2). The COG-type organic EL panel is excellent in that the display device can be downsized.

JP-A-8-315981 JP 2000-40585 A

  Here, since the organic EL element is a charge storage light emitting element, a large current is generated when switching ON / OFF of light emission. For this reason, an excessive load may be applied to the driver IC, which may impair the reliability of the display device. On the other hand, conventionally, a limiting resistor for protecting the driver IC is separately provided in an external circuit connected to the driver IC by a connecting member such as an FPC (Flexible Printed Circuit). However, the method of providing the limiting resistor in the external circuit increases the number of components or the variation of the external circuit because the resistance value of the limiting resistor needs to be changed depending on the size of the organic EL panel. There was a problem that it would cause an increase in manufacturing costs.

  Therefore, in view of the above-described problems, the present invention provides an organic EL panel that can easily improve the reliability of a display device without increasing the number of parts and variations of an external circuit in a COG-type organic EL panel. It is intended to provide.

  In order to solve the above problems, the present invention provides a first electrode formed in a line on a support substrate, a functional layer formed on the first electrode and having at least an organic light emitting layer, the first electrode, An organic EL panel comprising a light-emitting display unit having a plurality of second electrodes formed in a line so as to intersect with each other, wherein the support is provided so as to be electrically connected to the first and second electrodes. A driver IC disposed on a substrate; a connection wiring portion formed on the support substrate to be connected to the driver IC; and connecting the driver IC and an external circuit; and And a portion corresponding to a resistance element having a resistance value higher than that of other portions of the connection wiring portion.

  Further, the resistance element equivalent portion is formed in a shape different from other portions of the connection wiring portion, and has a resistance value increased by adjusting an aspect ratio.

  Further, the connection wiring portion is formed of a laminate of a base layer and an auxiliary layer having a resistance value lower than that of the base layer, and the resistance element equivalent portion has a resistance value increased by removing the auxiliary layer. It is characterized by that.

  In addition, the connection wiring portion is formed at least partially at the same time as the first electrode.

  Further, the resistance element equivalent portion is formed by disposing a member having a higher resistance value than other portions of the connection wiring portion.

  As described above, according to the present invention, in a COG-type organic EL panel, it is possible to easily improve the reliability of a display device without increasing the number of parts and variations of an external circuit.

The figure which shows the organic electroluminescent panel which is embodiment of this invention. The principal part enlarged view of an organic electroluminescent panel same as the above. Sectional drawing which shows the organic EL element which shows an organic EL panel same as the above. The principal part enlarged view which shows the connection wiring part of an organic electroluminescent panel same as the above.

  Hereinafter, an organic EL panel according to an embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 1 is an overall view of an organic EL panel, and FIG. 2 is an enlarged view of a main part of the organic EL panel.

  The support substrate 1 is an electrically insulating substrate made of a rectangular transparent glass material. On the support substrate 1, a light emitting display portion 2, a driver IC 3 connected to the light emitting display portion 2, and a connection wiring portion 4 connected to the driver IC 3 are formed. Further, a sealing member that covers the light emitting display portion 2 in an airtight manner is disposed on the support substrate 1, but the sealing member is omitted in FIGS. 1 and 2.

  As shown in FIGS. 2 and 3, the light-emitting display unit 2 includes a plurality of anodes (first electrodes) 5 formed in a line, an insulating layer 6, a partition wall 7, a functional layer 8, and a plurality of lines. A plurality of light-emitting pixels (organic EL elements) each of which is mainly composed of a cathode (second electrode) 9 to be formed, and each anode 5 and each cathode 9 intersect each other to sandwich the functional layer 8. This is a so-called passive matrix light-emitting display portion. Each cathode 9 is connected to the drive wiring portion 10. Moreover, the light emission display part 2 is airtightly covered with the sealing member 11, as shown in FIG.

  The driver IC 3 constitutes a drive circuit that drives the light emitting display unit 2 to emit light, and includes a signal line drive circuit, a scanning line drive circuit, and the like. The driver IC 3 is disposed on the support substrate 1 according to the light emitting display unit 2 by the COG technique, and is electrically connected to each anode 5 and each cathode 9.

  The connection wiring portion 4 is formed so as to be connected to connect the driver IC 3 and an external circuit. For example, a base layer made of ITO, which is the same material as the anode 5, and chromium (Cr) or It consists of a laminated body with an auxiliary layer made of a conductive material having a lower resistance value than the base layer such as aluminum (Al). By making the base layer the same material as the anode 5, the base layer can be formed simultaneously with the anode 5. The connection wiring part 4 has one end (upper side in FIG. 1) connected to the driver IC 3 and the other end (lower side in FIG. 1) connected to the external circuit and an anisotropic conductive film such as an FPC. Connected via (ACF). Further, as shown in the enlarged view of the main part of FIG. 4, the connection wiring part 4 has resistance element equivalent parts 4a to 4c having a resistance value higher than other parts between the driver IC 3 and the connection part of the connection member. Is formed. The resistance element equivalent portion 4a is provided in a wiring to which a high load is applied such as a power supply line for supplying a constant current and a scanning line signal line for switching selection / non-selection of the cathode 9 as a scanning line. The driver IC 3 is protected by limiting the load. The resistance element equivalent portion 4a is formed by increasing the resistance value by adjusting the aspect ratio by extending the length by partially meandering the wiring. The resistance element equivalent portion 4b is formed by increasing the resistance value by adjusting the aspect ratio by partially reducing the width of the wiring. The resistance element equivalent portion 4c has a resistance value increased by partially removing the auxiliary layer from the wiring. The resistance values of the resistance element equivalent portions 4a to 4c are determined by the structure and driving method of the driver IC 3, but in this embodiment, the resistance value is 5 to 5000Ω in consideration of the forming method, material, and resistance accuracy. Scope. In addition, as the resistance element equivalent part of the present invention, a part of the wiring of the connection wiring part 4 is disconnected, and a carbon paste layer or a chip resistor is disposed as a dedicated member for increasing the resistance value in the disconnected part. Also good.

