CN203038981U - Encapsulation structure of large-size OLED device - Google Patents
Encapsulation structure of large-size OLED device Download PDFInfo
- Publication number
- CN203038981U CN203038981U CN 201220659866 CN201220659866U CN203038981U CN 203038981 U CN203038981 U CN 203038981U CN 201220659866 CN201220659866 CN 201220659866 CN 201220659866 U CN201220659866 U CN 201220659866U CN 203038981 U CN203038981 U CN 203038981U
- Authority
- CN
- China
- Prior art keywords
- oled device
- encapsulation
- package cavity
- large scale
- glass substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model provides an encapsulation structure of a large-size OLED device. The encapsulation structure includes oppositely-arranged glass substrates and a closed loop-shaped adhesive layer arranged between the glass substrates; the adhesive layer and the inner surfaces of the glass substrates form an encapsulation cavity; and a light-emitting element and an encapsulation cavity supporting structure layer are arranged in the encapsulation cavity. According to the encapsulation structure of the large-size OLED device of the utility model, the encapsulation cavity supporting structure layer is arranged in the encapsulation cavity; and the encapsulation structure can not only assist in improving waterproof performance and anti-oxygen performance, and significantly improving sealing effect, but also can assist in solving the problem of the recessing of the substrates of the large-size device, and ensuring the service life and product performance of the OLED device, and is suitable for the encapsulation of large-size OLED devices in the future.
Description
Technical field
The utility model relates to a kind of encapsulating structure of large scale OLED device.
Background technology
The OLED device is a kind of organic luminescent device, its principle is by organic material is applied voltage, make electric energy be converted into luminous energy, have advantages such as high-luminous-efficiency, low driving voltage, but the increase along with service time, aqueous vapor in the environment and oxygen infiltrate in the device easily, influence the device luminescent properties.
At present, the encapsulation of small size OLED device is mainly based on glass powder with low melting point, yet, along with the OLED technical development, the OLED device certainly will constantly be done greatly, needs air-isolation during owing to the encapsulation of OLED device, may influence little during small size, but during large scale, because depressed phenomenon can appear in inner and outer air pressure difference panel, influence the device display effect.
The utility model content
The purpose of this utility model is to provide a kind of encapsulating structure of large scale OLED device, and this encapsulating structure can better stop aqueous vapor, oxygen, has strengthened the packaging effect of encapsulating structure significantly, has solved the substrate depression problem of large-size device simultaneously.
For achieving the above object, the utility model has adopted following technical scheme.
Comprise the glass substrate that is oppositely arranged and be arranged at the tack coat that is closed ring between glass substrate, the inner surface of described tack coat and glass substrate forms package cavity, is provided with light-emitting component and package cavity support structure layers in the package cavity.
Described tack coat is through laser sintered glass powder with low melting point.
Described light-emitting component is organic light emitting diode or PLED.
Described light-emitting component comprises an anode conductive layer, a luminous organic material layer and a cathodic metal layer at least.
Described package cavity support structure layers is the transparent UV resin through overcuring.
Described light-emitting component is arranged on the interior side glass substrate of package cavity, and the package cavity support structure layers is filled in the remainder of package cavity.
The encapsulating structure of large scale OLED device described in the utility model arranges the package cavity support structure layers in package cavity, this encapsulating structure has not only improved the waterproof of device, anti-oxygen performance, significantly improved sealing effectiveness, and solved the problem of large-size device substrate depression, guarantee life-span and the properties of product of OLED device, be fit to the encapsulation of following large scale OLED device.
Description of drawings
Fig. 1 is structural representation of the present utility model;
Among the figure: glass substrate 1, tack coat 2, package cavity support structure layers 3, light-emitting component 4.
Embodiment
The utility model is described in further detail below in conjunction with drawings and Examples.