  The anode 5 is made of a light-transmitting conductive material such as ITO. A plurality of anodes 5 are formed in a line shape so as to be substantially parallel to each other by a photolithographic etching method or the like after the conductive material is formed in layers on the support substrate 1 by means such as vapor deposition or sputtering. At this time, the base layer of the connection wiring portion 4 is also formed in the same process. The anode 5 is connected to the driver IC 3 on one side of the end (the lower side in FIG. 1).

  The insulating layer 6 is made of, for example, a polyimide-based electrically insulating material, and is formed on the anode 5 so as to be positioned between the anode 5 and the cathode 9, and prevents a short circuit between the electrodes 5 and 9. . The insulating layer 6 is formed with an opening 6a for defining each light emitting pixel and for clarifying the outline. The insulating layer 6 also extends between the drive wiring portion 10 and the cathode 9 and has a contact hole 6 b that connects the drive wiring portion 10 and the cathode 9.

  The partition wall 7 is made of, for example, a phenol-based electrically insulating material and is formed on the insulating layer 6. The partition wall 7 is formed by means such as photolithography so that the cross section thereof has a reverse taper shape with respect to the insulating layer 6. A plurality of partition walls 7 are formed at equal intervals in a direction orthogonal to the anode 5. The partition wall 7 has a structure in which the functional layer 8 and the metal film are divided into lines when a metal film to be the functional layer 8 and the cathode 9 is formed from above by a vapor deposition method, a sputtering method, or the like.

  The functional layer 8 is formed on the anode 5 and has at least an organic light emitting layer. In the present embodiment, the functional layer 8 is formed by sequentially laminating a hole injection layer, a hole transport layer, an organic light emitting layer, and an electron transport layer by means of vapor deposition or sputtering.

  The cathode 9 is formed in a line so that a metallic conductive material having a higher conductivity than the anode 5 such as aluminum (Al) or magnesium silver (Mg: Ag) intersects the anode 5 by means such as sputtering or vapor deposition. A plurality are formed. The cathode 9 is divided into a structure in which a metal film formed of the conductive material is laminated on the functional layer 8 by the partition walls 7 and a structure in which the metal film is laminated on the partition walls 7. Further, the cathode 9 is connected to the drive wiring part 10 through a contact hole 6 b provided in the insulating layer 6, and is electrically connected to the driver IC 3 through the drive wiring part 10.

  The drive wiring portion 10 is made of, for example, a conductive material such as ITO, chromium (Cr) or aluminum (Al), which is the same material as the anode 5, or a laminate of these conductive materials, and connects the driver IC 3 and the cathode 9. is there. Further, the drive wiring portion 10 is formed so that at least an end portion to be connected to the cathode 9 is located below the cathode 9 via the insulating layer 6 so as to be connectable to the cathode 9 via the contact hole 6b. Has been.

  The sealing member 11 is a flat plate member made of, for example, a glass material, and includes a concave portion 11a that houses the light emitting display portion 2, and a joint portion 11b that is formed so as to surround the entire circumference of the concave portion 11a. It arrange | positions on the support substrate 1 through the agent 11c.

  The organic EL panel is configured by the above-described units.

  Such an organic EL panel is provided on the connection wiring part 4 formed on the support substrate 1 and connecting the driver IC 3 and the external circuit by providing resistance element equivalent parts 4a to 4c having higher resistance values than other parts. Since it is not necessary to provide a resistor in the external circuit, the number of components can be reduced, and the resistance value can be changed as appropriate on the organic EL panel side, so the variation of the external circuit is increased according to the panel size. There is no need to reduce the manufacturing cost, and the reliability of the display device using the organic EL panel can be improved more easily.

  The present invention is suitable for a COG type organic EL panel.

DESCRIPTION OF SYMBOLS 1 Support substrate 2 Light emission display part 3 Driver IC
4 connection wiring part 4a-4c resistance element equivalent part 5 anode (first electrode)
6 Insulating layer 6a Opening 6b Contact hole 7 Partition 8 Functional layer 9 Cathode (second electrode)
10 Drive wiring part 11 Sealing member

Claims (5)

A plurality of first electrodes formed in a line on the support substrate, a functional layer formed on the first electrode and having at least an organic light emitting layer, and a plurality of lines formed so as to intersect the first electrode An organic EL panel formed with a light emitting display unit having a second electrode,
A driver IC disposed on the support substrate so as to be electrically connected to the first and second electrodes;
A connection wiring portion formed on the support substrate so as to be connected to the driver IC, and for connecting the driver IC and an external circuit;
An organic EL panel comprising: a resistance element equivalent portion formed in the connection wiring portion and having a higher resistance value than other portions of the connection wiring portion. 2. The organic EL panel according to claim 1, wherein the resistance element equivalent portion is formed in a shape different from other portions of the connection wiring portion, and has an increased resistance value by adjusting an aspect ratio. The connection wiring part is composed of a laminate of a base layer and an auxiliary layer having a resistance value lower than that of the base layer, and the resistance element equivalent part is formed by increasing the resistance value by removing the auxiliary layer. The organic EL panel according to claim 1. The organic EL panel according to claim 1, wherein at least a part of the connection wiring portion is formed simultaneously with the first electrode. 2. The organic EL panel according to claim 1, wherein the resistance element equivalent portion includes a member having a higher resistance value than other portions of the connection wiring portion.

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