Referring to Fig. 1, the utility model comprises the glass substrate 1 that is oppositely arranged and the tack coat that is closed ring 2 that is arranged at 1 of glass substrate, the inner surface of described tack coat 2 and glass substrate 1 forms package cavity, described tack coat 2 is through laser sintered glass powder with low melting point, be provided with light-emitting component 4 and package cavity support structure layers 3 in the package cavity, described light-emitting component 4 is arranged on the interior side glass substrate 1 of package cavity, package cavity support structure layers 3 is filled in the remainder of package cavity, described light-emitting component 4 is organic light emitting diode or PLED, described light-emitting component 4 comprises an anode conductive layer at least, one luminous organic material layer and a cathodic metal layer, described package cavity support structure layers 3 are the transparent UV resin through overcuring.
Embodiment 1
A kind of OLED device encapsulation structure can improve the sealing effectiveness of OLED device.This OLED device encapsulation structure comprises a glass substrate, and its surface comprises light-emitting component, and light-emitting component is made of an anode conductive layer, a luminous organic material layer and a cathodic metal layer.Another glass substrate is encapsulation cover plate, be provided with UV resin bed and glass powder with low melting point at the encapsulation cover plate inner surface, described substrate forms the cavity volume that holds the OLED device by glass powder with low melting point and UV resin bed and encapsulation cover plate bonding between glass powder with low melting point, UV resin bed inner surface and the substrate.This encapsulating structure is when manufacturing, and elder generation applies a circle glass powder with low melting point in cap edges of boards portion, and modes such as the inner surface of glass powder with low melting point employing silk screen printing apply one deck UV resin bed; Placement surface comprises the glass substrate of light-emitting component on the UV resin bed then, and light-emitting component is between UV resin bed and the glass substrate; Substrate and encapsulation cover plate are adhered to by glass powder with low melting point, UV resin bed; By UV light irradiation, make the sclerosis of UV resin bed at last, by laser to glass powder with low melting point from new crystallization, thereby finish encapsulation to the OLED device, this encapsulating structure can improve sealing effectiveness greatly, thereby can guarantee life-span and the properties of product of OLED device.
Embodiment 2
A kind of OLED device encapsulation structure comprises a glass substrate, and its surface comprises light-emitting component, and light-emitting component is made of an anode conductive layer, a luminous organic material layer and a cathodic metal layer.Another glass substrate, glass powder with low melting point is coated on this glass substrate periphery by silk screen printing or some glue mode, constitutes a closed ring, and closed ring is mainly used to provide the adherence of encapsulation; The UV resin is coated in the closed ring of glass powder with low melting point formation by silk screen printing or some glue mode, be mainly used to provide adherence and the base plate supports of encapsulation, utilize the UV solidification equipment to make the sclerosis of UV resin bed, utilize high power laser light to pass through real estate, glass powder with low melting point is carried out sintering, between glass substrate, form a confined space, improve water proof, the oxygen barrier performance of device, solved the problem of substrate generation depression.
Above content just further describes the utility model in conjunction with concrete scheme; can not assert that embodiment of the present utility model only limits to this; or else break away under the prerequisite of the utility model design; can also do some deductions and conversion, all should be considered as belonging to the definite patent protection category of claims that the utility model proposes.
Claims (6)
1. the encapsulating structure of a large scale OLED device, it is characterized in that: comprise the glass substrate (1) that is oppositely arranged and be arranged at the tack coat that is closed ring (2) between glass substrate (1), the inner surface of described tack coat (2) and glass substrate (1) forms package cavity, is provided with light-emitting component (4) and package cavity support structure layers (3) in the package cavity.
2. according to the encapsulating structure of the described a kind of large scale OLED device of claim 1, it is characterized in that: described tack coat (2) is through laser sintered glass powder with low melting point.
3. according to the encapsulating structure of the described a kind of large scale OLED device of claim 1, it is characterized in that: described light-emitting component (4) is organic light emitting diode or PLED.
4. according to the encapsulating structure of the described a kind of large scale OLED device of claim 3, it is characterized in that: described light-emitting component (4) comprises an anode conductive layer, a luminous organic material layer and a cathodic metal layer at least.
5. according to the encapsulating structure of the described a kind of large scale OLED device of claim 1, it is characterized in that: described package cavity support structure layers (3) is the transparent UV resin through overcuring.
6. according to the encapsulating structure of the described a kind of large scale OLED device of claim 1, it is characterized in that: described light-emitting component (4) is arranged on the interior side glass substrate (1) of package cavity, and package cavity support structure layers (3) is filled in the remainder of package cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220659866 CN203038981U (en) | 2012-12-04 | 2012-12-04 | Encapsulation structure of large-size OLED device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220659866 CN203038981U (en) | 2012-12-04 | 2012-12-04 | Encapsulation structure of large-size OLED device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203038981U true CN203038981U (en) | 2013-07-03 |
Family
ID=48691073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220659866 Expired - Fee Related CN203038981U (en) | 2012-12-04 | 2012-12-04 | Encapsulation structure of large-size OLED device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203038981U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112310175A (en) * | 2020-09-30 | 2021-02-02 | 上海怡美装饰工程设计有限公司 | Outdoor advertisement display structure based on flexible OLED technology |
-
2012
- 2012-12-04 CN CN 201220659866 patent/CN203038981U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112310175A (en) * | 2020-09-30 | 2021-02-02 | 上海怡美装饰工程设计有限公司 | Outdoor advertisement display structure based on flexible OLED technology |
| CN112310175B (en) * | 2020-09-30 | 2022-10-25 | 上海怡美装饰工程设计有限公司 | Outdoor advertisement display structure based on flexible OLED technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104505466B (en) | OLED encapsulating structure and method for packing thereof | |
| WO2016086535A1 (en) | Oled packaging structure and packaging method therefor | |
| CN105591036A (en) | Packaging structure of flexible electroluminescent device and packaging method thereof | |
| CN104538420A (en) | Flexible oled display device and manufacturing method thereof | |
| US10333105B2 (en) | Organic light emitting display packaging structure and manufacturing method thereof | |
| WO2014201759A1 (en) | Packaging cover plate for organic electroluminescent device, organic electroluminescent device and display | |
| CN102903735B (en) | Organic electroluminescence optical diode display and polaroid method for sticking and covering thereof | |
| CN103219474B (en) | A kind of substrate packaging method | |
| CN203631556U (en) | Organic light-emitting touch display panel and organic light-emitting touch display device | |
| CN104600204A (en) | OLED package structure and OLED packaging method | |
| JP2021516413A (en) | Encapsulation structure, display device and display device | |
| TW201349483A (en) | Flexible package substrate, fabricating method thereof, and OLED packaging method using the same | |
| CN105552248A (en) | Package structure for electroluminescent device and package method for electroluminescent device | |
| WO2013051358A1 (en) | Organic electroluminescence element, planar light-emitting body, and method for manufacturing organic electroluminescence element | |
| CN102361064A (en) | Method for packaging organic light-emitting diode (OLED) substrate | |
| CN203300706U (en) | Packaging cover plate of organic electroluminescent device, organic electroluminescent device and display | |
| CN102709480A (en) | Organic electrogenerated luminescent device and display | |
| CN201243391Y (en) | Organic electroluminescent display | |
| CN104916789A (en) | OLED encapsulation method and OLED device | |
| CN202394976U (en) | Organic light-emitting display device with touch control function | |
| CN203038981U (en) | Encapsulation structure of large-size OLED device | |
| CN201820801U (en) | Encapsulating structure for OLED (Organic Light Emitting Diode) device | |
| CN105228283B (en) | One kind is repeatable to utilize flexible inorganic electroluminescent device | |
| CN105247698B (en) | Organic luminescent device and preparation method thereof | |
| CN201749877U (en) | Packaging cover board with organic lighting element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130703 Termination date: 20151204 |
|
| EXPY | Termination of patent right or utility model |